
NANIUM S.A.
NANIUM S.A.
8 Projects, page 1 of 2
assignment_turned_in Project2014 - 2017Partners:Thalgo (France), AT&S (Austria), FHG, THALES GLOBAL SERVICES SAS, Thalgo (France) +6 partnersThalgo (France),AT&S (Austria),FHG,THALES GLOBAL SERVICES SAS,Thalgo (France),AT&S,NANIUM S.A.,THALES GLOBAL SERVICES SAS,E&E,E&E,NANIUM S.A.Funder: European Commission Project Code: 312701All Research productsarrow_drop_down <script type="text/javascript"> <!-- document.write('<div id="oa_widget"></div>'); document.write('<script type="text/javascript" src="https://beta.openaire.eu/index.php?option=com_openaire&view=widget&format=raw&projectId=corda_______::e34bbf36342550638b31465c4555e893&type=result"></script>'); --> </script>
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For further information contact us at helpdesk@openaire.euOpen Access Mandate for Publications assignment_turned_in Project2020 - 2023Partners:RBDD, SIRRIS, MU, III V Lab, TEKNE +144 partnersRBDD,SIRRIS,MU,III V Lab,TEKNE,PUMACY,University of L'Aquila,AALTO,NANODESIGN,HSG-IMIT,STU,FORCIOT OY,Okmetic,ELAPHE PROPULSION TECHNOLOGIES LTD,TUD,PLASTIC OMNIUM ADVANCED INNOVATIONAND RESEARCH,SIRRIS,WAT MOTOR,NANODESIGN,NEXPERIA BV,AT&S (Austria),EDR & MEDESO,PUMACY,MU,LIS,WHZ,ARCELIK,Ams AG,X-FAB SEMICONDUCTOR,CSIC,Screentec,WHZ,AVL,TEKNOLOGIAN TUTKIMUSKESKUS VTT OY,Infineon Technologies (Austria),JIACO INSTRUMENTS BV,LEC GMBH,Ikerlan,IFKL,Infineon Technologies (Germany),UCLM,Graz University of Technology,JSI,JIACO INSTRUMENTS BV,Infineon Technologies (Germany),ENFORMA BILISIM,PAVO TASARIM URETIM ELEKTRONIK TICARET ANONIM SIRKETI,SENSITEC GMBH,LFOUNDRY SRL,Scania (Sweden),III V Lab,ELAPHE PROPULSION TECHNOLOGIES LTD,FHG,University of Bremen,THE REUSE COMPANY,QRTECH,Signify Netherlands BV,IUNET,Infineon Technologies (Austria),IFD,X-FAB Dresden,Signify Netherlands BV,IWO,IMEC,TEKNOLOGIAN TUTKIMUSKESKUS VTT OY,NINIX TECHNOLOGIES NV,THALES,SCHWEIZER ELECTRONIC AG,IMEC,Plastic Omnium (France),UES,UNIVERSITE LYON 1 CLAUDE BERNARD,PLASTIC OMNIUM ADVANCED INNOVATIONAND RESEARCH,LEC GMBH,TEKNE,Ikerlan,X-FAB SEMICONDUCTOR,NANIUM S.A.,HSG-IMIT,KAI,Chemnitz University of Technology,EDR & MEDESO,FTZ,X-FAB Dresden,ULMA Embedded Solutions,LIS,HAN University of Applied Sciences,INMOTION TECHNOLOGIES AB,THE REUSE COMPANY,Elmos Semiconductor (Germany),SENSITEC GMBH,ON SEMICONDUCTOR TECHNOLOGY,AT&S,ON BELGIUM,WAT MOTOR,SCHWEIZER ELECTRONIC AG,Ams AG,VIF,IWO,Plastic Omnium (France),NEXPERIA BV,FOUNDATION FOR RESEARCH AND TECHNOLOGYHELLAS,Screentec,ON SEMICONDUCTOR TECHNOLOGY,INMOTION TECHNOLOGIES AB,MCL,IFKL,Carlos III University of Madrid,TUW,MCL,THALES,CAF,UMS,VIF,INFINEON TECHNOLOGIES ITALIA Srl,BelGaN,RISE,JSI,ARCELIK,Elmos Semiconductor (Germany),BATZ,PAVO TASARIM URETIM ELEKTRONIK TICARET ANONIM SIRKETI,AVL,INFINEON TECHNOLOGIES ITALIA Srl,TECNOLOGICA,FTZ,MINDCET NV,Scania (Sweden),Chemnitz University of Technology,CAF,IVF,Okmetic,KAI,HAN University of Applied Sciences,MINDCET NV,NINIX TECHNOLOGIES NV,TECNOLOGICA,RBDD,ENFORMA BILISIM,TU Delft,BATZ,GPL,IFD,FOUNDATION FOR RESEARCH AND TECHNOLOGYHELLAS,GPL,ULMA Embedded Solutions,BSH,BSH,FORCIOT OYFunder: European Commission Project Code: 876659Overall Budget: 103,493,000 EURFunder Contribution: 24,862,600 EURIntelligent Reliability 4.0 (iRel40) has the ultimate goal of improving reliability for electronic components and systems by reducing failure rates along the entire value chain. Trend for system integration, especially for heterogeneous integration, is miniaturization. Thus, reliability becomes an increasing challenge on device and system level and faces exceptional requirements for future complex applications. Applications require customer acceptance and satisfaction at acceptable cost. Reliability must be guaranteed when using systems in new and critical environments. In iRel40, 79 partners from 14 countries collaborate in 6 technical work packages along