
SLI Limited
SLI Limited
1 Projects, page 1 of 1
assignment_turned_in Project2008 - 2013Partners:Weidlinger Associates, Microstencil Ltd, Advanced Optical Technology, BAE Systems Avionics Management Ltd, Italian Institute of Technology +170 partnersWeidlinger Associates,Microstencil Ltd,Advanced Optical Technology,BAE Systems Avionics Management Ltd,Italian Institute of Technology,NCR Financial Solutions Ltd,University of Transylvania,Loadpoint Ltd,Virtual Interconnect Limited,BCF Designs Ltd,Reachin software,BCF Designs Ltd,IMEC - REALITY,Ituna Solutions Limited,Merlin Circuits,Airbus (Germany),IKEA Properties Investments Ltd,Merlin Circuits,MBDA (United Kingdom),IKEA Properties Investments Ltd,BAE Sytems Electronics Ltd,Kestrel 3D,Loadpoint (United Kingdom),BAE Systems (Sweden),Pathtrace Engineering Systems Ltd,SLI Limited,BAE Systems Avionics,Qioptiq Ltd,Transylvania University of Bra?ov,Microstencil Ltd,RENISHAW,OptoSci (United Kingdom),Weidlinger Associates (United States),Selex-Galileo,NTU,ROLLS-ROYCE PLC,Scotweave Ltd,Siemens (United Kingdom),BAE Systems Avionics Management Ltd,First Syngenta UIC,AWE Aldermaston,Cv FMC Technologies Ltd,Optocap Ltd,Bath Spa University,Silicon Graphics,Micro Circuit Engineering,Omnova Solutions,RENISHAW,IMEC - REALITY,The Mathworks Ltd,Heriot-Watt University,FMC Energy Systems,PowerPhotonic Ltd,Advanced Optical Technology,SLI Limited,QinetiQ (Malvern),Sun Microsystems,Qioptiq Ltd,BAE Systems Avionics Management Ltd,Rolls-Royce (United Kingdom),AIRBUS OPERATIONS LIMITED,Cv FMC Technologies Ltd,Kodak Ltd,J C Bamford Excavators (United Kingdom),3D Systems (United Kingdom),Mactaggart Scott & Co Ltd,The Mathworks Ltd,Agilent Technologies (United Kingdom),Reachin software,Mactaggart Scott & Co Ltd,Cv FMC Technologies Ltd,Roper Technologies (United Kingdom),Silicon Graphics,Virtual Interconnect Limited,Microstencil Ltd,Italian Institute of Technology,IKEA Properties Investments Ltd,Virtual Interconnect Limited,Selex-Galileo,University of Bath,Qinetiq (United Kingdom),LSTECH LTD,Airbus,Sira Ltd,PowerPhotonic Ltd,FMC Energy Systems,J C Bamford Excavators (United Kingdom),D-Cubed Ltd,Design LED,FMC Energy Systems,BAE Systems (Sweden),IMEC - REALITY,3D Systems Inc,Weidlinger Associates,Advanced Optical Technology,C A Models Ltd,Piezo Composite Transducers (PCT) Ltd,Raytheon (United Kingdom),BAE Systems Naval Ships,Micro Circuit Engineering,Sira Ltd,ModCell,Rolls-Royce (United Kingdom),MBDA UK Ltd,Sun Microsystems,Kestrel 3D,Heriot-Watt University,Agilent Technologies (United Kingdom),Pathtrace Engineering Systems Ltd,Lightworks Design Ltd,Rolls-Royce (United Kingdom),BAE Systems Advanced Technology Centre,NCR Financial Solutions Ltd,Rofin-Sinar UK Ltd,RSL,Piezo Composite Transducers (PCT) Ltd,Loadpoint Ltd,Rofin-Sinar UK Ltd,TechnipFMC (United Kingdom),Silicon Graphics,Agilent Technologies (United Kingdom),SLI Limited,Scotweave Ltd,Pathtrace Engineering Systems Ltd,AWE,Design LED,ModCell,Ituna Solutions Limited,University of Strathclyde,Exception PCB Ltd,D-Cubed Ltd,RSL,Sun Microsystems,BCF Designs Ltd,Ituna Solutions Limited,Optocap Ltd,J C Bamford Excavators (United Kingdom),Merlin Circuit Technology (United Kingdom),University of Strathclyde,D-Cubed Ltd,Airbus (United Kingdom),MBDA UK Ltd,Sira Ltd,University of Transylvania,Lightworks Design Ltd,Exception PCB Ltd,Reachin software,Piezo Composite Transducers (PCT) Ltd,IceRobotics Ltd,Exception PCB Ltd,Heidenhain (United Kingdom),Scotweave Ltd,Kodak Ltd,Syngenta Ltd,LSTECH LTD,Mactaggart Scott & Co Ltd,PowerPhotonic (United Kingdom),BAE Systems Advanced Technology Centre,Omnova Solutions,University of Nottingham,Syngenta Ltd,University of Bath,Renishaw Plc,Renishaw (United Kingdom),Omnova Solutions,BAE Systems (United Kingdom),Selex Sensors and Aiborne Systems Ltd,NCR Financial Solutions Ltd,Rofin (United Kingdom),Design LED,Heriot-Watt University,Generic Robotics (United Kingdom),Lightworks Design Ltd,Kodak (United Kingdom),Micro Circuit EngineeringFunder: UK Research and Innovation Project Code: EP/F02553X/1Funder Contribution: 7,146,840 GBPThe Scottish Manufacturing Institute aims to research technology for manufacture, addressing the requirements of European, UK and regional industries. It taps into the broad expanse of research at Heriot-Watt University to deliver innovative manufacturing technology solutions. The SMI delivers high quality research and education in innovative manufacturing technology for high value, lower volume, highly customised, and high IP content products that enable European and UK Manufacturers to compete in an environment of increased global competition, environmental concern, sustainability and regulation, where access to knowledge, skills and IP determine where manufacturing is located. Our mission is to deliver high impact research in innovative manufacturing technologies based on the multidisciplinary technology resource across Heriot-Watt University, the Edinburgh Research Partnership, the Scottish Universities Physics Alliance and beyond. The Institute is organised into three themes:- Digital Tools;- Photonics; and - MicrosystemsThe vision of the Digital Tools Theme is to provide tomorrow's engineers with tools that will help them to easily capture, locate, exploit and manipulate 3D information for mechanical products of all kinds using distributed, networked resources. Photonics has strong resonance with the needs of developed economies to compete in the 21st Century global market for manufacturing, providing: routes to low cost automated manufacture; and the key processes underpinning high added value products. We have a shared conviction that photonics technologies are an essential component of any credible strategy for knowledge-based industrial production. The Photonics Theme vision is for the SMI to be internationally recognised as the leading UK focus for industrially-relevant photonics R&D, delivering a mix of academic and commercial outputs in hardware, process technology and production applications.The principal strategy of the Microsystems Theme is to research into new integration and packaging solutions of MEMS that are low cost, mass manufacturable and easily adoptable by the industry. The vision is to become a European Centre of Excellence in MEMS integration and packaging over the next 5 years. We thus aspire to service UK manufacturing industry with innovative technology for high value, lower volume, highly customised, and high IP content products; and to help UK industry expand globally in an internationally competitive market.
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