
IMA
43 Projects, page 1 of 9
Open Access Mandate for Publications and Research data assignment_turned_in Project2023 - 2026Partners:TU Darmstadt, PATH MEDICAL GMBH, SONION NEDERLAND B.V., CAS, HSG-IMIT +48 partnersTU Darmstadt,PATH MEDICAL GMBH,SONION NEDERLAND B.V.,CAS,HSG-IMIT,FORKBEARD AS,CODASIP GMBH,NEOS NEW BORN SOLUTIONS SL,LAM RESEARCH INTERNATIONAL BV,INOSON GMBH,TUM,University of Twente,CSIC,GE HEALTHCARE AUSTRIA GMBH & CO OG,PULSIFY MEDICAL,SNO,BUT,SNO,UTIA,IFD,CODASIP GMBH,Solmates,IMA,Infineon Technologies (Austria),SINTEF AS,SINTEF AS,IMA,POLICLINICA SMD,UTIA,INOSON GMBH,IMEC,POLICLINICA SMD,IMEC,Infineon Technologies (Austria),SAL,Solmates,DASEL,FORKBEARD AS,NEOS NEW BORN SOLUTIONS SL,Infineon Technologies (Germany),Infineon Technologies (Germany),UGR,SONION NEDERLAND B.V.,DASEL,ELLIPTIC LABORATORIES ASA,LAM RESEARCH INTERNATIONAL BV,HSG-IMIT,PATH MEDICAL GMBH,GE HEALTHCARE AUSTRIA GMBH & CO OG,ELLIPTIC LABORATORIES ASA,PULSIFY MEDICAL,SAL,IFDFunder: European Commission Project Code: 101096884Overall Budget: 29,429,700 EURFunder Contribution: 9,145,620 EURListen2Future will boost the potential of piezoelectric acoustic transducers to provide new solutions in the key application areas of Health & Wellbeing and Digital Industry & Energy. Acoustic transducer solutions and the key underlying technologies are addressing many of the challenges in emerging applications towards a more digitalized society. Indeed, growing demand for MEMS-based acoustic transducers (microphones, ultrasonic transducers) in medical and industrial devices are creating a new high demand for miniaturized low power sensors. In combination with an intelligent signal processing system, algorithms and customized packaging, these technologies will be the key to achieve performant, low power consuming, miniaturized and cost-saving systems. The demonstrators will address 14 use-cases in LISTEN2FUTURE with their benchmark in low power consumption, small size and low cost to open the door for disruptive acoustic applications. Major impact on quality of live for humans as well as on industrial and medical appliances can be expected. The European Position in Acoustic Sensors will be therefore strengthened by new piezoelectric materials and technologies with the capability to outperform the existing ones that are based on capacitive MEMS technologies. This will contribute to reinforcing the Union's strategic autonomy in electronic components and systems to support future needs of vertical industries and the economy at large. The growth of the microphone market (8 -> 14bio. units in 5 years) and the growth of the Ultrasound sensing modules market (500mio -> 800mio in 3 years) should be predominantly covered with acoustic sensors made in Europe. The double transition of European Union toward digital and greener society there poses a high demand for reliable and secure data. Our integral acoustic sensor solutions are listening to these needs and mapping the acoustic senses and perceptions into Society 5.0.
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For further information contact us at helpdesk@openaire.euOpen Access Mandate for Publications assignment_turned_in Project2019 - 2022Partners:NXP (Netherlands), PHILIPS ELECTRONICS NEDERLAND B.V., FORD OTOMOTIV SANAYI ANONIM SIRKETI, VALOSSA LABS OY, Infineon Technologies (Austria) +81 partnersNXP (Netherlands),PHILIPS ELECTRONICS NEDERLAND B.V.,FORD OTOMOTIV SANAYI ANONIM SIRKETI,VALOSSA LABS OY,Infineon Technologies (Austria),POLITO,SMART PHOTONICS BV,TEKNOLOGIAN TUTKIMUSKESKUS VTT OY,CSIC,BiFAST,BYLOGIX,IOTAM INTERNET OF THINGS APPLICATIONS AND MULTI LAYER DEVELOPMENT LTD,AVIONTEK GMBH,Infineon Technologies (Austria),FORD OTOMOTIV SANAYI ANONIM SIRKETI,TTTECH AUTO AG,BiFAST,TU/e,University of Freiburg,AMBER NEDERLAND BV,AVL,IMA,TUM,AALTO,BUT,UNIMORE,AMBER NEDERLAND BV,AVIONTEK GMBH,BMW GROUP,Okmetic,NXP (Germany),UniPi,BYLOGIX,IMA,TEKNOLOGIAN TUTKIMUSKESKUS VTT OY,IDEAS & MOTION SRL,4S srl,NXP (Germany),PSA ID,FHG,THE REUSE COMPANY,THALES,SMART PHOTONICS BV,MARELLI EUROPE SPA,IDNEO,UAB TERAGLOBUS,DANISI ENGINEERING SRL,TTTECH AUTO AG,Infineon Technologies (Germany),HABITUS RESEARCH,MURATA