This project involves the high energy Physics (HEP) group of the University of Liverpool and Micron Semiconductor (UK) Ltd as the industrial partner. The Liverpool group has a world recognised track record in R&D, assembly and commissioning of silicon detectors for HEP experiments. Micron Semiconductor LTd is a leading supplier of silicon detectors to particle physics experiments, having a long track record dating from fixed target programmes, to LEP, Tevatron, PEP-II, HERA and the LHC. However, Micron have diversified into work for space (with contracts with NASA,in USA and JAXA in Japan), defence, nuclear and medical applications with particle physics representing only about 20% of current orders. However, the development of new technology and techniques for these other areas has historically always taken place in the context of meeting the challenges of particle physics and the current programme represents an excellent opportunity for both the company and the student. The over 15 years long collaboration between Micron and the University of Liverpool has lead to the production of extremely successful silicon sensors for HEP experiments like CDF at Tevatron-FNAL, DELPHI at CERN-LEP, ATLAS and LHCb at the CERN-LHC. It is worth noting that the first p-type sensors, leading to the development for the n-in-p technology now the default for sLHC, grew out of a CASE studentship between Liverpool and Micron, for which the student, Moshe Hanlon, won the Rutherglen Prize for his PhD. thesis research. The work will focus on the optimisation of the design and processing parameters of silicon detectors to operate in a controlled charge multiplication regime by mean of the shaping of the electric field at the junction side. In the first phase (a) of the project the student will perform2-d and 3-d device simulations of the, using TCAD and/or custom made charge transport models. A model of the radiation damaged silicon will be implemented by the student using the existing literature and the experimental data accumulated by the group. The performance of irradiated silicon is a subject of high interest to both industry and academy, and the ability to access a substantial amount of experimental data to compare to the simulations, with the deep understanding of the tested devices coming from the collaboration with the specialised industrial partner makes a unique working environment likely to lead to publishable results and to enhanced manufacturing methods. The student will design the photolithography mask set using a state of the art package that will be adopted by the industrial partner for processing the novel devices. Pad diodes, microstrip detectors, pixels and various test structures for process control and optimisation will be designed (phase (b)) and produced. Both task (a) and (b) will be performed at the University of Liverpool during the first semester of the thesis. The following phase (c) will start on the 2nd semester and will involve close collaboration with the company to learn the processing parameters that can be tuned for a fine shaping of the junction. The production of a first set of wafers (10-15) will be based on intuitive modifications (in the opposite directions of a steeper and smoother profile) of the current processing parameters to explore more extreme junction geometries (step or diffused junction) and their performance after irradiation. The first processed detectors can be expected within the 1st semester of the 2nd year, with measurements (performed by the student under the initial guidance of the supervisor) taking place within the end of the same year. This allows for feedback from the measurement to correct the processing parameters, verify and improve the simulation with information from measured data. The finally optimised geometries will be processed and characterised in the last year, with fine tuning of the parameters.

Silicon sensors are essential in a range of fields, from cutting-edge research (e.g. particle physics, chemistry, materials science) to industry (agriculture, manufacturing), and everyday devices (cameras, security). They are the eyes of our electronic world. As we develop more precise sensors, for example cameras with smaller pixels, the potential reach of these devices increases, allowing more processes to be investigated, and with more detail. Currently the resolution of such sensors is at the micrometre level. However, the time precision is relatively much worse, due to significant technological challenges in assigning times to the signals in the silicon. The best precision for small-pixel silicon sensors is at the nanosecond (ns) level. By comparison, light travels 300,000 micrometre per ns. Our ability to observe many processes is significantly hampered by limitations in time precision. For fast (~1ns duration) processes, adding picosecond-level (1ps = 0.001ns) timing to micrometre-level spatial measurements effectively corresponds to the difference between still images and video, and hence has the potential to open up entire new fields of research. Such processes occur, for example, in particle and nuclear physics, chemistry, and materials science. The ultimate aim of this project is to develop sensors that for the first time simultaneously reach precision at the micrometre-level in space, and picosecond-level in time: a high-speed video camera for the smallest observable scales. We start from a new type of sensor only developed in the past decade: Low Gain Avalanche Detectors (LGAD). By adding specially-treated semiconductor layers to the silicon, the time of signal collection is significantly reduced, making it possible to reach ~30ps precision. However, the only devices so far developed have large (mm-size) pads rather than pixels. Our programme of research will focus on ways to transform these devices into pixel sensors, by considering new geometries and doping approaches, and thin sensors. The key is to maintain as uniform an electric field as possible within the pixel, to ensure fast signal development. We have started preliminary studies, including fabrication of prototype devices, and now we are ready to push forward with an aggressive research and development phase. Researchers from the Universities of Glasgow and Manchester will work with a commercial semiconductor manufacturer (Micron) to design and fabricate a range of new LGAD sensors, and analyse their performance using several high-tech methods ('transient current technique' - TCT and 'two photon absorption' - TPA). In parallel, we will develop realistic simulations of the detectors using TCAD models, to predict the sensor characteristics under different designs. These simulations will be validated using the TCT and TPA results from our measurements. All of our results will be published in open-access journals, taking us a step closer to the dream of '4D' precision sensors. In parallel, we will develop a network of potential beneficiaries of these new devices, in particular for the fields of materials science and proton therapy. We have already established connections with representatives within these areas, who will help us to build the network, starting with two dedicated workshops. These will be used to build a specifications document where the required technology performances are defined. They will also enable us to reach further to identify more potential users of this new technology, in the UK and beyond.

