
ALCATEL ITALIA
ALCATEL ITALIA
5 Projects, page 1 of 1
Open Access Mandate for Publications assignment_turned_in Project2016 - 2018Partners:ESF, UNIPD, AVANZARE, FHG, University of Bremen +271 partnersESF,UNIPD,AVANZARE,FHG,University of Bremen,University of Ioannina,RF360 EUROPE GMBH,BRETON SPA,SU,IMEC,NOKIA SOLUTIONS AND NETWORKS ITALIA SPA,BRETON SPA,HITACHI ENERGY SWEDEN AB,THALES,Bundeswehr University Munich,G TEC,NVISION,Repsol (Spain),Bielefeld University,AIXTRON LIMITED,Unisa,TU/e,University of Freiburg,UZH,ULB,University of Ioannina,ProGnomics Ltd.,BASF SE,LNE,GRAPHENEA SEMICONDUCTOR SL,UT,CNR,Alcatel-Lucent (Germany),NSN,University of Groningen,University of Augsburg,KIT,AALTO,Alcatel-Lucent (Germany),ALCATEL ITALIA,TUM,CNM TECHNOLOGIES GMBH,TUD,Horiba (France),UEF,SISSA,IIT,Lancaster University,BRUNO BALDASSARI & FRATELLI SPA,GRAPHENE-XT SRL,UCD,CIC biomaGUNE,University of Manchester,EPCOS AG,TCD,UniPi,INTER-QUIMICA,UNIGE,University of Ulm,UOC,CERAPS,USTL,University of Sunderland,University of Warwick,UNITS,UNIBAS,INDORAMA VENTURES FIBERS GERMANY GMBH,University of Regensburg,FBK,UH,Robert Bosch (Germany),BSU,CRAYONANO AS,UOXF,PIXIUM VISION,IAW,KI,University of Namur,ICN2,E. AMALDI FOUNDATION,STICHTING RADBOUD UNIVERSITEIT,CAU,UW,ΕΛΚΕ- ΠΙ,Technion – Israel Institute of Technology,CHALMERS INDUSTRITEK,Robert Bosch (Germany),ICFO,GALVANI BIOELECTRONICS LIMITED,THE CHANCELLOR, MASTERS AND SCHOLARS OF THE UNIVERSITY OF CAMBRIDGE,DELTA TECH SPA,Plastic Logic (United Kingdom),AMO GMBH,CNRS,LIBRE SOCIETA A RESPONSABILITA LIMITATA,UNIVERSITY OF CRETE,CSIC,GRAPHENE-XT SRL,IMech-BAS,БелГУТ,EK,AVANZARE,AMALYST,G24 POWER LIMITED,M-Solv,UCLM,Graphenea (Spain),CIC ENERGIGUNE,VMI,University of Rome Tor Vergata,Infineon Technologies (Germany),GALVANI BIOELECTRONICS LIMITED,AMO GMBH,Infineon Technologies (Germany),NSN,EPCOS AG,MCS,NanoTechLab,EAB,LITHOPS SRL,NOKIA SOLUTIONS AND NETWORKS UK LIMITED,BRUNO BALDASSARI & FRATELLI SPA,CNIT,ESF,ITALCEMENTI S.p.A.,NanoTechLab,Emberion Ltd,E. AMALDI FOUNDATION,FOUNDATION FOR RESEARCH AND TECHNOLOGYHELLAS,SES SPA,VMI,FIDAMC,UCL,University of Sheffield,Sorbonne University,IAW,EMPA,NanOsc AB,POLITO,Repsol (Spain),GRINP,J. Heyrovsky Institute of Physical Chemistry,UNISTRA,ETHZ,RWTH,UM,Printed Electronics Ltd,NPL MANAGEMENT LIMITED,UPMC,WUT,LIBRE SOCIETA A RESPONSABILITA LIMITATA,FSU,Technological Educational Institute of Crete,NOKIA UK LIMITED,NOVALIA LIMITED,FIDAMC,CIBER,LEONARDO,NOKIA SOLUTIONS AND NETWORKS UK LIMITED,TEKNOLOGIAN TUTKIMUSKESKUS VTT OY,SISSA,STMicroelectronics (Switzerland),ICFO,AUREL SPA,IMEC,GRUPO ANTOLIN-INGENIERIA SA,TEKNOLOGIAN TUTKIMUSKESKUS VTT OY,TUHH,POLYMEM,Atherm,GLAXOSMITHKLINE RESEARCH AND DEVELOPMENT LTD.,University of Nottingham,Emberion Ltd,WALTER PACK,BASF SE,DropSens S.L.,Printed Electronics Ltd,CRF,UMINHO,Umeå University,FAU,HUN-REN CENTRE FOR ENERGY RESEARCH,University of Sunderland,CHALMERS INDUSTRITEK,HEIDELBERG MATERIALS ITALIA CEMENTI SPA,OINT,INTERNACIONAL DE COMPOSITES SA,CRF,EMBERION OY,Nanesa,AIRBUS OPERATIONS SL,LETI,DropSens S.L.,Polytechnic University of Milan,LiU,Chalmers University of Technology,DI,TECNALIA,NanOsc AB,Chemnitz University of Technology,IDIBAPS,GRINP,IRTA,AIXTRON LIMITED,INSERM,G24 