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22 Projects, page 1 of 5
assignment_turned_in Project2019 - 2028Partners:Precision Acoustics (United Kingdom), Stryker International, Zilico Ltd, Polatis (United Kingdom), Xtera Communications Limited +96 partnersPrecision Acoustics (United Kingdom),Stryker International,Zilico Ltd,Polatis (United Kingdom),Xtera Communications Limited,PHOTON DESIGN LIMITED,Waveoptics,Waveoptics,Optalysys Ltd,VividQ,Precision Acoustics (United Kingdom),Precision Acoustics (United Kingdom),Continental (Germany),Plessey Semiconductors Ltd,Xtera Communications Limited,BAE Systems (Sweden),PragmatIC Printing Ltd,Thales Group,PragmatIC Printing Ltd,Oclaro Technology UK,University of Cambridge,Zilico Ltd,Huawei Technologies (UK) Co. Ltd,McWane Technology (United Kingdom),Hitachi Cambridge Laboratory,Chromacity (United Kingdom),Integer Holdings Corporation,Xilinx (Ireland),Oclaro (United Kingdom),Analog Devices Inc (Global),Continental Automotive GmbH,Defence Science & Tech Lab DSTL,Defence Science & Tech Lab DSTL,BT Group (United Kingdom),Hitachi Cambridge Laboratory,HUBER+SUHNER Polatis Ltd,PLESSEY SEMICONDUCTORS LIMITED,Leonardo MW Ltd,Teraview Ltd,Anvil Semiconductors Ltd,Chromacity Ltd.,Airbus Defence and Space,Phasor Solutions Ltd,BT Group (United Kingdom),The Rockley Group UK,Toshiba (United Kingdom),Phasor Solutions Ltd,Xtera Communications Limited,Defence Science & Tech Lab DSTL,Thales Group (UK),UCL,Huawei Technologies (United Kingdom),PervasID Ltd,Leonardo MW Ltd,General Electric (United Kingdom),Stryker International,VividQ,MICROSOFT RESEARCH LIMITED,PHOTON DESIGN LIMITED,British Telecommunications plc,TREL,FAZ Technology Limited,BAE Systems (UK),Zinwave,aXenic Ltd.,TREL,Eight19 Ltd,Defence Science and Technology Laboratory,Hitachi Cambridge Laboratory,Oclaro Technology UK,The Rockley Group UK,Thales Group,PragmatIC (United Kingdom),Eight19 (United Kingdom),Inphenix,PervasID Ltd,Integer Holdings Corporation,FAZ Technology Limited,Inphenix,Eight19 Ltd,Optalysys Ltd,Eblana Photonics (Ireland),TeraView (United Kingdom),MICROSOFT RESEARCH LIMITED,Photon Design (United Kingdom),PLESSEY SEMICONDUCTORS LIMITED,BAE Systems (Sweden),BAE Systems (United Kingdom),Airbus (United Kingdom),Analog Devices,Chromacity Ltd.,Teraview Ltd,Anvil Semiconductors (United Kingdom),Airbus Defence and Space,Xilinx (Ireland),Thales (United Kingdom),aXenic Ltd.,Microsoft Research (United Kingdom),Huawei Technologies (UK) Co. Ltd,Zinwave,Teraview LtdFunder: UK Research and Innovation Project Code: EP/S022139/1Funder Contribution: 5,419,250 GBPThis proposal seeks funding to create a Centre for Doctoral Training (CDT) in Connected Electronic and Photonic Systems (CEPS). Photonics has moved from a niche industry to being embedded in the majority of deployed systems, ranging from sensing, biophotonics and advanced manufacturing, through communications from the chip-to-chip to transcontinental scale, to display technologies, bringing higher resolution, lower power operation and enabling new ways of human-machine interaction. These advances have set the scene for a major change in commercialisation activity where electronics photonics and wireless converge in a wide range of information, sensing, communications, manufacturing and personal healthcare systems. Currently manufactured systems are realised by combining separately developed photonics, electronic and wireless components. This approach is labour intensive and requires many electrical interconnects as well as optical alignment on the micron scale. Devices are optimised separately and then brought together to meet systems specifications. Such an approach, although it has delivered remarkable results, not least the communications systems upon which the internet depends, limits the benefits that could come from systems-led design and the development of technologies for seamless integration of electronic photonics and wireless systems. To realise such connected systems requires researchers who have not only deep understanding of their specialist area, but also an excellent understanding across the fields of electronic photonics and wireless hardware and software. This proposal seeks to meet this important need, building upon the uniqueness and extent of the UCL and Cambridge research, where research activities are already focussing on higher levels of electronic, photonic and wireless integration; the convergence of wireless and optical communication systems; combined quantum and classical communication systems; the application of THz and optical low-latency connections in data centres; techniques for the low-cost roll-out of optical fibre to replace the copper network; the substitution of many conventional lighting products with photonic light sources and extensive application of photonics in medical diagnostics and personalised medicine. Many of these activities will increasingly rely on more advanced systems integration, and so the proposed CDT includes experts in electronic circuits, wireless systems and software. By drawing these complementary activities together, and building upon initial work towards this goal carried out within our previously funded CDT in Integrated Photonic and Electronic Systems, it is proposed to develop an advanced training programme to equip the next generation of very high calibre doctoral students with the required technical expertise, responsible innovation (RI), commercial and business skills to enable the £90 billion annual turnover UK electronics and photonics industry to create the closely integrated systems of the future. The CEPS CDT will provide a wide range of methods for learning for research students, well beyond that conventionally available, so that they can gain the required skills. In addition to conventional lectures and seminars, for example, there will be bespoke experimental coursework activities, reading clubs, roadmapping activities, responsible innovation (RI) studies, secondments to companies and other research laboratories and business planning courses. Connecting electronic and photonic systems is likely to expand the range of applications into which these technologies are deployed in other key sectors of the economy, such as industrial manufacturing, consumer electronics, data processing, defence, energy, engineering, security and medicine. As a result, a key feature of the CDT will be a developed awareness in its student cohorts of the breadth of opportunity available and the confidence that they can make strong impact thereon.
