
BCF Designs Ltd
BCF Designs Ltd
1 Projects, page 1 of 1
assignment_turned_in Project2008 - 2013Partners:University of Strathclyde, IMEC - REALITY, Roper Technologies (United Kingdom), NCR Financial Solutions Ltd, PowerPhotonic (United Kingdom) +170 partnersUniversity of Strathclyde,IMEC - REALITY,Roper Technologies (United Kingdom),NCR Financial Solutions Ltd,PowerPhotonic (United Kingdom),IKEA Properties Investments Ltd,Loadpoint (United Kingdom),OptoSci (United Kingdom),ROLLS-ROYCE PLC,Scotweave Ltd,University of Bath,Selex-Galileo,Ituna Solutions Limited,BAE Systems (Sweden),Lightworks Design Ltd,Rofin-Sinar UK Ltd,Pathtrace Engineering Systems Ltd,Ituna Solutions Limited,BAE Systems (United Kingdom),Airbus (United Kingdom),BAE Systems Avionics Management Ltd,Sira Ltd,Selex-Galileo,3D Systems (United Kingdom),Design LED,Silicon Graphics,SLI Limited,MBDA UK Ltd,Generic Robotics (United Kingdom),Agilent Technologies (United Kingdom),Design LED,FMC Energy Systems,Weidlinger Associates,Raytheon (United Kingdom),BAE Systems Naval Ships,Ituna Solutions Limited,University of Transylvania,Weidlinger Associates,Heriot-Watt University,IceRobotics Ltd,D-Cubed Ltd,Piezo Composite Transducers (PCT) Ltd,IMEC - REALITY,Omnova Solutions,Silicon Graphics,Cv FMC Technologies Ltd,BAE Sytems Electronics Ltd,Kestrel 3D,NCR Financial Solutions Ltd,Rolls-Royce (United Kingdom),C A Models Ltd,Advanced Optical Technology,Kodak (United Kingdom),Qioptiq Ltd,Merlin Circuits,Kodak Ltd,Reachin software,IKEA Properties Investments Ltd,Design LED,Piezo Composite Transducers (PCT) Ltd,RSL,PowerPhotonic Ltd,Piezo Composite Transducers (PCT) Ltd,D-Cubed Ltd,BCF Designs Ltd,BCF Designs Ltd,Virtual Interconnect Limited,BAE Systems Advanced Technology Centre,Rolls-Royce (United Kingdom),Exception PCB Ltd,Advanced Optical Technology,Omnova Solutions,Heidenhain (United Kingdom),Agilent Technologies (United Kingdom),NCR Financial Solutions Ltd,Sun Microsystems,MBDA UK Ltd,QinetiQ (Malvern),University of Strathclyde,Agilent Technologies (United Kingdom),SLI Limited,Lightworks Design Ltd,NTU,Italian Institute of Technology,University of Bath,The Mathworks Ltd,Exception PCB Ltd,BAE Systems Advanced Technology Centre,Reachin software,TechnipFMC (United Kingdom),RSL,J C Bamford Excavators (United Kingdom),SLI Limited,Kestrel 3D,Siemens (United Kingdom),Mactaggart Scott & Co Ltd,Pathtrace Engineering Systems Ltd,Rofin-Sinar UK Ltd,3D Systems Inc,Heriot-Watt University,Loadpoint Ltd,ModCell,Syngenta Ltd,Virtual Interconnect Limited,ModCell,LSTECH LTD,LSTECH LTD,Merlin Circuit Technology (United Kingdom),University of Nottingham,Sun Microsystems,Qinetiq (United Kingdom),Reachin software,J C Bamford Excavators (United Kingdom),MBDA (United Kingdom),RENISHAW,Loadpoint Ltd,Microstencil Ltd,Selex Sensors and Aiborne Systems Ltd,Transylvania University of Bra?ov,Microstencil Ltd,Rolls-Royce (United Kingdom),Cv FMC Technologies Ltd,Micro Circuit Engineering,Syngenta Ltd,Mactaggart Scott & Co Ltd,AWE,Advanced Optical Technology,Weidlinger Associates (United States),BAE Systems Avionics Management Ltd,Renishaw Plc,AIRBUS OPERATIONS LIMITED,Scotweave Ltd,Airbus,Mactaggart Scott & Co Ltd,Omnova Solutions,Heriot-Watt University,University of Transylvania,AWE Aldermaston,BCF Designs Ltd,Lightworks Design Ltd,IKEA Properties Investments Ltd,Italian Institute of Technology,FMC Energy Systems,Sira Ltd,PowerPhotonic Ltd,Micro Circuit Engineering,Rofin (United Kingdom),Optocap Ltd,BAE Systems Avionics Management Ltd,Optocap Ltd,Cv FMC Technologies Ltd,RENISHAW,First Syngenta UIC,FMC Energy Systems,BAE Systems Avionics,Sun Microsystems,J C Bamford Excavators (United Kingdom),Qioptiq Ltd,Bath Spa University,The Mathworks Ltd,Renishaw (United Kingdom),Scotweave Ltd,Silicon Graphics,Sira Ltd,Pathtrace Engineering Systems Ltd,D-Cubed Ltd,Merlin Circuits,Airbus (Germany),Exception PCB Ltd,Kodak Ltd,BAE Systems (Sweden),Microstencil Ltd,Virtual Interconnect Limited,IMEC - REALITY,Micro Circuit EngineeringFunder: UK Research and Innovation Project Code: EP/F02553X/1Funder Contribution: 7,146,840 GBPThe Scottish Manufacturing Institute aims to research technology for manufacture, addressing the requirements of European, UK and regional industries. It taps into the broad expanse of research at Heriot-Watt University to deliver innovative manufacturing technology solutions. The SMI delivers high quality research and education in innovative manufacturing technology for high value, lower volume, highly customised, and high IP content products that enable European and UK Manufacturers to compete in an environment of increased global competition, environmental concern, sustainability and regulation, where access to knowledge, skills and IP determine where manufacturing is located. Our mission is to deliver high impact research in innovative manufacturing technologies based on the multidisciplinary technology resource across Heriot-Watt University, the Edinburgh Research Partnership, the Scottish Universities Physics Alliance and beyond. The Institute is organised into three themes:- Digital Tools;- Photonics; and - MicrosystemsThe vision of the Digital Tools Theme is to provide tomorrow's engineers with tools that will help them to easily capture, locate, exploit and manipulate 3D information for mechanical products of all kinds using distributed, networked resources. Photonics has strong resonance with the needs of developed economies to compete in the 21st Century global market for manufacturing, providing: routes to low cost automated manufacture; and the key processes underpinning high added value products. We have a shared conviction that photonics technologies are an essential component of any credible strategy for knowledge-based industrial production. The Photonics Theme vision is for the SMI to be internationally recognised as the leading UK focus for industrially-relevant photonics R&D, delivering a mix of academic and commercial outputs in hardware, process technology and production applications.The principal strategy of the Microsystems Theme is to research into new integration and packaging solutions of MEMS that are low cost, mass manufacturable and easily adoptable by the industry. The vision is to become a European Centre of Excellence in MEMS integration and packaging over the next 5 years. We thus aspire to service UK manufacturing industry with innovative technology for high value, lower volume, highly customised, and high IP content products; and to help UK industry expand globally in an internationally competitive market.
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