POWER LIMITED,OINT,IMech-BAS,AMALYST,CIC biomaGUNE,CAS,NOKIA R&D (UK) LTD,G TEC,CNM TECHNOLOGIES GMBH,NOKIA SOLUTIONS AND NETWORKS ITALIA SPA,CIC ENERGIGUNE,Nokia (Finland),THE CHANCELLOR, MASTERS AND SCHOLARS OF THE UNIVERSITY OF CAMBRIDGE,DELTA TECH SPA,EMBERION OY,CIC nanoGUNE,IKS,ARCELORMITTAL,Carlos III University of Madrid,IMDEA NANO,MPG,UNIBO,University of Augsburg,TUW,ALCATEL ITALIA,THALES,NPL MANAGEMENT LIMITED,M-Solv,AUREL SPA,Nanesa,IKS,RF360 EUROPE GMBH,DTU,UAB,INTER-QUIMICA,Imperial,NVISION,LITHOPS SRL,GRAPHENEA SEMICONDUCTOR SL,ProGnomics Ltd.,STMicroelectronics (Switzerland),Horiba (France),AIRBUS OPERATIONS SL,GLAXOSMITHKLINE RESEARCH AND DEVELOPMENT LTD.,Atherm,INTERNACIONAL DE COMPOSITES SA,Chemnitz University of Technology,QMUL,INFN,Nokia (Finland),NOVALIA LIMITED,Technological Educational Institute of Crete,ARCELORMITTAL,NOKIA UK LIMITED,ITME,SES SPA,J. Heyrovsky Institute of Physical Chemistry,UCL,University of Zaragoza,GRUPO ANTOLIN-INGENIERIA SA,DSM Ahead,LEONARDO,TECNALIA,WALTER PACK,TU Delft,EPFL,CRAYONANO AS,FOUNDATION FOR RESEARCH AND TECHNOLOGYHELLAS,PIXIUM VISION,MCS,Graphenea (Spain)Funder: European Commission Project Code: 696656Overall Budget: 89,000,000 EURFunder Contribution: 89,000,000 EURThis project is the second in the series of EC-financed parts of the Graphene Flagship. The Graphene Flagship is a 10 year research and innovation endeavour with a total project cost of 1,000,000,000 euros, funded jointly by the European Commission and member states and associated countries. The first part of the Flagship was a 30-month Collaborative Project, Coordination and Support Action (CP-CSA) under the 7th framework program (2013-2016), while this and the following parts are implemented as Core Projects under the Horizon 2020 framework. The mission of the Graphene Flagship is to take graphene and related layered materials from a state of raw potential to a point where they can revolutionise multiple industries. This will bring a new dimension to future technology – a faster, thinner, stronger, flexible, and broadband revolution. Our program will put Europe firmly at the heart of the process, with a manifold return on the EU investment, both in terms of technological innovation and economic growth. To realise this vision, we have brought together a larger European consortium with about 150 partners in 23 countries. The partners represent academia, research institutes and industries, which work closely together in 15 technical work packages and five supporting work packages covering the entire value chain from materials to components and systems. As time progresses, the centre of gravity of the Flagship moves towards applications, which is reflected in the increasing importance of the higher - system - levels of the value chain. In this first core project the main focus is on components and initial system level tasks. The first core project is divided into 4 divisions, which in turn comprise 3 to 5 work packages on related topics. A fifth, external division acts as a link to the parts of the Flagship that are funded by the member states and associated countries, or by other funding sources. This creates a collaborative framework for the entire Flagship.
