
Silicon Radar (Germany)
Silicon Radar (Germany)
8 Projects, page 1 of 2
Open Access Mandate for Publications assignment_turned_in Project2020 - 2023Partners:Sony Europe B.V., KTH, Sony Europe B.V., FLAVIA IT-Management GmbH, BUYUTECH TEKNOLOJI SANAYI VE TICARET ANONIM SIRKETI +59 partnersSony Europe B.V.,KTH,Sony Europe B.V.,FLAVIA IT-Management GmbH,BUYUTECH TEKNOLOJI SANAYI VE TICARET ANONIM SIRKETI,TRAXENS,MIKROELEKTRONIK LTD,TURKCELL,MU,TRAXENS,Sequans Communications (France),Sequans Communications (France),EAB,Gdańsk University of Technology,MIKROELEKTRONIK LTD,RFBEAM MICROWAVE GMBH,D&R,IMEC,ARBE ROBOTICS LTD,NI,FORD OTOMOTIV SANAYI ANONIM SIRKETI,Anteverta,FORD OTOMOTIV SANAYI ANONIM SIRKETI,STGNB 2 SAS,SMART IS MAKINALARI SANAYI VE TICARET ANONIM SIRKETI,FHG,IMEC,SILTRONIC AG,GLOBALFOUNDRIES Dresden Module One LLC & Co. KG,BUYUTECH TEKNOLOJI SANAYI VE TICARET ANONIM SIRKETI,Bundeswehr University Munich,VIC,Silicon Radar (Germany),MU,TÜBİTAK,TUD,UCL,SILTRONIC AG,SOITEC,Silicon Radar (Germany),VIC,LETI,Lund University,D&R,STGNB 2 SAS,AED,RFBEAM MICROWAVE GMBH,University of Bucharest,Institut Polytechnique de Bordeaux,TURKCELL,MunEDA,TU Delft,Anteverta,TÜBİTAK,ASYGN,SMART IS MAKINALARI SANAYI VE TICARET ANONIM SIRKETI,Cooperative Program for the Technological Development and Modernization of Coffee,NI,SOITEC,MunEDA,ARBE ROBOTICS LTD,GLOBALFOUNDRIES Dresden Module One LLC & Co. KG,FLAVIA IT-Management GmbH,STM CROLLESFunder: European Commission Project Code: 876124Overall Budget: 97,448,096 EURFunder Contribution: 24,872,400 EURThe overarching goal of BEYOND5 is to build a completely European supply chain for Radio-Frequency Electronics enabling new RF domains for sensing, communication, 5G radio infrastructure and beyond. BEYOND5 is first and foremost a technology project gathering most significant European actors covering the entire value chain from materials, semiconductor technologies, designs and components up to the systems. BEYOND5 will drive industrial roadmaps in More than Moore (MtM) in adding connectivity features on existing CMOS Technology. The ambition is to accomplish sustainable Radio Frequency SOI platforms to cover the frequency range from 0.7GHz to more than 100GHz, and to demonstrate the technical advantage of SOI, which allows combining large scale integration, low power consumption, cost competitiveness and higher reliability; thus, resulting in high volume production of trusted components with low environmental impact in Europe. This objective will be achieved in a “Time to Market” approach using the 3 major work streams: 1. Technology enhancement in three European industrial pilot lines: • 300mm RF SOI substrates pilot line in Soitec, supported by the “Substrate Innovation Center” in CEA LETI to prepare future generations. • RF-SOI 65nm pilot line for 5G FEM in ST addressing both sub-6GHz and 28GHz domains. • 22FDX pilot line addressing Digital Signal Processing of radio module and RF reliability, in GF 2. European RF design ecosystem strengthening, based on a large fabless community using FD-SOI and RF-SOI platforms 3. Six Leading edge systems aggregating the value chain to demonstrate added-value of the technology at the user level: • NB IoT for Smart Asset Tracking, • Contactless USB for high-data rate communication, • V2X for autonomous connected trucks, • 5G Low Power Digital Beamforming Base Station for Indoor dense spaces, • Automotive MIMO Radar with embedded AI, • Car Interior Radar for passenger monitoring.
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For further information contact us at helpdesk@openaire.euOpen Access Mandate for Publications and Research data assignment_turned_in Project2023 - 2026Partners:THALES, Silicon Radar (Germany), IHP GMBH, ICAS, Silicon Radar (Germany) +4 partnersTHALES,Silicon Radar (Germany),IHP GMBH,ICAS,Silicon Radar (Germany),THALES,TAIPRO,TAIPRO,IHP GMBHFunder: European Commission Project Code: 101103057Overall Budget: 2,458,360 EURFunder Contribution: 2,457,760 EURNew communications and radar systems require small and tunable high-frequency devices, since their backbone is the Internet-of- Things (IoT). The need for ultrafast, low-energy-consumption information processing of an exponentially increasing data volume will lead to a global mobile traffic reaching 4394 EB by 2030, thus starting the 6G era (data rate up to 1 Tb/s) of an “ubiquitous virtual existence”. In today’s wireless applications, radar sensors play one of the major roles. Due to the increased need for higher sensitivity and non-destructive inspection systems, the frequency of the radar sensors has reached up to 300GHz on silicon-based technologies. On the other side, 60GHz radar sensing is considered one of the main products for smart home, non-destructive material classification, monitoring vital signals, and all the IoT application that need micro-motion detection. The market penetration for these sensors is now hampered by (i) the limited antenna performance (mainly for the 300GHz case) and (ii) the frequency selectivity and tunability (mainly for the 60GHz case). SMARTWAY proposes novel architectures based on new paradigms that exhibit a significant decrease in energy consumption while improving on speed/performance and miniaturization. The disruptive nature of the targeted approach relies on a progress towards the wafer-scale integration of two-dimensional (2D) materials, metamaterials (MMs), and carbon nanotubes (CNTs) into radar sensor suitable for IoT sensing applications at both millimetre-waves (i.e., 24–60GHz) and THz frequencies (i.e., 240–300GHz). The final outcomes of the project will be two demonstrators, apt to provide industry compatible solutions for radar sensor technologies. For the first time, the nanotechnological paradigms “2D materials” and “CNTs” will be harmonized with the MM concept, thus producing brand-new designs of large-scale complete systems with emphasis on compatibility and integration of different materials/technologies.
