The goal of QuTechSpace is to push the development of key components for space quantum communication and to facilitate standardization of the technology. To this end, we will advance three core technology components: entangled photon source (EPS), prepare and measure (P&M) source, and the post-processing software for the QKD protocol. In particular, we will increase the performance parameters such as sending rates, reduce the size, weight, and power consumption (SWaP), and perform space qualification of hardware. The technology development will be accompanied by facilitating the standardization process of space quantum communication technologies and systems through active involvement in standardization bodies. By including European entities ranging from academics over new space companies and quantum technology developers to large system integrators, the joint European ecosystem will be included in the process and together we will work towards the joint goal of reaching European sovereignty in space quantum technologies. QuTechSpace will also take into account developments in the field of space quantum communication. The technology development will be completed through testing in relevant environment, reaching TRL 6. Furthermore, the different technology components will be tested together in an end-to-end implementation of the quantum chain in the laboratory, providing crucial insights into the heart of space-based quantum-communication systems. Finally, it is important to highlight that the developed components can be used for quantum key distribution as well as for realization of the quantum internet. QuTechSpace will conclude by giving an outlook and recommendations for future developments and implementations of quantum-communication systems.

Miniaturization, advanced high performance materials and functional surface structures are all drivers behind key enabling technologies in high added value production. It is in such areas that ultrashort pulse lasers have enabled completely new machining concepts, where the big advantages of laser machining are combined with a quasi non-thermal and therefore mild process, which can be used to machine any material with high precision. An important obstacle however that hinders the full exploitation of the unique process characteristics, is the lack of a smart / adaptive machining technology. The laser process in principle is very accurate, but small deviations, e.g. in the materials to be processed, can compromise the accuracy to a very large extend. Therefore feedback systems are needed to keep the process accurate. Within this project the goal is to develop an adaptive laser micromachining system, based on ultrashort pulsed laser ablation and a novel depth measurement sensor, together with advanced data analysis software and automated system calibration routines. The sensor can be used inline with the laser ablation process, enabling adaptive processes by fast and accurate 3D surface measurements. The integrated sensor can be used to: • measure the surface topography while machining a part, in order to adapt the micromachining process, leading to highly increased machining accuracies and no defects, • measure the surface topography before machining, to scan for existing surface defects that can be removed in an automatically generated machining process, • measure complex shaped objects prior to machining, to precisely align the machining pattern to the workpiece, • quickly validate results after machining. Therefore, the main objective of this project is to develop a sensor based adaptive micro machining system using ultra short pulsed lasers for zero failure manufacturing.

This project will research new technologies for CMOS image sensors that are needed in the next generation of several application domains. The image sensor research will focus on enhancing the capabilities of current imaging devices: • New design (architectures) and technology (e.g. 3D stacking) for better pixels (lower noise, higher dynamic range, new functionality within the pixel) and more pixels (higher spatial and temporal resolutions) at higher speed, time-of-flight pixels, local (on-chip) image processing, embedded CCD in CMOS TDI pixels. • Extended sensitivity and functionality of the pixels: extension into infrared, filters for hyper-and multi-spectral imaging, better colour filters, programmable filters with LCD cells. Application domains that will be covered are: • Digital Lifestyle: Broadcast, Digital Cinema & Entertainment, Smart home (Grass Valley, Angenieux, Silios, Delft University of Technology, SoftKinetic) • Smart Production (IMEC, C-cam) • High-end Security (Adimec, Angenieux, Le2i, TNO) • Agriculture and food sorting using hyper- and multi-spectral imaging and programmable filters (Silios, Le2i) • Medical healthcare: diagnostics using multi-/hyper-spectral imaging and programmable filters (Adimec, TNO, Silios, Quest and Focal) • Gas detection using multi spectral IR imagers (Sofradir) • Security: gas sensing (Sofradir) The prototype CMOS image sensors for several application domains will be demonstrated together with the sensor related processing.