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For further information contact us at helpdesk@openaire.euOpen Access Mandate for Publications assignment_turned_in Project2018 - 2020Partners:University of Groningen, University of Augsburg, KIT, FIOH, University of Regensburg +297 partnersUniversity of Groningen,University of Augsburg,KIT,FIOH,University of Regensburg,FBK,CRAYONANO AS,UOXF,Singulus (Germany),ICN2,GRAPHMATECH AB,E. AMALDI FOUNDATION,ΕΛΚΕ- ΠΙ,Robert Bosch (Germany),DALLARA AUTOMOBILI SPA,THE CHANCELLOR, MASTERS AND SCHOLARS OF THE UNIVERSITY OF CAMBRIDGE,CIC biomaGUNE,TCD,University of Warwick,UNITS,KI,confinis,INTER-QUIMICA,CAU,NAWATECHNOLOGIES,SIEC BADAWCZA LUKASIEWICZ - INSTYTUT MIKROELEKTRONIKI I FOTONIKI,Evonik Nutrition & Care GmbH,Naturality Research & Development,EK,Infineon Technologies (Germany),Infineon Technologies (Germany),NSN,EAB,NOKIA SOLUTIONS AND NETWORKS UK LIMITED,University of Ulm,AIXTRON LIMITED,VRS,CHALMERS INDUSTRITEK,Unisa,Plastic Logic (United Kingdom),AMO GMBH,CNRS,AALTO,UCL,University of Sheffield,Sorbonne University,IAW,EMPA,TU/e,NanOsc AB,University of Freiburg,PHI-STONE AG,UNISTRA,Siemens (Germany),EVONIK DEGUSSA GmbH,IIT,GRAPHENE-XT SRL,BMW GROUP,University of Manchester,Printed Electronics Ltd,Technological Educational Institute of Crete,NOKIA UK LIMITED,CIBER,TEKNOLOGIAN TUTKIMUSKESKUS VTT OY,SISSA,VRS,ICFO,IMEC,GRAPHMATECH AB,CAMBRIDGE RAMAN IMAGING LTD,Lancaster University,PHI-STONE AG,UNIGE,Robert Bosch (Germany),Technion – Israel Institute of Technology,DELTA TECH SPA,LHT,GRAPHENE-XT SRL,IMech-BAS,AVANZARE,confinis,AMALYST,INDORAMA VENTURES FIBERS GERMANY GMBH,PIXIUM VISION,M-Solv,IAW,VMI,Evonik Nutrition & Care GmbH,ICFO,GALVANI BIOELECTRONICS LIMITED,EVONIK CREAVIS GMBH,MCS,NanoTechLab,LITHOPS SRL,ABB AB,ESF,ICON LIFESAVER LIMITED,E. AMALDI FOUNDATION,BARNICES Y PINTURAS MODERNAS SOCIEDAD ANONIMA,FOUNDATION FOR RESEARCH AND TECHNOLOGYHELLAS,VMI,FIDAMC,UZH,University of Ioannina,ProGnomics Ltd.,BASF SE,GRAPHENEA SEMICONDUCTOR SL,NSN,ALCATEL ITALIA,BEDIMENSIONAL SPA,TECNIUM,Varta Microbattery (Germany),AIRBUS DEFENCE AND SPACE GMBH,SISSA,CSIC,SCHAFFHAUSEN INSTITUTE OF TECHNOLOGY AG,FNSR,UCLM,Graphenea (Spain),CIC ENERGIGUNE,GALVANI BIOELECTRONICS LIMITED,AMO GMBH,BRUNO BALDASSARI & FRATELLI SPA,CNIT,MEDICA SPA,ITALCEMENTI S.p.A.,NanoTechLab,Emberion Ltd,Composites Evolution (United Kingdom),BRUNO BALDASSARI & FRATELLI SPA,ESF,UNIPD,AVANZARE,CAMBRIDGE RAMAN IMAGING LTD,FHG,University of Bremen,University of Ioannina,Naturality Research & Development,BRETON SPA,SIXONIA TECH,IMEC,NOKIA SOLUTIONS AND NETWORKS ITALIA SPA,BRETON SPA,HITACHI ENERGY SWEDEN AB,THALES,Bundeswehr University Munich,Sonaca (Belgium),G TEC,SPAC SPA,SPAC SPA,TUD,UCL,University of Zaragoza,GRUPO ANTOLIN-INGENIERIA SA,Mellanox Technologies (Israel),LEONARDO,TECNALIA,WALTER PACK,USTL,University of Rome Tor Vergata,TME,AIRBUS OPERATIONS SL,LETI,DropSens S.L.,Polytechnic University of Milan,Chalmers University of Technology,DI,TECNALIA,NanOsc AB,Sonaca (Belgium),Chemnitz University of Technology,BMW (Germany),IDIBAPS,IRTA,AIXTRON