ELECTRONICS OY,Infineon Technologies (Germany),UNIKIE,IDEAS & MOTION SRL,BMW (Germany),THE REUSE COMPANY,Fortiss,TAMPERE UNIVERSITY,FLASH BATTERY SRL,VIF,UAB TERAGLOBUS,IOTAM INTERNET OF THINGS APPLICATIONS AND MULTI LAYER DEVELOPMENT LTD,4S srl,AVL,Innoluce,TNO,VUB,DANISI ENGINEERING SRL,IDNEO,HABITUS RESEARCH,Okmetic,TNO,Murata (Finland),UNIKIE,Carlos III University of Madrid,THALES,PHILIPS ELECTRONICS NEDERLAND B.V.,VIF,Innoluce,VALOSSA LABS OY,XENOMATIX,MAGNETI MARELLI S.P.A.,XENOMATIX,NXP (Netherlands),TU Delft,FortissFunder: European Commission Project Code: 826653Overall Budget: 37,858,600 EURFunder Contribution: 11,090,600 EURNewControl will develop virtualized platforms for vehicular subsystems that are essential to highly automated driving (realizing functions such as perception, cognition and control), so as to enable mobility-as-a-service for next generation highly automated vehicles. Its overarching goal is to provide an industrially calibrated trajectory towards increased user-acceptance of automated control functions, through an approach that is centered on the premise of safety by design. Newcontrol will deliver: 1. Fail-operational platform for robust holistic perception through a combination of Lidar, Radar, and sensor fusion 2. Generalized virtual platform for stable and efficient control of propulsion systems 3. Cost- and power-efficient, high-performance embedded compute-platforms for in-vehicle perception, cognition, and control 4. Robust approaches for implementing, verifying, and certifying automated control for safety-critical applications Several (12) demonstrators will be built to showcase the project’s findings and their capability to facilitate perception, cognition and control of next generation highly automated vehicles. The developments in NewControl will facilitate significant cost reductions for essential modules necessary for future automated vehicles. Concomitantly, these developments will improve the safety and reliability of automated systems to levels necessary for mass-market deployment. These innovations will leverage the expertise of industrial (OEMs, Tier-1, Tier-2 and technology providers) and research partners along the complete semiconductor, automotive, and aviation value chains, providing Europe with a competitive edge in a growing market. Importantly, NewControl's innovations will improve the market penetration of safety-centric automation systems, contributing directly to the European goal of zero road fatalities by 2050.
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For further information contact us at helpdesk@openaire.euOpen Access Mandate for Publications assignment_turned_in Project2016 - 2020Partners:GAS NATURAL, NORDSON DIMA, UNIVERSITE DE TOURS, SORIN GROUP, GN RESOUND +65 partnersGAS NATURAL,NORDSON DIMA,UNIVERSITE DE TOURS,SORIN GROUP,GN RESOUND,SOLEMS,Henkel Electronic Materials (Belgium) NV,SKF,O-FLEXX TECHNOLOGIES GMBH,CAIRDAC,OJMAR S.A.,NORDSON BV,IMA,UL,SKF (France),CAIRDAC,FHG,Von Ardenne (Germany),EDITAG,ST-CZ,OPHTIMALIA,ST TOURS,GEMALTO,SOLEMS,LETI,ALPWISE,Evalan,NORDSON DIMA,Maastricht Instruments BV,SKF,ST-CZ,AIRBUS DEFENCE AND SPACE GMBH,BASF Schweiz AG,ENERBEE,CSIC,GN RESOUND,SKF (France),GAS NATURAL,Maastricht Instruments,ALPWISE,PRAYON S.A,BLUMORPHO,MEYER BURGER (NETHERLANDS) BV,TNO,IMA,Von Ardenne (Germany),IDNEO,Evalan,ValoTec,SORIN GROUP,TNO,APPLIED MATERIALS,APPLIED MATERIALS GMBH,UM,ST TOURS,Henkel Electronic Materials (Belgium) NV,MEYER BURGER (NETHERLANDS) BV,OPHTIMALIA,PRAYON S.A,AED,AIRBUS DEFENCE AND SPACE GMBH,ValoTec,OJMAR S.A.,EDITAG,IDNEO,ULiège,BASF Schweiz AG,NORDSON BV,ČVUT,ENERBEEFunder: European Commission Project Code: 692482Overall Budget: 64,564,300 EURFunder Contribution: 16,677,300 EURThe goal of EnSO is to develop and consolidate a unique European ecosystem in the field of autonomous micro energy sources (AMES) supporting Electronic European industry to develop innovative products, in particular in IoT markets. In summary, EnSO multi-KET objectives are: • Objective 1: demonstrate the competitiveness of EnSO energy solutions of the targeted Smart Society, Smart Health, and Smart Energy key applications • Objective 2: disseminate EnSO energy solutions to foster the take-up of emerging markets. • Objective 3: develop high reliability assembly technologies of shapeable micro batteries, energy harvester and power management building blocks • Objective 4: Develop and demonstrate high density, low profile, shapeable, long life time, rechargeable micro battery product family. • Objective 5: develop customizable smart recharge and energy harvesting enabling technologies for Autonomous Micro Energy Source “AMES”. • Objective 6: demonstrate EnSO Pilot Line capability and investigate and assess the upscale of AMES manufacturing for competitive very high volume production. EnSO will bring to market innovative energy solutions inducing definitive differentiation to the electronic smart systems. Generic building block technologies will be customizable. EnSO manufacturing challenges will develop high throughput processes. The ENSo ecosystem will involve all the value chain from key materials and tools to many demonstrators in different fields of application. EnSO work scope addresses the market replication, demonstration and technological introduction activities of ECSEL Innovation Action work program. EnSO relates to several of the Strategic Thrusts of ECSEL MASP. EnSO innovations in terms of advanced materials, advanced equipment and multi-physics co-design of heterogeneous smart systems will contribute to the Semiconductor Process, Equipment and Materials thrust. The AMES will be a key enabling technology of Smart Energy key applications.
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For further information contact us at helpdesk@openaire.euOpen Access Mandate for Publications assignment_turned_in Project2018 - 2021Partners:ubiqu, Merantix, STARCK, TECHNOLOGY NEXUS SECURED BUSINESS SOLUTIONS AB, CWA PC +121 partnersubiqu,Merantix,STARCK,TECHNOLOGY NEXUS SECURED BUSINESS SOLUTIONS AB,CWA PC,Gdańsk University of Technology,TECHNOLOGY NEXUS SECURED BUSINESS SOLUTIONS AB,Prove & Run,SICS,IP TELECOM,OYS,HALTIAN,Merantix,University of Bucharest,BUT,CANON RESEARCH CENTRE FRANCE,NXP (Germany),BEYOND VISION - SISTEMAS MOVEIS AUTONOMOS DE REALIDADE AUMENTADA LDA,NSNFINLAND,IMEC,COMMSOLID GMBH,TST,RISE,SENETICS HEALTHCARE GROUP GMBH & CO. KG,CISC Semiconductor (Austria),Prove & Run,EXELONIX GMBH,ZF FRIEDRICHSHAFEN AG,Gemeente Helmond,IFSTTAR,IP TELECOM,CHINA-EURO VEHICLE TECHNOLOGY AKTIEBOLAG,CHINA-EURO VEHICLE TECHNOLOGY AKTIEBOLAG,RHEINLAND-PFALZISCHE TECHNISCHE UNIVERSITAT,SENETICS HEALTHCARE GROUP GMBH & CO. KG,FHG,Roche PVT,CWA PC,IMEC,GEMALTO,THALES DIS DESIGN SERVICES SAS,UNIVERSITE GUSTAVE EIFFEL,LETI,PDM&FC,MARELLI EUROPE SPA,TU/e,BUTE,AVL,CSIC,TST,NSNFINLAND,INTERNET OF TRUST,IMEC-NL,Indra (Spain),SECINTO,A3,UNIMORE,AIT,IT,ubiqu,STICHTING RADBOUD UNIVERSITEIT,SICS,THALES DIS DESIGN SERVICES SAS,IDNEO,ENIT,BEYOND VISION - SISTEMAS MOVEIS AUTONOMOS DE REALIDADE AUMENTADA LDA,IDEAS & MOTION SRL,IMEC-NL,VIF,Evidence (Italy),Indra (Spain),IP,G&D,ideXlab (France),YOGOKO,Fastree3D B.V.,Thales (Austria),Evidence (Italy),Sup'Com,AVL SOFTWARE AND FUNCTIONS GMBH,UNIVERSITE GUSTAVE EIFFEL,NXP (Netherlands),PHILIPS ELECTRONICS NEDERLAND B.V.,iN2Car,Thales (Austria),EXELONIX GMBH,TML,ideXlab (France),THALES DIS,COMMSIGNIA Kft.,A3,IMA,THALES DIS,NXP (Netherlands),STACKFORCE,NXP LABORATORIES UK LIMITED,ZF FRIEDRICHSHAFEN AG,FICOSA ADAS, S.L.,AVL,Gemeente Helmond,SECINTO,COMMSOLID GMBH,INTERNET OF TRUST,TNO,IDNEO,TNO,SOLITA OY,CANON RESEARCH CENTRE FRANCE,IP,FICOSA ADAS, S.L.,PDM&FC,HALTIAN,IMA,IDEAS & MOTION SRL,TML,NXP (Germany),SOLITA OY,PSA ID,Roche PVT,NXP LABORATORIES UK LIMITED,PHILIPS ELECTRONICS NEDERLAND B.V.,AVL SOFTWARE AND FUNCTIONS GMBH,VIF,CISC Semiconductor (Austria),MAGNETI MARELLI S.P.A.,Fastree3D B.V.Funder: European Commission Project Code: 783119Overall Budget: 51,165,000 EURFunder Contribution: 14,816,200 EURTitle : Cyber Security for Cross Domain Reliable Dependable Automated Systems. Goal : SECREDAS aims to develop and validate multi-domain architecting methodologies, reference architectures & components for autonomous systems, combining high security and privacy protection while preserving functional-safety and operational performance.
