HARVEST will unleash the potential of breakthrough technologies by creating integrated multifunctional systems for Aeronautics via the development of i) Structural composites, comprised of hierarchical carbon fiber (CF) reinforcements and an innovative thermoset 3R (repair, recycle and reprocess) epoxy matrix with ThermoElectric Generation (TEG) and self-repair capabilities, ii) Autonomously TEG -driven integrated systems for on- and off-line structural health monitoring-(SHM) and iii) Wired and low-power wireless SHM data transmission and mining system. The innovative intelligent materials and parts, will be manufactured in purposefully developed pilot lines aiming at reducing production time and costs. CFs yarns or textiles will be coated with nanomaterials using facile & environmentally friendly deposition and doping methods in a Roll-to-Roll (R2R) pilot line targeting dramatically increased TEG performance compared to existing composites, carbon and organic based materials. Innovative TEG-hierarchical composites will be manufactured with new generation 3R thermoset matrix systems enabling out of autoclave manufacturing and self-repair. These will be interfaced with a purposely designed hardware to (i) power inherent functionalities (e.g. strain, damage or UV-exposure sensing), (ii) drive external elements (e.g. piezo electric sensors for SHM) and (iii) transmit sensing signals to a remote panel. The autonomous SHM systems will increase the safety of civil aviation; reduce emissions and maintenance & life cycle costs. The proposed technologies will be finally integrated in two aircraft demonstrator parts, targeting areas with temperature gradients (e.g. engine vs. environment, inside vs. outside fuselage during flight) or where quick heat dissipation is essential (e.g. landing gear after take-off). The location of suitable heat sinks in real structures will be established using advanced numerical tools to identify thermal gradients in operating environment.

SEER aims to develop smart self-monitoring composite tools, able to measure process and material parameters and, thus, to provide real-time process control with unprecedented reliability. SEER consortium will achieve this by: 1) developing miniature photonic sensors, 2) embedding those sensors in the tool with through-the-thickness techniques which minimise alteration of the structural integrity of the tool itself and 3) optimising the manufacturing control system through the implementation of a prototype process monitoring, optimisation, and process control unit. SEER will adopt a multi-sensor approach that will comprise a temperature, a refractive index, and a pressure sensor, operating in the near infrared and all integrated on a miniature photonic integrated circuit (PIC). The SEER solution will be compatible with and optimise existing composite manufacturing methods and its reuse for several resin curing cycles will increase efficiency and save resources. The embedded PIC sensors in a reusable tool will cater perfectly to address pre-processing and will use acquired raw data for process optimisation, using theoretical models and machine learning algorithms, establishing for each tool a link between the sensor data, material state models, process parameters, as well as degradation of the tool. This will allow efficient preventive maintenance of the tool with less effort and provide insight on better tool design. Finally, the acquired data from quality testing of cured parts will be used to optimise the process control ensuring further enhance in the quality yield and will provide with a part quality fingerprint.