
AMIC
7 Projects, page 1 of 2
assignment_turned_in Project2014 - 2017Partners:AMIC, FHG, UCC, IBM RESEARCH GMBH, IBM RESEARCH GMBH +10 partnersAMIC,FHG,UCC,IBM RESEARCH GMBH,IBM RESEARCH GMBH,Chemnitz University of Technology,AMIC,IPD,IPDIA,IPDIA,Chemnitz University of Technology,ETHZ,Optocap Ltd,ITE,Optocap LtdFunder: European Commission Project Code: 619488All Research productsarrow_drop_down <script type="text/javascript"> <!-- document.write('<div id="oa_widget"></div>'); document.write('<script type="text/javascript" src="https://beta.openaire.eu/index.php?option=com_openaire&view=widget&format=raw&projectId=corda_______::3122ca658bcb106db9a4e027287d6776&type=result"></script>'); --> </script>
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For further information contact us at helpdesk@openaire.euassignment_turned_in Project2013 - 2015Partners:FHG, IBM RESEARCH GMBH, Conpart (Norway), LORD GERMANY GMBH, SINTEF AS +14 partnersFHG,IBM RESEARCH GMBH,Conpart (Norway),LORD GERMANY GMBH,SINTEF AS,SINTEF AS,AMIC,INTRINSIQ MATERIALS LIMITED,IBM RESEARCH GMBH,Chemnitz University of Technology,VESTFORSK,AMIC,Conpart (Norway),Chemnitz University of Technology,INTRINSIQ MATERIALS LIMITED,IKIFP PAN,LORD GERMANY GMBH,VESTFORSK,IKIFP PANFunder: European Commission Project Code: 310420All Research productsarrow_drop_down <script type="text/javascript"> <!-- document.write('<div id="oa_widget"></div>'); document.write('<script type="text/javascript" src="https://beta.openaire.eu/index.php?option=com_openaire&view=widget&format=raw&projectId=corda_______::387b90a828db8608bb56e7b6d52aad2b&type=result"></script>'); --> </script>
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For further information contact us at helpdesk@openaire.eu- AMIC,CWM,NANOTEST,NANOTEST,CWM,AMICFunder: European Commission Project Code: 271882All Research products
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For further information contact us at helpdesk@openaire.eu Open Access Mandate for Publications assignment_turned_in Project2018 - 2021Partners:CORTEC, Complutense University of Madrid, HUN-REN CENTRE FOR ENERGY RESEARCH, ALPHASIP SANTA CLARA NANOMEDICAL USA NANOCARDIOCOCO SOCIEDAD LIMITADA, FHG +80 partnersCORTEC,Complutense University of Madrid,HUN-REN CENTRE FOR ENERGY RESEARCH,ALPHASIP SANTA CLARA NANOMEDICAL USA NANOCARDIOCOCO SOCIEDAD LIMITADA,FHG,LETI,HUN-REN RESEARCH CENTRE FOR NATURAL SCIENCES,TIKITIN,VERMON,CIKAUTXO S COOP,University of Zaragoza,AALTO,IMEC,PDM&FC,Creganna,Okmetic,CATENA GERMANY GMBH,Analog Devices (Ireland),3D-Micromac AG,3D-Micromac AG,PDM&FC,Salvia BioElectronics,TEKNOLOGIAN TUTKIMUSKESKUS VTT OY,IT,Salvia BioElectronics,OSYPKA,CIBER,TEKNOLOGIAN TUTKIMUSKESKUS VTT OY,AMIC,Roma Tre University,TU/e,FINETECH GMBH & CO KG,IMEC,IMS,VERMON,EK,Analog Devices (Ireland),PHILIPS MEDICAL SYSTEMS NEDERLAND,INESC ID,UCC,DYB DYCONEX SA DYCONEX LTD,OSYPKA,Philips (France),TIKITIN,Brio Apps AlphaSIP,Silex Microsystems (Sweden),IPDIA,PICOSUN OY,PHILIPS ELECTRONICS NEDERLAND B.V.,AMIC,Integer,Okmetic,MCS,Silex Microsystems (Sweden),CIKAUTXO S COOP,JOHNSON MATTHEY PIEZO PRODUCTS GMBH,FINETECH GMBH & CO KG,CORTEC,REDEN,DYB DYCONEX SA DYCONEX LTD,Creganna,IMS,HUN-REN RESEARCH CENTRE FOR NATURAL SCIENCES,FBK,COMELEC,JOHNSON MATTHEY PIEZO PRODUCTS GMBH,CATENA GERMANY GMBH,IPDIA,INESC ID,JUMISC FOUNDATION JESUS USON MINIMALLY INVASIVESUR,Integer,PHILIPS