The total EU electronics industry employs ≈20.5 million people, sales exceeding €1 trillion and includes 396,000 SMEs. It is a major contributor to EU GDP and its size continues to grow fueled by demand from consumers to many industries. Despite its many positive impacts, the industry also faces some challenges connected with the enormous quantity of raw materials that it needs for sustainability, the huge quantity of Waste Electrical, Electronics Equipment (WEEE) generated and the threat of competition from Asia. To sustain its growth, to manage the impact of WEEE and to face the competition from Asia, the industry needs innovations in key areas. One such area is the drive for ultra-miniaturisation/ultlra-functionality of equipment. The key current road block/limitation to achieving the goal of ultra-miniaturisation/functionality is how to increase the component density on the printed circuit board (PCB). This is currently limited by the availability of hyper fine pitch solder powder pastes. FineSol aims to deliver at first stage an integrated production line for solder particles with size 1-10 μm and to formulate solder pastes containing these particles. Thus, by proper printing methods (e.g. screen and jet printing) the fabrication of PCBs with more than double component density will be achieved. Consequently, this would effectively enable more than a doubling of the functions available on electronic devices such as cell phones, satellite navigation systems, health devices etc. The successful completion of the FineSol project would lift the ultra-miniaturisation/functionality road block and also enable reduction in raw material usage, reduction in WEEE, reduction in pollution and associated health costs and also a major reduction in EU energy demand with all its indirect benefits for environment and society.

The rationale for Medtronic and partners to propose the InSiDe project is the unmet need of the medical community for reliable, non-invasive, cheap and easy-to-use tools able to identify and characterize different stages of cardiovascular diseases. Solving this need ensures the early adoption of the appropriate therapies, dramatically reduces healthcare costs and importantly, improves patient outcome. In fact, monitoring arterial stiffness by measurement of the aortic pulse wave velocity has been demonstrated to be a crucial need for the management of hypertensive patients and it is recommended in the European Society of Cardiology Guidelines. In addition, the early identification of arterial stenosis and cardiac contraction abnormalities can be used to drive earlier therapy adoption and to improve patient’s response in cardiac (valvular) disease. Building on the realizations of the successful CARDIS (H2020-ICT-644798) project, the objective of InSiDe is to accelerate access to a new diagnostic device, based on silicon photonics technology, able to monitor cardiovascular diseases and to prove its efficacy in driving a timely therapy institution and its related follow-up. We will: -Develop an efficient miniaturized laser Doppler interferometer supported by a manufacturable package with integrated imaging optics and by electronics for control of the laser interferometer with onboard near-real time signal processing capability. -Develop algorithms for translation of the interferometer signals to beat-to-beat measurement results relevant for monitoring and diagnosis of selected cardiovascular parameters. -Prove the device efficacy in multiple clinical feasibility studies inside and outside the consortium. -Outline a path to industrialization and manufacturability. In this way InSiDe will realize a low-cost handheld, robust diagnostic tool, manufacturable in high-volumes. The diagnostic tool gives immediate results for physician’s interpretation.

Chronic wounds represent a significant burden to patients, health care professionals, and health care systems, affecting over 40 million patients and creating costs of approximately 40 billion € annually. Goal of the project is the fabrication of a medical device for professional wound care. The device will use recently proven therapeutic effects of visible light to enhance the self-healing process and monitor the status and history of the wound during therapy. Light exposure in the red part of the spectrum (620-750nm) induces growth of keratinocytes and fibroblasts in deeper layers of the skin. The blue part of the spectrum (450–495nm) is known to have antibacterial effects predominantly at the surface layers of the skin. In order to be compliant with hygiene requirements the system will consist of two parts: 1. a disposable wound dressing with embedded optical waveguides and integrated sensors for the delivery of light and monitoring (temperature and blood oxygen) of the wound. 2. a soft and compliant electronic module for multiple use containing LEDs, a photodiode, a controller, analog data acquisition, a rechargeable battery, and a data transmission unit. Both parts of the device will be interconnected by a mechanically robust plug, enabling a low loss coupling of light into the waveguide structures and electrical interconnection to the sensors. The status of the wound will be monitored with temporal and low level spatial resolution. The electronic module will be optimized for functionality and user comfort, combining leading edge heterogeneous integration technologies (PCB embedding) and stretchable electronics approaches. The detailed effects of light-exposure schemes will be explored and backed by in-vitro and in-vivo animal studies. Results will be used to develop smart algorithms and implement it into respective programs and feedback loops of the device.