LIMITED,INSERM,OINT,HMU,IMech-BAS,AMALYST,AIRBUS HELICOPTERS,CIC biomaGUNE,Mellanox Technologies (Israel),G TEC,NOKIA SOLUTIONS AND NETWORKS ITALIA SPA,CIC ENERGIGUNE,DIPC,THE CHANCELLOR, MASTERS AND SCHOLARS OF THE UNIVERSITY OF CAMBRIDGE,DELTA TECH SPA,EMBERION OY,CIC nanoGUNE,AIRBUS DEFENCE AND SPACE GMBH,NOVALIA LIMITED,ULB,LNE,UT,CNR,Varta Microbattery (Germany),UMINHO,Umeå University,FIDAMC,FAU,HUN-REN CENTRE FOR ENERGY RESEARCH,TECNIUM,BOSTON SCIENTIFIC CORK LIMITED,OINT,INTERNACIONAL DE COMPOSITES SA,SCHAFFHAUSEN INSTITUTE OF TECHNOLOGY AG,CRF,LHT,EMBERION OY,Nanesa,FIOH,LEONARDO,AUREL SPA,TUHH,BOKU,POLYMEM,FNSR,MEDICA SPA,Emberion Ltd,Printed Electronics Ltd,CRF,CHALMERS INDUSTRITEK,TU Delft,EPFL,HEIDELBERG MATERIALS ITALIA CEMENTI SPA,Composites Evolution (United Kingdom),TEMAS AG TECHNOLOGY AND MANAGEMENT SERVICES,CRAYONANO AS,BIOAGE,SIXONIA TECH,FOUNDATION FOR RESEARCH AND TECHNOLOGYHELLAS,BEDIMENSIONAL SPA,PIXIUM VISION,MCS,Graphenea (Spain),INTERNACIONAL DE COMPOSITES SA,Chemnitz University of Technology,QMUL,VEONEER SWEDEN AB,NOVALIA LIMITED,SIEC BADAWCZA LUKASIEWICZ - INSTYTUT MIKROELEKTRONIKI I FOTONIKI,EVONIK CREAVIS GMBH,Technological Educational Institute of Crete,ARCELORMITTAL,NOKIA UK LIMITED,ITME,BIOAGE,ICON LIFESAVER LIMITED,BARNICES Y PINTURAS MODERNAS SOCIEDAD ANONIMA,DTU,UAB,Singulus Technologies,INTER-QUIMICA,Imperial,LITHOPS SRL,GRAPHENEA SEMICONDUCTOR SL,ProGnomics Ltd.,STMicroelectronics (Switzerland),AIRBUS OPERATIONS SL,EGP,UniPi,BSL,UNIBAS,ETHZ,RWTH,NPL MANAGEMENT LIMITED,WUT,FSU,TME,NOKIA SOLUTIONS AND NETWORKS UK LIMITED,STMicroelectronics (Switzerland),GRUPO ANTOLIN-INGENIERIA SA,TEKNOLOGIAN TUTKIMUSKESKUS VTT OY,University of Nottingham,WALTER PACK,BASF SE,MAGNA ELECTRONICS SWEDEN AB,DropSens S.L.,IKS,ARCELORMITTAL,Carlos III University of Madrid,IMDEA NANO,MPG,UNIBO,University of Augsburg,TUW,ALCATEL ITALIA,THALES,TEMAS AG TECHNOLOGY AND MANAGEMENT SERVICES,Siemens (Germany),DIPC,NPL MANAGEMENT LIMITED,M-Solv,AUREL SPA,Nanesa,EGP,AIRBUS HELICOPTERS,DALLARA AUTOMOBILI SPA,IKS,NAWATECHNOLOGIESFunder: European Commission Project Code: 785219Overall Budget: 88,000,000 EURFunder Contribution: 88,000,000 EURThis proposal describes the third stage of the EC-funded part of the Graphene Flagship. It builds upon the results achieved in the ramp-up phase (2013 - 2016) and the first core project (2016 - 2018), and covers the period April 2018 - March 2020. The progress of the flagship follows the general plans set out in the Framework Partnership Agreement, and the second core project represents an additional step towards higher technology and manufacturing readiness levels. The Flagship is built upon the concept of value chains, one of which is along the axis of materials-components-systems; the ramp-up phase placed substantial resources on the development of materials production technologies, the first core project moved to emphasise components, and the second core project will move further towards integrating components in larger systems. This evolution is manifested, e.g., in the introduction of six market-motivated spearhead projects during the Core 2 project.
