
NXP (Netherlands)
NXP (Netherlands)
Funder
103 Projects, page 1 of 21
Open Access Mandate for Publications and Research data assignment_turned_in Project2025 - 2028Partners:SCREEN SPE GERMANY GMBH, Robert Bosch (Germany), PICOSUN OY, SOITEC, THERMO ONIX LTD +48 partnersSCREEN SPE GERMANY GMBH,Robert Bosch (Germany),PICOSUN OY,SOITEC,THERMO ONIX LTD,Mersen (France),STMicroelectronics (Switzerland),FHG,CENTROTHERM CLEAN SOLUTIONS GMBH,University of Catania,University of Leicester,University of Malta,ICRA,Arkema (France),GASERA,MOLYMEM LIMITED,CEA,FEI,AALTO,TEKNOLOGIAN TUTKIMUSKESKUS VTT OY,AIXTRON SE,CS CLEAN SOLUTIONS GmbH,TOKYO ELECTRON EUROPE LIMITED,VARIOLYTICS GMBH,ISL,THERMO FISHER SCIENTIFIC (BREMEN) GMBH,UCC,HQ-Dielectrics (Germany),LAYERONE AS,UCL,WEEECYCLING,MERCK ELECTRONICS KGAA,Pfeiffer Vacuum (France),Polytechnic University of Milan,LEONARDO,Infineon Technologies (Germany),University of Rome Tor Vergata,NXP (Netherlands),EDWARDS LTD,SEMI Europe,IMEC,PIBOND,Pfeiffer Vacuum (Germany),STM CROLLES,ST,SINTEF AS,STMicroelectronics (Malta),SCHMIDT + HAENSCH GMBH & CO,FATH GMBH,TechnipFMC (France),Besi Netherlands BV,VOCSENS,TNOFunder: European Commission Project Code: 101194246Overall Budget: 46,626,100 EURFunder Contribution: 13,965,000 EURGENESIS, backed by Horizon Europe, aims to make semiconductor manufacturing sustainable, aligning with the European Green Deal, by minimizing environmental impact with eco-friendly innovations. [Objectives] GENESIS aims to replace harmful materials with safer options, improve waste management, and enhance the use and recyclability of scarce materials. [Innovations] GENESIS introduces innovations in three key areas: • Innovative materials: PFAS-free polymer and eco-friendly gas alternatives complying with EU regulations. • Waste & emissions monitoring: Cutting-edge sensors detect hazardous substances for efficient aqueous and gas waste elimination, reducing environmental and health risks. • Scarce material management: New integration technologies optimize material usage and initiate recycling of scarce materials like Gallium, Niobium, and silicon carbide. [Methodology] GENESIS employs four technical work packages to research sustainable material substitution, emission reduction, and resource management. This modular approach promotes scalability and integration with existing processes, fostering a circular economy in the semiconductor sector. Supervised by management work packages, it quantifies environmental efficiency and engages in dissemination to promote European technological achievements [Outcomes] The project targets a 50% cut in hazardous materials, 30% decrease in emissions and waste, and improved scarce material recyclability, boosting EU semiconductor sustainability and global competitiveness. [Impact] GENESIS supports EU's tech sovereignty and resilience through accurate monitoring and sustainable practices. It positions Europe as a leader in sustainable semiconductor tech, setting new standards for impact-oriented communication and dissemination.