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For further information contact us at helpdesk@openaire.euassignment_turned_in Project2013 - 2019Partners:Plastic Logic (United Kingdom), Swansea University, CDT, 3i (Germany), Dow Corning Ltd (UK) +53 partnersPlastic Logic (United Kingdom),Swansea University,CDT,3i (Germany),Dow Corning Ltd (UK),NPL,Nokia Research Centre,Defence Science & Tech Lab DSTL,National Physical Laboratory,RK Print Coat Instruments Ltd,PragmatIC Printing Ltd,Centre for Process Innovation,PragmatIC Printing Ltd,Nokia Research Centre (UK),RK Print Coat Instruments Ltd,Defence Science & Tech Lab DSTL,CDT,Merck & Co., Inc. (Sharp & Dohme (MSD)),Solvay (International Chemical Group),MOLECULAR VISION LIMITED,Cambridge Display Technology Ltd (CDT),SABMiller plc,Molecular Vision,SPECIFIC (Innovation and Knowledge Ctr),3M (United Kingdom),SPECIFIC (Innovation and Knowledge Ctr),Oxford Lasers (United Kingdom),CPI Ltd,RK Print Coat Instruments Ltd,PragmatIC (United Kingdom),Eight19 Ltd,De La Rue (United Kingdom),De La Rue International Ltd,MSD (United States),Plastic Logic (United Kingdom),3M (United Kingdom),SABMILLER PLC,MOLECULAR VISION LIMITED,Eight19 (United Kingdom),CPI Ltd,Nokia Research Centre,SPECIFIC Innovation and Knowledge Ctr,Dow Corning Ltd,University of Cambridge,Dow Corning Ltd,University of Cambridge,OXFORD,OXFORD,UNIVERSITY OF CAMBRIDGE,De La Rue International Ltd,Eight19 Ltd,Defence Science and Technology Laboratory,Defence Science & Tech Lab DSTL,SABMILLER PLC,Merck & Co Inc,NPL,Solvay (Belgium),Solvay (International Chemical Group)Funder: UK Research and Innovation Project Code: EP/K03099X/1Funder Contribution: 5,627,160 GBPLarge-Area Electronics is a branch of electronics in which functionality is distributed over large-areas, much bigger than the dimensions of a typical circuit board. Recently, it has become possible to manufacture electronic devices and circuits using a solution-based approach in which a "palette" of functional "inks" is printed on flexible webs to create the multi-layered patterns required to build up devices. This approach is very different from the fabrication and assembly of conventional silicon-based electronics and offers the benefits of lower-cost manufacturing plants that can operate with reduced waste and power consumption, producing electronic systems in high volume with new form factors and features. Examples of "printed devices" include new kinds of photovoltaics, lighting, displays, sensing systems and intelligent objects. We use the term "large-area electronics" (LAE) rather than "printable electronics" because many electronic systems require both conventional and printed electronics, benefitting from the high performance of the conventional and the ability of the printable to create functionality over large-areas cost-effectively. Great progress has been made over the last 20 years in producing new printable functional materials with suitable performance and stability in operation but despite this promise, the emerging industry has been slow to take-off, due in part to (i) manufacturing scale-up being significantly more challenging than expected and (ii) the current inability to produce complete multifunctional electronic systems as required in several early markets, such as brand enhancement and intelligent packaging. Our proposed Centre for Innovative Manufacturing in Large-Area Electronics will tackle these challenges to support the emergence of a vibrant UK manufacturing industry in the sector. Our vision has four key elements: - to address the technical challenges of low-cost manufacturing of multi-functional LAE systems - to develop a long-term research programme in advanced manufacturing processes aimed at ongoing reduction in manufacturing cost and improvement in system performance. - to support the scale-up of technologies and processes developed in and with the Centre by UK manufacturing industry - to promote the adoption of LAE technologies by the wider UK electronics manufacturing industry Our Centre for Innovative Manufacturing brings together 4 UK academic Centres of Excellence in LAE at the University of Cambridge (Cambridge Integrated Knowledge Centre, CIKC), Imperial College London (Centre for Plastic Electronics, CPE), Swansea University (Welsh Centre for Printing and Coating, WCPC) and the University of Manchester (Organic Materials Innovation Centre, OMIC) to create a truly representative national centre with world-class expertise in design, development, fabrication and characterisation of a wide range of devices, materials and processes.