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For further information contact us at helpdesk@openaire.euOpen Access Mandate for Publications and Research data assignment_turned_in Project2015 - 2019Partners:STMicroelectronics (Switzerland), UPV, ERICSSON TELECOMUNICAZIONI, EPIC, EPIC +12 partnersSTMicroelectronics (Switzerland),UPV,ERICSSON TELECOMUNICAZIONI,EPIC,EPIC,CNIT,IMEC,ALCATEL ITALIA,IMEC,NOKIA SOLUTIONS AND NETWORKS ITALIA SPA,IBBT,NOKIA SOLUTIONS AND NETWORKS ITALIA SPA,CNR,ERICSSON TELECOMUNICAZIONI,STMicroelectronics (Switzerland),IBBT,ALCATEL ITALIAFunder: European Commission Project Code: 688510Overall Budget: 4,249,160 EURFunder Contribution: 4,249,160 EUROptical communications are becoming always more relevant because of the continuous growth of the requiested bandwidth. In the last decade we assisted a continuous growing of transport and metro netwotks, presently the bottleneck is in the processing of the huge amount of data constituted by the growing number of users, the capacity of the content that is exchanged and the convergence of Telecom and Datacom. This accumulation of data are elaborated and redirected within data centers with a continuous growing of traffic congestion. The continuous growth of traffic require therefore a roadmap of bandwidth density growth that necessarily has to be scalable on the timeframe of several years. To this point photonics plays a crucial role that is always more pervasive. However a major limiting factor is also arising from the energy cost and latency accumulated by the need of aggregation to route signals. To limitate this effect is necessary to make possible data exchange and processing without or with limited aggregation. Teraboard project consists in developing a full intra data center photonic platform for intraboard, intrarack and intra data center optical communications. The Teraboard interconnection platform will be based on ultra-high density and scalable bandwidth optical interconnectivity with low insertion loss and a target of lowest energy cost per channel of 2.5pJ/bit and a manufacturing cost of 0.1$/Gb/s in volumes. These target values are 10x reduction respect to commercial state of the art. Teraboard demonstrates: 1) passive, scalable, 3D inter processor interconnection layer, 2) novel WDM optical connector to plug the fiber ribbons directly onto the transceiver chip, 3) intraboard transceiver bank with high density bandwidth of 7Tb/s/cm2. Single wavelength laser arrays will be directly integrated on the silicon photonics transceiver circuits, 4) and edge single and four wavelength transceiver interface with bandwidth density of 50 and 7Tb/s/cm2 respectively.