MEDICAL SYSTEMS NEDERLAND,IBERHOSPITEX SA,Brio Apps AlphaSIP,Roma Tre University,REDEN,IBERHOSPITEX SA,ALPHASIP SANTA CLARA NANOMEDICAL USA NANOCARDIOCOCO SOCIEDAD LIMITADA,Catena,PHILIPS ELECTRONICS NEDERLAND B.V.,Philips (France),TU Delft,MCS,JUMISC FOUNDATION JESUS USON MINIMALLY INVASIVESUR,PICOSUN OYFunder: European Commission Project Code: 783132Overall Budget: 41,171,000 EURFunder Contribution: 10,409,000 EURThe objective of POSITION-II is to bring innovation in the development and production of smart catheters by the introduction of open technology platforms for miniaturization, AD conversion at the tip, ultra-sound MEMS devices and encapsulation. Open technology platforms will generate the production volume that will enable sustainable innovation. The availability of open technology platforms will result in new instruments that have a better performance, new sensing and imaging capabilities, while the scale of volume will result in lower manufacturing costs. The production of the “brains” of these smart catheters will take place in Europe, with many European partners contributing essential technologies. The POSITION-II project will consolidate Europe’s premier position as manufacturer of cath lab infrastructure since these new smart catheters will be seamlessly integrated in the cath lab hardware and software platforms. By combining the different sensing and imaging data a more intuitive cath lab experience will be achieved. Looking forward, POSITION-II prepares the European electronics industry for the next revolution in healthcare, bioelectronics implants. Bioelectronics implants are expected to replace a considerable fraction of traditional medicine by direct stimulation of nerves. The miniaturization and soft encapsulation platforms developed in POSITION-II will be the ideal technology frame work for the manufacturing of these bioelectronics implants. The technology platforms developed in POSITION-II are demonstrated by five challenging product demonstrators covering FRR, IVUS, ICE, EP and cell therapy as well as a bioelectronics implant to treat cluster headache.
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For further information contact us at helpdesk@openaire.euOpen Access Mandate for Publications assignment_turned_in Project2017 - 2020Partners:NXP, NXP, VALEO VISION SYSTEMS, SPINVERSE OY, PAC TECH +48 partnersNXP,NXP,VALEO VISION SYSTEMS,SPINVERSE OY,PAC TECH,FHG,Besi Netherlands BV,Silicon Radar (Germany),Afore Oy,NANOTEST,NANOTEST,SEMILAB ZRT,ROODMICROTEC,Sencio,INNOSENT,LETI,BESI,Afore Oy,ADVANCED VACUUM,NANIUM S.A.,EVG,BESI,Elmos Semiconductor (Germany),Elmos Semiconductor (Germany),I.Con. Innovation,TEKNOLOGIAN TUTKIMUSKESKUS VTT OY,3DIS TECHNOLOGIES,AMIC,ROODMICROTEC,SEMILAB ZRT,PAC TECH,Nokian Tyres (Finland),Besi Netherlands BV,TEKNOLOGIAN TUTKIMUSKESKUS VTT OY,AMIC,Nokian Tyres (Finland),VALEO VISION SYSTEMS,EVG,MURATA ELECTRONICS OY,KETEK GMBH HALBLEITER-UND REINRAUMTECHNIK,TEXEDA DESIGN GMBH,PACKAGING SIP,Murata (Finland),ADVANCED VACUUM,3DIS TECHNOLOGIES,MICRO ANALOG SYSTEMS OY,Sencio,KETEK GMBH HALBLEITER-UND REINRAUMTECHNIK,SPINVERSE OY,PACKAGING SIP,TEXEDA DESIGN GMBH,Silicon Radar (Germany),MICRO ANALOG SYSTEMS OYFunder: European Commission Project Code: 737497Overall Budget: 29,735,000 EURFunder Contribution: 7,203,640 EURna
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