The rise of quantum technology has opened the eyes of the ICT industry with respect to cryogenics. It is considered an enabler bringing in quantum functionalities and enhanced system performance and we are observing a massive growth of cryogenics from coolers to cryogenic electronics and photonics. ArCTIC is a joint effort of top European RTOs, industrial fabrication facilities, and leading application partners (23 industrial among which 14 SMEs, 7 RTO, 6 academic), sharing the vision to take a joint EU step towards the era of cryogenic classical and quantum microsystems. We aim to close the gap between qubit research and interfacing control machinery, highly needed for scaled-up quantum systems. The main goal of ArCTIC is to develop scalable cryogenic ICT microsystems and control technology for quantum processors. The technologies developed will have applications in many fields from sensing to communication, leading to important cross-fertilization that will strengthen the forming European ecosystem on cryogenic classical and quantum microsystems. ArCTIC will advance semiconductor technologies and materials, and tailor these for QT requirements and cryogenic applications. Multi-scale physics and data-driven models, cryogenic PDK modelling, device characterization, circuit design activities will support the development of cryogenic microelectronics. We will develop quantum processor platforms and broaden the applicability of microelectronic devices and circuits for cryogenic operation by developing cryo-compatible ultra-low loss substrates and thin-films, microelectronic and photonic circuits, semiconductor packaging and heterogeneous-integration techniques and benchmark the developed technologies. Scientific and Industrial ArCTIC-demonstrators and applications are driving our developments enabling the European industry to maintain and expand its leading edge in semiconductor components and processes and QT and strengthen sustainable manufacturing technologies

The HOMEMADE project falls directly into the scope of the HORIZON EUROPE policy: “To reduce the dependence on critical technologies and capabilities from outside Europe for future space applications”. We target a fast growing market which integrates communication satellites in 5G networks that will reduce digital divide by meeting latent demand for digital broadband. The project aims at developing a truly new Surface Acoustic Wave(SAW) filter technology not yet available to space industry. This innovation based on Piezo-On-Insulator (POI) wafers already produced for Smart phone industry is not accessible to space industry due to market size and its own high reliability specificities. Compared to existing technologies, POI-based SAW filters enable high integration, temperature stability, thermal management, low insertion loss and high rejection with various bandwidths in L- and S-band frequencies, replacing leaky waves on usual piezoelectric substrates by real guided waves on Silicon-based wafers. This project will deliver, as first pillar, POI-based SAW filters for space industry up to a TRL7 addressing all volume demands, in line with Geosynchronous Earth Orbiting satellites to Low Earth Orbiting satellite constellations. The supply chain for key items such as POI wafer supply, to front-end and back-end process is based in Europe. The high demand of innovation yielding reduced mass in satellites especially for new growing markets within a limited access time, has pushed to develop in HOMEMADE a second pillar that will deliver disruptive POI based SAW filters able to compete with bulky mechanical filters. The value chain includes European supplier of specific acoustic passive SOI-FREC as part of the SOITEC group with space integrator and technology supplier TAS, UCL and SME INC both world leaders in the field POI based material and device optimization, and finally ALT European centre of excellence for space reliability of high complexity active and passive components.

Electronic devices evolved significantly, fuelling the digital transformation towards a connected society. To growing need for performance, speed and efficiency pushes wireless applications to operate at sub-THz frequencies and beyond. Today’s technologies, however, come short to efficiently and effectively utilize these frequencies, even taking into account technological evolutions. A disruptive yet commercially viable technology is urgently needed. Indium Phosphide (InP) has outstanding and unique capabilities to surpass other technologies in terms of high-frequency performance. Today, InP is only adopted in niche markets because of its costly and scarce substrates. Move2THz will transform the InP platform and build a fully integrated European value chain providing commercially attractive, ecology-friendly, mass-market technologies suitable for sub-THz frequency operation and beyond, enabling emerging applications like mobile/data connectivity, imaging and sensing. To achieve this, Move2THz will radically innovate the manufacturing process by establishing a breakthrough InP-on-silicon (InPoSi) global standard. This facilitates to upscale the wafer size & volume compatible with CMOS manufacturing capacities, while minimizing the use of rare InP resources and ecological footprint. Further up the value chain, the European InP platform will be developed, matured and adopted through substrates, manufacturing, design and foundry services, including integration, packaging and education. Through Move2THz, the technical excellence provided by our consortium and the technologies developed in this project will significantly strengthen the competitive and sovereign position of Europe. It will secure its supply of semiconductors in a sustainable way for the next generations of wireless applications, generate a wealth of new market opportunities, and make significant contributions to a highly qualified European workforce. To achieve this, InP’s adoptability must accelerate NOW.