more_vert Open Access Mandate for Publications and Research data assignment_turned_in Project2022 - 2026Partners:IUR, Axelera AI, TU Delft, CAIRNE, GN STORE NORD +11 partnersIUR,Axelera AI,TU Delft,CAIRNE,GN STORE NORD,TAS-E,KUL,RUB,University of Murcia,Robert Bosch (Germany),TU/e,VINOTION BV,NXP (Netherlands),ICCS,COGNITIVEIC B.V.,NXP (Germany)Funder: European Commission Project Code: 101070374Overall Budget: 8,418,130 EURFunder Contribution: 8,416,880 EURWith the rise of deep learning (DL), our world braces for Artificial Intelligence (AI) in every edge device, creating an urgent need for edge-AI processing hardware. Unlike existing solutions, this hardware needs to support high throughput, reliable, and secure AI processing at ultra-low power (ULP), with a very short time to market. With its strong legacy in edge solutions and open processing platforms, the EU is ideally positioned to become the leader in this edge-AI market. However, certain roadblocks keep the EU from assuming this leadership role: Edge processors need to become 100x more energy efficient; Their complexity demands automated design with 10x design time reduction; They must be secure and reliable to get accepted; Finally, they should be flexible and powerful to support the DL domain. CONVOLVE addresses these roadblocks and thereby enables EU leadership in Edge-AI. To that end, it will take a holistic approach with innovations at all design stack levels, including: 1.ULP memristive circuits for computation-in-memory 2.Fast compositional design of System-on-Chips (SoC) 3.Transparent compilers supporting automated code optimizations and domain-specific languages 4.Rethinking DL models through dynamic neural networks, event-based execution, and sparsity 5.On-edge continuous learning for improved accuracy, self-healing, and reliable adaptation to non-stationary environments 6.Holistic integration in SoCs supporting secure execution with real-time guarantees The CONVOLVE consortium includes some of Europe's strongest research groups and industries, covering the whole design stack and value chain. In a community effort, we will demonstrate Edge-AI computing in real-life vision and audio domains. By combining these innovative ULP and fast design solutions, CONVOLVE will, for the first time, enable reliable, smart, and energy-efficient edge-AI devices at a rapid time-to-market and low cost, and as such open the road for EU leadership in edge-processing.
more_vert assignment_turned_in Project2009 - 2011Partners:National Centre of Scientific Research Demokritos, VOLVO TECHNOLOGY AB, FOUNDATION FOR RESEARCH AND TECHNOLOGYHELLAS, THETAMETRI, BTE +15 partnersNational Centre of Scientific Research Demokritos,VOLVO TECHNOLOGY AB,FOUNDATION FOR RESEARCH AND TECHNOLOGYHELLAS,THETAMETRI,BTE,Optronic,INESC TEC,IPD,NXP (Netherlands),INESC ID,WESZTA-T,BHE KFT BH,RISE,M2i,INSTITUTUL NATIONAL DE CERCETAREDEZVOLTARE PENTRU MICROTEHNOLOGIE,BUTE,TNO,RESEARCH CENTRE FOR NATURAL SCIENCES,Wrocław University of Science and Technology,AMEPOXFunder: European Commission Project Code: 120009more_vert assignment_turned_in Project2010 - 2013Partners:ORANGE SA, Graz University of Technology, NXP, NXP (Germany), IHP GMBH +5 partnersORANGE SA,Graz University of Technology,NXP,NXP (Germany),IHP GMBH,NXP (Netherlands),UCL,EPFZ,EURECOM,COALESENSESFunder: European Commission Project Code: 258754more_vert assignment_turned_in Project2013 - 2017Partners:CIT, EQUA Simulation (Sweden), University of La Rochelle, Schneider Electric (France), TUD +13 partnersCIT,EQUA Simulation (Sweden),University of La Rochelle,Schneider Electric (France),TUD,CITTA DI TORINO,TBC,TEKEVER,POLITO,NXP (Netherlands),CSEM,IBM (United States),IREC,TBC Innovations (France),ZEDFACTORY,Agglomeration Community of La Rochelle,AMIRES SRO,IBM (Ireland)Funder: European Commission Project Code: 608790more_vert
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6 Organizations, page 1 of 1
corporate_fare Organization GermanyWebsite URL: https://www.nxp.com/more_vert corporate_fare Organization BelgiumWebsite URL: http://www.nxp.com/more_vert corporate_fare Organization United StatesWebsite URL: http://www.nxp.com/more_vert corporate_fare Organization Francemore_vert corporate_fare Organization United KingdomWebsite URL: https://www.nxp.commore_vert corporate_fare Organization Czech Republicmore_vert