
SANLAB SIMULASYON AR. GE. SAN. TIC. A.S.
SANLAB SIMULASYON AR. GE. SAN. TIC. A.S.
2 Projects, page 1 of 1
Open Access Mandate for Publications and Research data assignment_turned_in Project2023 - 2025Partners:BARKHAUSEN INSTITUT GGMBH, AVL TURKIYE, NOVA LTD, KLA, ARBONAUT +117 partnersBARKHAUSEN INSTITUT GGMBH,AVL TURKIYE,NOVA LTD,KLA,ARBONAUT,ITML,FHG,TURKCELL,NXP (Netherlands),AIXTRON SE,SIEMENS ELECTRONIC DESIGN AUTOMATION SARL,SKILL REAL LTD,Solmates,FORD OTOMOTIV SANAYI ANONIM SIRKETI,QTECHNOLOGY A/S,Mellanox Technologies (Israel),HUBER DIFFRAKTIONSTECHNIK GMBH & CO KG,NovAliX,ICOS,NXP (Netherlands),ORBX,BESI,IMEC,CORETIGO LTD,SAVOX,INNOLUME,Jordan Valley Semiconductors (Israel),Nanomotion (Israel),EVG,NFI,BESI,EVG,DEEPXSCAN GMBH,SANLAB SIMULASYON AR. GE. SAN. TIC. A.S.,TURKCELL,Harokopio University,SAVOX,University of Catania,SMART CONTROL SYSTEMS AND SOFTWARE JOINT STOCK COMPANY,TU/e,POLITO,KLA,ASM Amicra,NXP,3DIS TECHNOLOGIES,AIXTRON SE,TÜBİTAK,Nanomotion (Israel),NXP,Innolume (Germany),PHIX BV,FERDINAND-BRAUN-INSTITUT GGMBH LEIBNIZ- INSTITUT FUR HOCHSTFREQUENZTECHNIK,FEI,DEEPXSCAN GMBH,SEMILAB ZRT,HORSA S.P.A.,ULAK HABERLESME AS,SEMI Europe,IMEC,IMT,BARKHAUSEN INSTITUT GGMBH,AT&S (Austria),ICOS,Mellanox Technologies (Israel),LAM RESEARCH INTERNATIONAL BV,NFI,SEMILAB ZRT,Polytechnic University of Milan,NOVA LTD,BLUEPATH ROBOTICS,AVL TURKIYE,SKILL REAL LTD,AT&S,Besi Netherlands BV,SEMI Europe,3DIS TECHNOLOGIES,FEI,STMicroelectronics (Switzerland),CORETIGO LTD,Centria University of Applied Sciences,TERAMOUNT LTD,TNO,Excillum (Sweden),PHOTONICSYS LTD,TNO,SANLAB SIMULASYON AR. GE. SAN. TIC. A.S.,TERAMOUNT LTD,ITML,University of Bucharest,Solmates,SIEMENS ELECTRONIC DESIGN AUTOMATION SARL,NXP (Germany),Besi Netherlands BV,FERDINAND-BRAUN-INSTITUT GGMBH LEIBNIZ- INSTITUT FUR HOCHSTFREQUENZTECHNIK,PHIX BV,HUBER DIFFRAKTIONSTECHNIK GMBH & CO KG,STMicroelectronics (Switzerland),AT-ITALY,NXP (Germany),Excillum (Sweden),Centria University of Applied Sciences,SMART CONTROL SYSTEMS AND SOFTWARE JOINT STOCK COMPANY,HORSA S.P.A.,FORD OTOMOTIV SANAYI ANONIM SIRKETI,ULAK HABERLESME AS,ORBX,LAM RESEARCH INTERNATIONAL BV,BRILLIANETOR LTD,ASM Amicra,SOFTABILITY OY,Harokopio University,AMIL,Phononicstech,SOFTABILITY OY,NovAliX,BLUEPATH ROBOTICS,ARBONAUT,QTECHNOLOGY A/S,BRILLIANETOR LTD,AMIL,TÜBİTAK,AT-ITALYFunder: European Commission Project Code: 101097296Overall Budget: 101,901,000 EURFunder Contribution: 24,573,800 EURThe challenges and major HiCONNECTS objectives are to transform the centralized cloud platform to decentralized platforms which include edge cloud computing in a sustainable, energy-efficient way. This will bring cloud services including Artificial Intelligence (AI) closer to the IOT end-users, which enables them to really use the COT and IOT efficiently. The technologies underpinning this revolutionary step include the development of high-performance computing, storage infrastructure, network interfaces and connecting media , and the analysis of IOT sensors and big data in real-time. This major step forward will enable, for example, the mobile clients (during the 5G deployment phase and 6G exploration) to move among different places with minimum cost, short response time and with stable connection between cloud nodes and mobile devices. The main underlying technology to be developed by the HiCONNECTS consortium, comprising large industrial players, universities and RTOs, and many SMEs, can be summarized under the title: heterogenous integration (HI) which is needed to meet the computing power, bandwidth, latency and sensing requirements for the next generation cloud and edge computing and applications. The HI revolution brings the electronic components and systems (ECS) into a new domain, which combines traditional silicon wafers integrated circuit (IC), InP based high speed electronics , and Si and InP photonics devices and interconnect. The HiCONNECTS ambition is to demonstrate, through HI development, a leap in computing and networking reliability and performances across the full vertical and horizontal ECS value chain (i.e. essential capabilities and key applications) in a sustainable way. In addition, HiCONNECTS will focus on the development of next generation design, algorithms, equipment (HW/SW), systems and Systems of Systems (SOS).
