ALL2GaN will be the backbone for the European Power Electronics Industry by offering an EU-born smart GaN Integration Toolbox. The project will provide the base for applications with significantly increased material- and energy efficiency, thus meeting the global energy needs while keeping the CO2 footprint to the minimum. 46 partners from 12 European countries will collaborate on 8 major objectives along the entire vertical value chain of power and RF electronics. O1: Push the limits of industrial GaN devices and system-on-chip approaches for ≤ 100V O2: Leverage the full potential of innovative substrates for GaN O3: Achieve novel benchmark solutions for lateral GaN devices and integrated circuits ≥ 650V O4: Reach best technical and cost performance of RF GaN on Si with novel integration concepts O5: Break the packaging limits by application driven integrated solutions of high performance GaN products O6: Advance the methods to evaluate and optimize reliability and robustness of GaN components, modules, and systems for shortest time-to-market and maximum product availability at the end user O7: Demonstrate highest affordable performance for greener power electronics and RF applications O8: Road-mapping for the future GaN technology development and applications to support long-term exploitation/business cases and European leadership beyond ALL2GaN. The collaboration in ALL2GaN is based on a work package structure covering activities on novel power- and RF-GaN technologies for various voltage classes, latest packaging technologies, research on reliability and demonstration in 11 Use Cases. With ambitious goals and a clear vision, ALL2GaN will unleash the energy saving and material efficiency potential of GaN semiconductors for a broad field of applications, thus being in line with the major challenges outlined in the ECS-SRIA. ALL2GaN technology will directly contribute to energy saving and cutting-edge green technology innovation as…Every Watt counts!

FastLane targets a full, highly competitive and sustainable European value chain for Silicon Carbide (SiC) based power electronics. The goal is to provide a competitive technology excellence from engineered SiC substrates to novel devices, smart power modules and converters to broadened automotive and industrial applications. The next generation of SiC materials will be developed by improved quality of the crystalline starting material, material re-use and acceleration of substrate EU-based manufacturing. Based on the new materials the next generation SiC MOSFET power devices will be developed overcoming current limitations regarding efficiency, performance, robustness and sustainability and will integrate also new on-chip sensing technology. Power modules based on the devices will be further improved by several innovations, e.g. advanced sintering which will lead to improved power module reliability and therefore better sustainability. On component level, highly efficient and reliable inverters for automotive and industrial applications will be developed, including a variety of innovations in detail. In all steps, an improvement of SiC material characterization methodologies will increase the quality and the output of EU based semiconductors. Overall, performance and reliability are expected to increase greatly in all steps. These developments will lead to an overall reduction of cost and, by reduction of the footprint (lifetime increase, CO2 decrease, water consumption decrease), to a greener economy. With the envisioned goals, FastLane will decrease the environmental footprint all along the product lifecycle and contribute to the European Green Deal and ensure a sustainable European sovereignty in power electronics. Cost benefits for the end user will be achieved by the reuse of the automotive economy of scale. With these steps, FastLane contributes to the European societal goals and a greener economy.