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Review of applications and developments of ultra-thin micro heat pipes for electronic cooling
descriptionPublicationkeyboard_double_arrow_right Article , Journal 2018Publisher:Elsevier BV
Authors: Heng Tang; Yong Tang; Zhenping Wan; Jie Li; +4 Authors
Heng Tang; Yong Tang; Zhenping Wan; Jie Li; Wei Yuan; Longsheng Lu; Yong Li; Kairui Tang;
doi: 10.1016/j.apenergy.2018.04.072
doi: 10.1016/j.apenergy.2018.04.072
Abstract The development of miniaturization and high-density packaging of electronic components demands heat dissipation components that are compact and exhibit high performance. An ultra-thin micro heat pipe (UTHP), as a novel heat pipe with a flat shape that is highly suitable for application with high power and limited heat dissipation space, has been extensively investigated and widely used in mobile electronics. Understanding the influence of the manufacturing processes, capillary wick structures and flattened thickness on the thermal performance of UTHPs has been the aim of numerous studies. This paper presents a comprehensive review of the recent developments and applications of UTHPs for thermal management of electronics. The different types and applications of UTHPs are introduced, and the packaging technologies of UTHPs are summarized and compared. Furthermore, the fabrication methodology and heat transfer characteristics of various wick structures used for UTHPs are reviewed and analysed in detail. Finally, the challenges affecting the development and application of UTHPs are outlined, and recommendations for future research are presented.
Applied Energyarrow_drop_down
Applied Energy
Article . 2018 . Peer-reviewed
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Applied Energyarrow_drop_down
Applied Energy
Article . 2018 . Peer-reviewed
License: Elsevier TDM
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Applied Energy
Journal
Data sources: Microsoft Academic Graph
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Review of applications and developments of ultra-thin micro heat pipes for electronic cooling
descriptionPublicationkeyboard_double_arrow_right Article , Journal 2018Publisher:Elsevier BV
Authors: Heng Tang; Yong Tang; Zhenping Wan; Jie Li; +4 Authors
Heng Tang; Yong Tang; Zhenping Wan; Jie Li; Wei Yuan; Longsheng Lu; Yong Li; Kairui Tang;
doi: 10.1016/j.apenergy.2018.04.072
doi: 10.1016/j.apenergy.2018.04.072
Abstract The development of miniaturization and high-density packaging of electronic components demands heat dissipation components that are compact and exhibit high performance. An ultra-thin micro heat pipe (UTHP), as a novel heat pipe with a flat shape that is highly suitable for application with high power and limited heat dissipation space, has been extensively investigated and widely used in mobile electronics. Understanding the influence of the manufacturing processes, capillary wick structures and flattened thickness on the thermal performance of UTHPs has been the aim of numerous studies. This paper presents a comprehensive review of the recent developments and applications of UTHPs for thermal management of electronics. The different types and applications of UTHPs are introduced, and the packaging technologies of UTHPs are summarized and compared. Furthermore, the fabrication methodology and heat transfer characteristics of various wick structures used for UTHPs are reviewed and analysed in detail. Finally, the challenges affecting the development and application of UTHPs are outlined, and recommendations for future research are presented.
Applied Energyarrow_drop_down
Applied Energy
Article . 2018 . Peer-reviewed
License: Elsevier TDM
Data sources: Crossref
Applied Energy
Journal
Data sources: Microsoft Academic Graph
linkLink to
shareshareShare
citeCite
addClaim
Please grant OpenAIRE to access and update your ORCID works.
This Research product is the result of merged Research products in OpenAIRE.

You have already added works in your ORCID record related to the merged Research product.
This Research product is the result of merged Research products in OpenAIRE.

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420
citations 420
popularity Top 0.1%
influence Top 1%
impulse Top 0.1%
Powered by BIP!
more_vert
Applied Energyarrow_drop_down
Applied Energy
Article . 2018 . Peer-reviewed
License: Elsevier TDM
Data sources: Crossref
Applied Energy
Journal
Data sources: Microsoft Academic Graph
linkLink to
shareshareShare
citeCite
addClaim
Please grant OpenAIRE to access and update your ORCID works.
This Research product is the result of merged Research products in OpenAIRE.

You have already added works in your ORCID record related to the merged Research product.
This Research product is the result of merged Research products in OpenAIRE.

You have already added works in your ORCID record related to the merged Research product.
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Review of applications and developments of ultra-thin micro heat pipes for electronic cooling

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