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For further information contact us at helpdesk@openaire.euassignment_turned_in Project2017 - 2021Partners:PragmatIC Printing Ltd, PragmatIC Printing Ltd, Applied Materials (United States), UNIVERSITY OF CAMBRIDGE, PragmatIC (United Kingdom) +6 partnersPragmatIC Printing Ltd,PragmatIC Printing Ltd,Applied Materials (United States),UNIVERSITY OF CAMBRIDGE,PragmatIC (United Kingdom),Purdue University,Applied Materials Inc,Purdue University West Lafayette,University of Cambridge,University of Cambridge,Purdue University West LafayetteFunder: UK Research and Innovation Project Code: EP/P027032/1Funder Contribution: 373,054 GBPHigh quality, low temperature-grown thin film metal oxides are urgently needed for a wide range of emerging electronic applications relating to the Internet of Things. Numerous energy harvesting, generation and storage devices also rely on obtaining such films. The market is huge (>$100Bn) for such devices. However, manufacturing techniques cannot deliver the required high quality oxides simultaneously with the necessary low-temperature processing. The main focus of this proposal is to develop a manufacturing tool to rapidly synthesise, at low temperatures, high quality p-type oxides for flexible CMOS devices. Such devices are currently unavailable. The work will also have broad ramifications for the manufacturing of a wide range of oxide thin film applications beyond CMOS. The work is novel both in terms of the manufacturing tool (atmospheric vapour pressure spatial atomic layer deposition, AP-SALD) and the processing methodology (inducing surface quasi-liquids to strongly improve film crystallinity and carrier mobility). The tool and the process are together essential for enabling a step-change in the production of commercial flexible devices incorporating oxides. We will work closely with PragmatIC, a fast growing start-up in the area, who have committed both cash and in-kind support to the project as well as with Applied Materials, a large equipment manufacturer, the world leaders in industrial ALD, who are in an excellent position and also have interest in commercialising the AP-SALD manufacturing tool.
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For further information contact us at helpdesk@openaire.euassignment_turned_in Project2020 - 2023Partners:UNIVERSITY OF EXETER, Knowledge Transfer Network Ltd, Centre for Process Innovation, PragmatIC Printing Ltd, Waveoptics +53 partnersUNIVERSITY OF EXETER,Knowledge Transfer Network Ltd,Centre for Process Innovation,PragmatIC Printing Ltd,Waveoptics,Rolls-Royce,Technical Composite Systems,MBDA (United Kingdom),Metasonixx,Oxford Instruments (United Kingdom),MBDA UK Ltd,Centre of Process Innovation Limited,Defence Science & Tech Lab DSTL,Qioptiq Ltd,BAE Systems,PepsiCo (United Kingdom),Cobham,University of Exeter,Defence Science & Tech Lab DSTL,Qinetiq (United Kingdom),Technical Composite Systems,Metamaterial Technologies Inc.,Rolls-Royce (United Kingdom),PragmatIC (United Kingdom),Oxford Instruments (United Kingdom),Thales UK Limited,Atomic Weapons Establishment,Pepsico International Ltd,BAE SYSTEMS PLC,Defence Science & Tech Lab DSTL,Pepsico International Ltd,Pepsico International Ltd,MBDA UK Ltd,AWE,PragmatIC Printing Ltd,Rolls-Royce,Metasonixx,Thales (United Kingdom),Metamaterial Technologies (Canada),THALES UK LIMITED,BAE Systems (United Kingdom),Airbus (United Kingdom),Henry Royce Institute,Airbus Group Limited (UK),Knowledge Transfer Network,Business West,Cobham,Business West,Oxford Instruments (United Kingdom),Waveoptics,Qioptiq Ltd,University of Exeter,Centre for Process Innovation (replace),EADS Airbus,Henry Royce Institute,Defence Science and Technology Laboratory,EADS Airbus,Cobham (United Kingdom)Funder: UK Research and Innovation Project Code: EP/V002198/1Funder Contribution: 877,428 GBPMetamaterials are artificial materials with characteristics beyond those found in nature that unlock routes to material and device functionalities not available using conventional approaches. Their electromagnetic, acoustic or mechanical behaviour is not simply dictated by averaging out the properties of their constituent elements, but emerge from the precise control of geometry, arrangement, alignment, material composition, shape, size and density of their constituent elements. In terms of applications, metamaterials have phenomenal potential, in important areas, from energy to ICT, defence & security, aerospace, and healthcare. Numerous market research studies predict very significant growth over the next decade, for example, by 2030 the metamaterial device market is expected to reach a value of over $10bn (Lux Research 2019). The 'Metamaterials' topic is inherently interdisciplinary, spanning advanced materials (plasmonics, active materials, RF, high index contrast, 2D materials, phase change