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For further information contact us at helpdesk@openaire.euOpen Access Mandate for Publications and Research data assignment_turned_in Project2024 - 2027Partners:University of Bucharest, UTIA, ISD, Institut Polytechnique de Bordeaux, Grenoble Institute of Technology +50 partnersUniversity of Bucharest,UTIA,ISD,Institut Polytechnique de Bordeaux,Grenoble Institute of Technology,UCL,CAS,SOITEC,TU/e,Ibs (France),NATIONAL UNIVERSITY OF SCIENCE ANDTECHNOLOGY POLITEHNICA BUCHAREST,THALES ALENIA SPACE FRANCE,GREENWAVES TECHNOLOGIES,IMA,UNICAL,IC-LOGIC GMBH,CITROBITS GMBH,STGNB 2 SAS,D&R,AED,NEWAYS ADVANCED MICROSYSTEMS BV,THALES ALENIA SPACE FRANCE,ST,IMEC,ROBERT BOSCH BV,Ibs (France),ROBERT BOSCH BV,CITROBITS GMBH,IMA,IC-LOGIC GMBH,SIAE MICROELETTRONICA SPA,ST,LETI,FHG,UTIA,SIAE MICROELETTRONICA SPA,Cooperative Program for the Technological Development and Modernization of Coffee,IMEC,Antennex,GREENWAVES TECHNOLOGIES,GLOBALFOUNDRIES Dresden Module One LLC & Co. KG,INFINISCALE,Antennex,IMST,D&R,AED,STGNB 2 SAS,NEWAYS ADVANCED MICROSYSTEMS BV,ISD,INFINISCALE,SOITEC,GLOBALFOUNDRIES Dresden Module One LLC & Co. KG,STM CROLLES,IMST,ECLFunder: European Commission Project Code: 101139785Overall Budget: 95,095,296 EURFunder Contribution: 24,019,400 EURThe European FDSOI family of technology platforms is recognized for its low power consumption, versatility, high radiation hardness, embedded non-volatile memories and exceptional radio frequency capabilities. The objective of the SOIL project is to extend FDSOI technology platforms and broaden their use within the European industry in order to provide Europe with a real alternative to semiconductor supply autonomy using FDSOI semiconductors. We will thus expand a European technology manufactured by European players and suited to the European and Worldwide market. The SOIL project will give Europe the opportunity to move forward with industrial and academic players spanning the value chain by joining in the risk-taking necessary for the growth dynamics of semiconductors for Automotive, Space, IOT and Edge AI domain in Europe. The SOIL project will accelerate the implementation of semiconductor manufacturing based on FDSOI technology, building, and securing the European semiconductor value chain from material to system, supporting the twin green and digital transition. SOIL will expand the family of European FDSOI technology platforms by developing production and innovation capabilities in the following key areas: i) Advanced features: prepare next generation of FDSOI technologies and components; ii) Semiconductor Intellectual Property (SIP) core: reinforce the FDSOI design ecosystem and the supply chain around FDSOI manufacturing; iii) Digital, analog & RF single-chip integration capabilities (Microcontroller Unit; RF communication; RF sensor, e.g. radar). The project will shape the future by developing new technology approaches as well as numerous IPs on advanced applications and will promote the capability and benefits of the technology by providing advanced demonstrations on key applications and comparing the technology. SOIL will strengthen and expand the overall FDSOI ecosystem from material to system.
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