TEXEDA DESIGN GMBH

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Web page: http://www.texeda.de

Country: Germany

TEXEDA DESIGN GMBH

- Funding / Projects
  (1)

1 Projects, page 1 of 1

EuroPAT-MASIP (European Packaging, Assembly and Test Pilot for Manufacturing of Advanced System-in-Package)
Open Access Mandate for Publications assignment_turned_inProject2017 - 2020Partners:NXP, NXP, VALEO VISION SYSTEMS, SPINVERSE OY, PAC TECH +48 partners
NXP,
NXP,
VALEO VISION SYSTEMS,
SPINVERSE OY,
PAC TECH,
FHG,
Besi Netherlands BV,
Silicon Radar (Germany),
Afore Oy,
NANOTEST,
NANOTEST,
SEMILAB ZRT,
ROODMICROTEC,
Sencio,
INNOSENT,
LETI,
BESI,
Afore Oy,
ADVANCED VACUUM,
NANIUM S.A.,
EVG,
BESI,
Elmos Semiconductor (Germany),
Elmos Semiconductor (Germany),
I.Con. Innovation,
TEKNOLOGIAN TUTKIMUSKESKUS VTT OY,
3DIS TECHNOLOGIES,
AMIC,
ROODMICROTEC,
SEMILAB ZRT,
PAC TECH,
Nokian Tyres (Finland),
Besi Netherlands BV,
TEKNOLOGIAN TUTKIMUSKESKUS VTT OY,
AMIC,
Nokian Tyres (Finland),
VALEO VISION SYSTEMS,
EVG,
MURATA ELECTRONICS OY,
KETEK GMBH HALBLEITER-UND REINRAUMTECHNIK,
TEXEDA DESIGN GMBH,
PACKAGING SIP,
Murata (Finland),
ADVANCED VACUUM,
3DIS TECHNOLOGIES,
MICRO ANALOG SYSTEMS OY,
Sencio,
KETEK GMBH HALBLEITER-UND REINRAUMTECHNIK,
SPINVERSE OY,
PACKAGING SIP,
TEXEDA DESIGN GMBH,
Silicon Radar (Germany),
MICRO ANALOG SYSTEMS OY
Funder: European Commission Project Code: 737497
Overall Budget: 29,735,000 EURFunder Contribution: 7,203,640 EUR
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TEXEDA DESIGN GMBH

TEXEDA DESIGN GMBH

1 Projects, page 1 of 1

EuroPAT-MASIP (European Packaging, Assembly and Test Pilot for Manufacturing of Advanced System-in-Package)

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