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For further information contact us at helpdesk@openaire.euassignment_turned_in Project2011 - 2015Partners:Silicon Radar (Germany), University of Ulm, ICAS, IHP GMBH, TopGaN +24 partnersSilicon Radar (Germany),University of Ulm,ICAS,IHP GMBH,TopGaN,OMMIC SAS,Alfa Imaging (Spain),COVENTOR SARL,UoA,FOI,FOUNDATION FOR RESEARCH AND TECHNOLOGYHELLAS,UoA,SHT,FHG,COVENTOR SARL,Uppsala University,THALES,SHT,IHP GMBH,Thalgo (France),AIRBUS DEFENCE AND SPACE GMBH,EADS DEUTSCHLAND GMBH,FOI,TopGaN,Alfa Imaging (Spain),Silicon Radar (Germany),THALES,THALES UNDERWATER SYSTEMS SAS,FOUNDATION FOR RESEARCH AND TECHNOLOGYHELLASFunder: European Commission Project Code: 288531All Research productsarrow_drop_down <script type="text/javascript"> <!-- document.write('<div id="oa_widget"></div>'); document.write('<script type="text/javascript" src="https://beta.openaire.eu/index.php?option=com_openaire&view=widget&format=raw&projectId=corda_______::edf24048639f5f5deef731d08c7a1575&type=result"></script>'); --> </script>
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For further information contact us at helpdesk@openaire.euassignment_turned_in Project2009 - 2013Partners:IHP GMBH, Robert Bosch (Germany), Robert Bosch (Germany), ST, UNIVERSITY OF TORONTO +12 partnersIHP GMBH,Robert Bosch (Germany),Robert Bosch (Germany),ST,UNIVERSITY OF TORONTO,UNIVERSITY OF TORONTO,HIGHTEC,KIT,Silicon Radar (Germany),ST,Silicon Radar (Germany),SELMIC LTD,Evatronix IP,IHP GMBH,SELMIC LTD,HIGHTEC,Evatronix IPFunder: European Commission Project Code: 248120All Research productsarrow_drop_down <script type="text/javascript"> <!-- document.write('<div id="oa_widget"></div>'); document.write('<script type="text/javascript" src="https://beta.openaire.eu/index.php?option=com_openaire&view=widget&format=raw&projectId=corda_______::6c57a75b5335a1a39bcb447ba49aa88b&type=result"></script>'); --> </script>
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For further information contact us at helpdesk@openaire.euOpen Access Mandate for Publications assignment_turned_in Project2017 - 2020Partners:NXP, NXP, VALEO VISION SYSTEMS, SPINVERSE OY, PAC TECH +48 partnersNXP,NXP,VALEO VISION SYSTEMS,SPINVERSE OY,PAC TECH,FHG,Besi Netherlands BV,Silicon Radar (Germany),Afore Oy,NANOTEST,NANOTEST,SEMILAB ZRT,ROODMICROTEC,Sencio,INNOSENT,LETI,BESI,Afore Oy,ADVANCED VACUUM,NANIUM S.A.,EVG,BESI,Elmos Semiconductor (Germany),Elmos Semiconductor (Germany),I.Con. Innovation,TEKNOLOGIAN TUTKIMUSKESKUS VTT OY,3DIS TECHNOLOGIES,AMIC,ROODMICROTEC,SEMILAB ZRT,PAC TECH,Nokian Tyres (Finland),Besi Netherlands BV,TEKNOLOGIAN TUTKIMUSKESKUS VTT OY,AMIC,Nokian Tyres (Finland),VALEO VISION SYSTEMS,EVG,MURATA ELECTRONICS OY,KETEK GMBH HALBLEITER-UND REINRAUMTECHNIK,TEXEDA DESIGN GMBH,PACKAGING SIP,Murata (Finland),ADVANCED VACUUM,3DIS TECHNOLOGIES,MICRO ANALOG SYSTEMS OY,Sencio,KETEK GMBH HALBLEITER-UND REINRAUMTECHNIK,SPINVERSE OY,PACKAGING SIP,TEXEDA DESIGN GMBH,Silicon Radar (Germany),MICRO ANALOG SYSTEMS OYFunder: European Commission Project Code: 737497Overall Budget: 29,735,000 EURFunder Contribution: 7,203,640 EURna
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