materials, transparent conductive oxides, soft materials), theoretical physics, quantum physics, chemistry, biology, engineering (mechanical and electrical), acoustics, computer sciences (e.g. artificial intelligence, high performance computing), and robotics. Historically, the UK has been a global leader in the field, with its roots in the work of radar engineers in the 2nd World War, and being reinvigorated by the research of some of our most eminent academics, including Professor Sir John Pendry. However today, it risks falling behind the curve. As a specific example, the Chinese government has funded the development of the world's first large-scale metamaterial fabrication facility, which has capacity to produce 100,000 m2 of metamaterial plates annually, with projects relating to aerospace, communication, satellite and military applications. The breadth of metamaterial research challenges is huge, from theory, fabrication, experiment, and requiring expertise in large-scale manufacturing and field testing for successful exploitation. We believe that the isolation of research groups and lack of platforms to exchange and develop ideas currently inhibits the UK's access to the interdisciplinary potential existing within our universities, industries, and governmental agencies. It is of the utmost importance to develop interactions and mobility between these communities, to enable knowledge transfer, innovation, and a greater understanding of the barriers and opportunities. The intervention that this Network will provide will ensure that the UK does not lag our international competitors. Via the Network's Special Interest Groups, Forums, National Symposia and other community-strengthening strategies, the enhanced collaboration will help resolve key interdisciplinary challenges and foster the required talent pipeline across academia and industry. As a result we will see an increase in research power for the metamaterials theme, and therefore reaping the impact opportunities of this area for UK economy and society. The Network's extensive promotion of the benefits of metamaterials technology (e.g., case studies, white papers etc), facilitation of access to metamaterial experts and facilities (through the online database) and closer interactions with end-users at appropriate events (e.g. industry-academia workshops) will help grow external investment in metamaterials research. Ultimately the Network will provide the stimulation of a discovery-innovation-enterprise cycle to meet desired outcomes for prosperity and consequentially, society, defence, and security.
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For further information contact us at helpdesk@openaire.euassignment_turned_in Project2023 - 2026Partners:PragmatIC Printing Ltd, PragmatIC Printing Ltd, PragmatIC (United Kingdom), University of OxfordPragmatIC Printing Ltd,PragmatIC Printing Ltd,PragmatIC (United Kingdom),University of OxfordFunder: UK Research and Innovation Project Code: EP/W034387/1Funder Contribution: 534,486 GBPIn the post-Moore's law era, innovative new technologies to accelerate scientific computing and memory devices are growing explosively, amongst which photonic memory devices have been attracting a great amount of interest and hold future promise for built-in, non-volatile memory with high density, fast switching, multifunctionality, low-energy consumption, and multilevel data storage compared to electronic memory devices. It is now timely to ensure that these new device concepts are developed alongside new sustainable processes - as it is in the introduction stage of new products that manufacturing processes can also be changed. Current manufacturing of high-resolution semiconductor devices primarily relies on photolithography as the patterning technique of choice. During the fabrication of these resist-based lithography techniques, development and lift-off steps utilize alkaline solutions and organic solvents as developers and removers. These are two of the main sources of hazardous chemical wastes . The US Environmental Protection Agency developed a waste management hierarchy, which states that the most preferred approach is source reduction and reuse, followed by recycling, energy recovery, treatment and disposal. Therefore, the development of a water-based manufacturing technique which limits the amount of hazardous chemicals at the source is essential to the minimization of chemical wastes. This will lead to higher resource efficiency and more efficient recycling and recovery of processing waste. That is precisely what this proposal will target. The vision is to develop facile, inexpensive, scalable solvent-free lithography for nanomanufacturing, which eliminates solvents in as many lithography processes as possible but doing this in a reliable and functionally enabling manner.
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