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For further information contact us at helpdesk@openaire.euOpen Access Mandate for Publications and Research data assignment_turned_in Project2017 - 2021Partners:UNIPV, III V Lab, ALCATEL ITALIA, STMicroelectronics (Switzerland), TEKNOLOGIAN TUTKIMUSKESKUS VTT OY +10 partnersUNIPV,III V Lab,ALCATEL ITALIA,STMicroelectronics (Switzerland),TEKNOLOGIAN TUTKIMUSKESKUS VTT OY,NOKIA SOLUTIONS AND NETWORKS ITALIA SPA,III V Lab,Erzia,NOKIA SOLUTIONS AND NETWORKS ITALIA SPA,TEKNOLOGIAN TUTKIMUSKESKUS VTT OY,ALCATEL ITALIA,STMicroelectronics (Switzerland),CEIT,Erzia,CEITFunder: European Commission Project Code: 761390Overall Budget: 2,808,570 EURFunder Contribution: 2,808,570 EURNowadays there is a shared vision among industry, operators and academy that beyond 5G wireless networks will have to provide wideband wireless access and ubiquitous computing anywhere and at any time. The human life of the majority of the EU citizen will be surrounded by intelligent wireless sensors, which will bring radical changes to the way we live and do things. Supporting this scenario is a challenge for network operators and wireless network infrastructures and it will demand a tremendous performance improvement of medium range wireless infrastructure. This challenge needs to be addressed by a convergence of advanced semiconductor nanotechnology and a robust wireless infrastructure meshed network with seamless fiber performances. The DREAM project, through the exploitation of the radio spectrum in D-band (130-174.8 GHz) with beam steering functionality, will enable wireless links with data rate exceeding current V-band and E-band wireless backhaul solutions by at least a factor of 10 and thus, it will bring wireless systems to the speed of optical systems. The DREAM project vision and objectives rely on a power efficient and silicon based BiCMOS transceiver analog front end, operating in D-band and enabling cost efficient deployment of meshed networks with seamless fiber performance. A beam steering integrated antenna array using an intelligent low-cost packaging technology prototype will be developed for the implementation of the beyond 5G network proof of concept in a realistic environment. The DREAM consortium has a well-balanced and complementary known-how in the relevant areas for designing and demonstrating the feasibility of a small cell cellular network architecture based on meshed D-band backhaul links. DREAM will therefore secure Europe’s industrial leadership and pave the way towards the beyond 5G telecommunications networks.
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For further information contact us at helpdesk@openaire.euOpen Access Mandate for Publications assignment_turned_in Project2017 - 2020Partners:CTTC, FHG, Telecom Italia (Italy), NOKIA SOLUTIONS AND NETWORKS ITALIA SPA, TU/e +30 partnersCTTC,FHG,Telecom Italia (Italy),NOKIA SOLUTIONS AND NETWORKS ITALIA SPA,TU/e,Naudit HPC,Polytechnic University of Milan,LEX,Telefonica Research and Development,OPENLIGHTCOMM LTD,INFINERA PORTUGAL,ALCATEL ITALIA,OPENLIGHTCOMM LTD,Alcatel-Lucent (France),Naudit HPC,OLD DOG CONSULTING LIMITED,ERICSSON TELECOMUNICAZIONI,CNIT,UPC,ZEETTA NETWORKS LIMITED,Telefonica Research and Development,BT Group (United Kingdom),NOKIA SOLUTIONS AND NETWORKS ITALIA SPA,BT,ADVA Optical Networking (Germany),Telecom Italia (Italy),OLD DOG CONSULTING LIMITED,QOGNIFY GMBH,QOGNIFY GMBH,ERICSSON TELECOMUNICAZIONI,University of Bristol,ALCATEL ITALIA,LEX,ADVA Optical Networking (Germany),ZEETTA NETWORKS LIMITEDFunder: European Commission Project Code: 761727Overall Budget: 7,784,860 EURFunder Contribution: 7,784,860 EURMETRO-HAUL is a project proposal addressing the Horizon 2020 ICT-07 5G PPP call; it is an RIA, focusing on strand 2 (high capacity elastic – optical networks) and strand 3 (software networks). The central topic is cost-efficient optical metro networks for 5G backhaul. The aim of this project is to design and build a smart, but cost-effective, optical metro infrastructure able to support traffic originating from heterogeneous 5G access networks, addressing the anticipated capacity increase and its specific characteristics such as mobility, low latency, and high bandwidth. This infrastructure will be able to also support a wide variety of 5G applications with special emphasis on services from various industries vertical to the ICT. This will be achieved by architecting new access-facing and core-facing nodes, complete with storage and compute facilities, interconnected by novel, spectrally efficient, and adaptive optical transmission networks. Advanced concepts, such as hardware disaggregation and virtualisation, will assist in hitting challenging cost targets whilst enabling automation and programmability – all supported by a purpose-designed SDN-based control plane which will interface with client applications, intelligently catering for the wide range of 5G KPIs. METRO-HAUL will coordinate the disparate elements of transmission, switching, networking, compute, and storage, orchestrating dynamic solutions for multiple 5G applications. METRO-HAUL will carry out Proof of Concept demonstrations of its networking solution involving the interconnection of metro node prototypes, the use of the project's transmission technologies, and the associated control plane and orchestration software. The final project demonstrations will also involve the demonstration of actual 5G and vertical services across the METRO-HAUL test-bed. Additionally, the project will actively participate in the relevant standardization bodies, promoting METRO-HAUL solutions to the wider community.
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