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For further information contact us at helpdesk@openaire.euOpen Access Mandate for Publications and Research data assignment_turned_in Project2024 - 2027Partners:IDNEO, INNOVATION DIS.CO PRIVATE COMPANY, Infineon Technologies (Germany), Infineon Technologies (Germany), CSIC +67 partnersIDNEO,INNOVATION DIS.CO PRIVATE COMPANY,Infineon Technologies (Germany),Infineon Technologies (Germany),CSIC,HEMA ENDUSTRI AS,BYLOGIX,NOKIA TECHNOLOGIES,TOP DATA SCIENCE OY,IOTAM INTERNET OF THINGS APPLICATIONS AND MULTI LAYER DEVELOPMENT LTD,SIILI AUTO OY,INNOVATION DIS.CO PRIVATE COMPANY,Infineon Technologies (Austria),SMART CONTROL SYSTEMS AND SOFTWARE JOINT STOCK COMPANY,TTTECH AUTO AG,INNATERA NANOSYSTEMS BV,UNIMORE,UAM,ROVIMATICA,AIT,DANISI ENGINEERING SRL,TTTECH AUTO AG,Velti GMBH,EPOS EMBEDDED CORE & POWER SYSTEMS GMBH & CO. KG,TÜBİTAK,TH Köln – University of Applied Sciences,ANYWI,AITEK,TOP DATA SCIENCE OY,Infineon Technologies (Austria),POLITO,UAM,IMEC,IDEAS & MOTION SRL,HEMA ENDUSTRI AS,Velti GMBH,TAMPERE UNIVERSITY,SANLAB SIMULASYON AR. GE. SAN. TIC. A.S.,IMEC,OYAK RENAULT OTOMOBIL FABRIKALARI AS,ANYWI,IOTAM INTERNET OF THINGS APPLICATIONS AND MULTI LAYER DEVELOPMENT LTD,AVL,INFINEON TECHNOLOGIES DUISBURG GMBH& CO. KG,FREQUENTIS,NOKIA TECHNOLOGIES,SMARTSOL SIA,Harokopio University,Latvian Academy of Sciences,SMART CONTROL SYSTEMS AND SOFTWARE JOINT STOCK COMPANY,EESY-INNOVATION GMBH,BYLOGIX,TOFAS,IDEAS & MOTION SRL,AITEK SPA,TTTech Germany GmbH,DANISI ENGINEERING SRL,IDNEO,TTTech Germany GmbH,SANLAB SIMULASYON AR. GE. SAN. TIC. A.S.,IECS,TOFAS,AVL,Technische Hochschule Köln,ROVIMATICA,EESY-INNOVATION GMBH,Harokopio University,SIILI AUTO OY,TU Delft,TÜBİTAK,INNATERA NANOSYSTEMS BV,OYAK RENAULT OTOMOBIL FABRIKALARI ASFunder: European Commission Project Code: 101139996Overall Budget: 33,956,400 EURFunder Contribution: 10,016,600 EURShapeFuture will drive innovation in fundamental Electronic Components and Systems (ECS) that are essential for robust, powerful, fail-operational and integrated perception, cognition, AI-enabled decision making, resilient automation and computing, as well as communications, for highly automated vehicles. Its overarching vision is to bring ECS Innovation at the Heart of Europe's Mobility Transformation, thereby elevating Sovereignty by Perfecting Programmable ECS Solutions for Intelligent, Safe, Connected, and Highly Automated Vehicles. The project will result in the following main tangible outcomes: • Safety, security and reliability of in-vehicle systems to levels appropriate for mass-market deployment. • Availability and supply of leading-edge ECS for the European automotive supply chain and for OEMs to be at the forefront of technology developments in the 2030s. • Increased Accuracy and Robustness of ECS for perception with smaller form factors and lower power consumption. • ECS attributed with cognition features and improved human-Machine Interface (HMI). • ECS with cognitive processing and decision-making capabilities. • ECS for resilient automation and communications. • Increased technology acceptance that will also lead to business sovereignty safeguard. 15 demonstrators and 2 impact studies will showcase the project’s achievements and their capability to deliver innovations and secure future application advances in core markets for European society – Mobility, Green Deal, Digital Society, Safety and Industry. The project innovations will leverage the expertise of world-renowned industrial (5 OEMs, 24 Tier-1, Tier-2 and technology providers) and 12 research partners along the complete automotive and semiconductor value chains, providing Europe with a competitive edge in a growing market. Importantly, ShapeFuture will contribute to ensuring European ECS Sovereignty by shaping the future of ECS in mobility.
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