the value chain. WP1 focuses on specifications and requirements. WP2 and WP3 focus on modelling, simulation, materials and interfaces based on test vehicles. WP4 applies the test vehicle knowledge to industrial pilots related to production. WP5 applies the knowledge to testing. WP6 focuses on application use cases applying the industrial pilots. We assess and validate the iRel40 results. Reliable electronic components and systems are developed faster and new processes are transferred to production with higher speed. Crucial insight gained by Physics of Failure and AI methods will push overall quality levels and reliability. iRel40 results will strengthen production along the value chain and support sustainable success of Electronic Components and Systems investment in Europe. By collaboration between academy, industry and knowledge institutes on this challenging topic of reliability, the project secures more than 25.000 jobs in the 25 participating production and testing sites in Europe. The project supports new applications and reliable chips push applications in energy efficiency, e-mobility, autonomous driving and IoT. This unique project brings, for the first time ever, world-leading reliability experts and European manufacturing expertise together to generate a sustainable pan-European reliability community.
All Research productsarrow_drop_down <script type="text/javascript"> <!-- document.write('<div id="oa_widget"></div>'); document.write('<script type="text/javascript" src="https://beta.openaire.eu/index.php?option=com_openaire&view=widget&format=raw&projectId=corda__h2020::03adad92379483a036a39d8a54f864f2&type=result"></script>'); --> </script>
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For further information contact us at helpdesk@openaire.euOpen Access Mandate for Publications assignment_turned_in Project2017 - 2020Partners:NXP, NXP, VALEO VISION SYSTEMS, SPINVERSE OY, PAC TECH +48 partnersNXP,NXP,VALEO VISION SYSTEMS,SPINVERSE OY,PAC TECH,FHG,Besi Netherlands BV,Silicon Radar (Germany),Afore Oy,NANOTEST,NANOTEST,SEMILAB ZRT,ROODMICROTEC,Sencio,INNOSENT,LETI,BESI,Afore Oy,ADVANCED VACUUM,NANIUM S.A.,EVG,BESI,Elmos Semiconductor (Germany),Elmos Semiconductor (Germany),I.Con. Innovation,TEKNOLOGIAN TUTKIMUSKESKUS VTT OY,3DIS TECHNOLOGIES,AMIC,ROODMICROTEC,SEMILAB ZRT,PAC TECH,Nokian Tyres (Finland),Besi Netherlands BV,TEKNOLOGIAN TUTKIMUSKESKUS VTT OY,AMIC,Nokian Tyres (Finland),VALEO VISION SYSTEMS,EVG,MURATA ELECTRONICS OY,KETEK GMBH HALBLEITER-UND REINRAUMTECHNIK,TEXEDA DESIGN GMBH,PACKAGING SIP,Murata (Finland),ADVANCED VACUUM,3DIS TECHNOLOGIES,MICRO ANALOG SYSTEMS OY,Sencio,KETEK GMBH HALBLEITER-UND REINRAUMTECHNIK,SPINVERSE OY,PACKAGING SIP,TEXEDA DESIGN GMBH,Silicon Radar (Germany),MICRO ANALOG SYSTEMS OYFunder: European Commission Project Code: 737497Overall Budget: 29,735,000 EURFunder Contribution: 7,203,640 EURna
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For further information contact us at helpdesk@openaire.euOpen Access Mandate for Publications assignment_turned_in Project2016 - 2019Partners:AT&S (Austria), HOCHSCHULE FUR ANGEWANDTE WISSENSCHAFTEN BURGENLAND GMBH, IFD, Polytechnic University of Milan, Infineon Technologies (Austria) +61 partnersAT&S (Austria),HOCHSCHULE FUR ANGEWANDTE WISSENSCHAFTEN BURGENLAND GMBH,IFD,Polytechnic University of Milan,Infineon Technologies (Austria),University of Aveiro,Semikron (Germany),AT&S,SYSTEMA,AIT,VIF,Know Center,IT,ifak e. V. Magdeburg,Robert Bosch (Germany),KAI,SYSTEMA,FhA,Hochschule Mittweida,Fabmatics (Germany),Ibs (France),AAU,LPE,Roth & Rau - Ortner GmbH,Elmos Semiconductor (Germany),Infineon Technologies (Austria),LPE,Robert Bosch (Germany),PMX,Infineon Technologies (Germany),SEMIKRON,Infineon Technologies (Germany),TUD,FHG,Fabmatics (Germany),PMX,AVL,IFKL,FHV,NANIUM S.A.,CMF,Elmos Semiconductor (Germany),znt Zentren für Neue Technologien GmbH,MCL,IFKL,UNIPV,Ibs (France),znt Zentren für Neue Technologien GmbH,Hochschule Mittweida,Schiller Automatisierungstechnik GmbH,KAI,MLAB,AVL,PLANSEE SE,PLANSEE SE,ifak e. V. Magdeburg,TUW,MCL,MLAB,Schiller Automatisierungstechnik GmbH,VIF,CMF,FhA,IFD,Roth & Rau - Ortner GmbH,Know CenterFunder: European Commission Project Code: 692466Overall Budget: 61,919,600 EURFunder Contribution: 12,227,400 EURAddressing European Policies for 2020 and beyond the “Power Semiconductor and Electronics Manufacturing 4.0” (SemI40) project responds to the urgent need of increasing the competitiveness of the Semiconductor manufacturing industry in Europe through establishing smart, sustainable, and integrated ECS manufacturing. SemI40 will further pave the way for serving highly innovative electronic markets with products powered by microelectronics “Made in Europe”. Positioned as an Innovation Action it is the high ambition of SemI40 to implement technical solutions on TRL level 4-8 into the pilot lines of the industry partners. Challenging use cases will be implemented in real manufacturing environment considering also their technical, social and economic impact to the society, future working conditions and skills needed. Applying “Industry 4.0”, “Big Data”, and “Industrial Internet” technologies in the electronics field requires holistic and complex actions. The selected main objectives of SemI40 covered by the MASP2015 are: balancing system security and production flexibility, increase information transparency between fields and enterprise resource planning (ERP), manage critical knowledge for improved decision making and maintenance, improve fab digitalization and virtualization, and enable automation systems for agile distributed production. SemI40’s value chain oriented consortium consists of 37 project partners from 5 European countries. SemI40 involves a vertical and horizontal supply chain and spans expertise and partners from raw material research, process and assembly innovation and pilot line, up to various application domains representing enhanced smart systems. Through advancing manufacturing of electronic components and systems, SemI40 contributes to safeguard more than 20.000 jobs of people directly employed in the participating facilities, and in total more than 300.000 jobs of people employed at all industry partners’ facilities worldwide.
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For further information contact us at helpdesk@openaire.euassignment_turned_in Project2013 - 2016Partners:EMOSS, PHILIPS MEDICAL SYSTEMS NEDERLAND, KAI, LIN INL, University of Leoben +51 partnersEMOSS,PHILIPS MEDICAL SYSTEMS NEDERLAND,KAI,LIN INL,University of Leoben,EVG,Infineon Technologies (Austria),FRONIUS INTERNATIONAL GMBH,CTR,Ams AG,Heliox,SPTS TECHNOLOGIES SAS,adixen,Infineon Technologies (Austria),adixen,LEAR,PRESTO,FHG,University of Leoben,LEAR,TUD,TU/e,ECP,EMOSS,PLANSEE SE,PLANSEE SE,NANIUM S.A.,CEST Kompetenzzentrum fur elektrochemische Oberflachentechnologie GmbH,Ams AG,SPTS TECHNOLOGIES SAS,ALES,nmb-minebea GmbH,PHILIPS,ALES,PHILIPS,CEST Kompetenzzentrum fur elektrochemische Oberflachentechnologie GmbH,PRESTO,ECP,Heliox,EVG,Infineon Technologies (Germany),Infineon Technologies (Germany),FRONIUS INTERNATIONAL GMBH,Graz University of Technology,CTR,IFD,LETI,University of Applied Sciences Stralsund,KAI,PHILIPS MEDICAL SYSTEMS NEDERLAND,INFINEON TECHNOLOGIES ITALIA Srl,MPG,INFINEON TECHNOLOGIES ITALIA Srl,NANIUM S.A.,IFD,nmb-minebea GmbHFunder: European Commission Project Code: 325608All Research productsarrow_drop_down <script type="text/javascript"> <!-- document.write('<div id="oa_widget"></div>'); document.write('<script type="text/javascript" src="https://beta.openaire.eu/index.php?option=com_openaire&view=widget&format=raw&projectId=corda_______::d90195ff8e13635e35c090b7b8be3137&type=result"></script>'); --> </script>
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