Micro Combined Heat and Power (mCHP) systems are a perfect addition to stabilize the electricity grid in the increased presence of volatile renewable sources. Due to their efficient generation and local use of heat and electricity, their fuel saving- and CO2 reduction potential is tremendous. In spite of great interest of the market and policy-makers, currently available mCHP systems suffer from limited life, high investment and very high maintenance cost, making them too expensive for serious market uptake. MTT solves this problem with the EnerTwin, a mCHP system based on a micro gas turbine. The EnerTwin uses commercial off-the-shelf components resulting in low investment cost. Gas turbines are known for low-maintenance, high power density (small size) and long life. MTT uses automotive turbochargers as key components of the turbine: these are produced in millions and contribute to the low cost and high reliability of the EnerTwin. Gas turbines are inherently insensitive to varying fuel compositions facilitating use of various grades of natural gas. Currently, the EnerTwin is at TLR 7: 19 systems have been deployed in 1st-stage field tests at client locations since mid 2013. Besides the field-trial units, MTT has already sold 500 commercial EnerTwins, which promises an excellent commercial market perspective, while concrete contracts are under negotiation for high volumes for Canadian- and Chinese markets. The main objective of this project is the readiness for commercialisation of the EnerTwin. MTT and its industrial project partners will improve the mCHP to meet future CE and ECO Design requirements. Together with these partners, MTT will work on component and system optimisation for reliability and large-volume manufacturing. Additional field-test units will be deployed to test use cases and validate improvements. By the end of the project MTT expects to close at least 5.000 pre-orders for EnerTwins, resulting in creating over 600 qualified job positions.

The iSTORMY project will propose an innovative and interoperable hybrid stationary energy storage system based on: modular battery pack (stacks/modules) + modular power electronics (PE) interface + universal Self-healing energy management strategy (SH-EMS). In particular the project will investigate and demonstrate: 1. Modular battery pack with hybridization at stacks/modules level (incl. slave pBMS) with a new universal BMS (adaptive interfaces + accurate SoX) at the top of the battery system for easy and fast integration and control. The hybridization will consist of different battery types or same type with different capacities (first and second life) and a smart modular solution will be developed to integrate the cooling system among modules or stacks. 2. Modular PE interface based on SiC devices with high efficiency (topology + adaptive local controller) and Digital Twin modeling. 3. Universal SH-EMS (based on machine learning and online algorithms) including the aging and thermal constraints for failure mechanisms.

The overall objective of the IT2 project is to explore, develop and demonstrate technology options that are needed to realize 2nm CMOS logic technology extending the scaled Semiconductor technology roadmap to the next node in accordance to Moore’s law. These activities cover creation of Lithography equipment, new Processes & Modules and Metrology tools capable to create and deal with new 2nm node 3D structures, defect analysis, overlay and features. The topics addressed by the program relate to the ECSEL MASP 2019 Chapter 10; “Process Technology, Equipment, Materials and Manufacturing for electronic components and systems”, with emphasis on the following major challenge “the Extension of world leadership in Semiconductor Equipment, Materials and Manufacturing solutions” and “Developing Technology for heterogeneous System-on-Chip (SoC) Integration” of the ECSEL JU Annual Work Plan 2019. The relation of the IT2 project to world leadership regards the extension of the scaled semiconductor technology roadmaps and thereby maintain competence in advanced More Moore technology in Europe to support leading edge manufacturing. The relation of the IT2 project to the Developing Technology for heterogeneous System-on-chip Integration comes from activities regarding “System Scaling” in which technology is developed that enables wafer-to-wafer bonding creating 3D heterogeneous solutions with the aim to resolve performance limitations in power and data congestion. In regard to the annual work plan 2019, the IT2 project support the ECSEL JU objectives by contribution to the development of a strong and competitive Electronic Components and Systems (ECS) by involving many of the equipment and tool developers like; ASML, Zeiss, Thermo Fisher, Applied Materials, Nova, KLA along the value chain and knowledge institutes such as ARCNL, imec, PTB, TNO and TU/e. And by stimulating a dynamic ecosystem through through the involvement of SMEs like IBS, Recif, Reden and Unity.