OCEAN12 targets the key societal challenge of smart mobility. Based on the innovative FDSOI technology, OCEAN12 will develop new processors and applications design that leverage Fully Depleted Silicon On Insulator (FD-SOI) technology to offer the industry’s lowest power consuming processor, especially for automotive and aeronautic applications. OCEAN12 will develop a technology platform benefitting from FDSOI design’s extreme low leakage and operating voltage (Vdd) scalability attained thank to reverse and forward body biasing (RBB/FBB) of the integrate circuit and it power system architecture. This high performance, low power solution will enable the next strategic generations of smart vehicles. This platform will rely on: • pilot line facilities capable to manufacture advanced substrates compatible with 12FDX technology and define pathfinding solutions to push 12FDX technology performances and develop innovative sensors, • development of innovative designs to enhance FDSOI capacity and guarantee the highest level of integrated solutions, • the manufacturing of high performance ICs using all panel of FDSOI technologies, The produced highly integrated, reliable, ultra low power and lower cost components will be integrated in complex embedded systems accessible to TIER-1, 2 and OEMs and answering strategic challenges of future vehicles generations. Several product demonstrators are targeted: high end microcontroller plug and play board, high performance sensors data fusion, highly integrated low power video processing, awaking systems. A strong added value network is created across this project to enhance a competitive European value chain on a European breakthrough and secure a unique FDSOI roadmap beyond the 22FDX. OCEAN 12 finally highlights Europe’s unique leading position on FDSOI technology integrating the entire manufacturing chain in this dynamic, from substrate suppliers and foundries to TIER-1 and OEM, including academia and RTO’s.

The overarching goal of BEYOND5 is to build a completely European supply chain for Radio-Frequency Electronics enabling new RF domains for sensing, communication, 5G radio infrastructure and beyond. BEYOND5 is first and foremost a technology project gathering most significant European actors covering the entire value chain from materials, semiconductor technologies, designs and components up to the systems. BEYOND5 will drive industrial roadmaps in More than Moore (MtM) in adding connectivity features on existing CMOS Technology. The ambition is to accomplish sustainable Radio Frequency SOI platforms to cover the frequency range from 0.7GHz to more than 100GHz, and to demonstrate the technical advantage of SOI, which allows combining large scale integration, low power consumption, cost competitiveness and higher reliability; thus, resulting in high volume production of trusted components with low environmental impact in Europe. This objective will be achieved in a “Time to Market” approach using the 3 major work streams: 1. Technology enhancement in three European industrial pilot lines: • 300mm RF SOI substrates pilot line in Soitec, supported by the “Substrate Innovation Center” in CEA LETI to prepare future generations. • RF-SOI 65nm pilot line for 5G FEM in ST addressing both sub-6GHz and 28GHz domains. • 22FDX pilot line addressing Digital Signal Processing of radio module and RF reliability, in GF 2. European RF design ecosystem strengthening, based on a large fabless community using FD-SOI and RF-SOI platforms 3. Six Leading edge systems aggregating the value chain to demonstrate added-value of the technology at the user level: • NB IoT for Smart Asset Tracking, • Contactless USB for high-data rate communication, • V2X for autonomous connected trucks, • 5G Low Power Digital Beamforming Base Station for Indoor dense spaces, • Automotive MIMO Radar with embedded AI, • Car Interior Radar for passenger monitoring.