ACP

ACP - ADVANCED CLEAN PRODUCTION GMBH

corporate_fareorganization

Web page: http://www.acp-micron.com/

Country: Germany

ACP

- Funding / Projects
  (2)

2 Projects, page 1 of 1

IMPRESS (Flexible Compression Injection Moulding Platform for Multi-Scale Surface Structures)
assignment_turned_inProject2010 - 2013Partners:LETI, Moldetipo II, Lda, Plastipolis, CZ, BCBG +23 partners
LETI,
Moldetipo II, Lda,
Plastipolis,
CZ,
BCBG,
CSEM,
CZ,
KISTLER INSTRUMENTE AG,
ACP,
CSEM,
BCBG,
Crospon (Ireland),
PEP,
BILLION,
SILLIA,
CGM,
CROSPON LTD,
Moldetipo II, Lda,
FHG,
BILLION,
ACP,
Plastipolis,
PEP,
KISTLER INSTRUMENTE AG,
CGM,
Cardiff University,
Cardiff University,
SILLIA
Funder: European Commission Project Code: 260174
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SEAL (Semiconductor Equipment Assessment Leveraging Innovation)
assignment_turned_inProject2010 - 2013Partners:LETI, RF SUNY , SEMILAB ZRT, MIY, RF SUNY +70 partners
LETI,
RF SUNY ,
SEMILAB ZRT,
MIY,
RF SUNY ,
JO AT,
KLA,
HQ-Dielectrics (Germany),
Intel Corporation,
Ibs (France),
FHWN,
LAM RESEARCH AG,
Metryx,
Infineon Technologies (Germany),
Protec Carrier Systems GmbH,
Infineon Technologies (Germany),
KLA,
Intel (United States),
MEMC,
Ams AG,
Landshut Silicon Foundry,
RMT,
Mapper Lithography (Netherlands),
Mapper Lithography (Netherlands),
FHG,
MIY,
PVA-AS,
Cooperative Program for the Technological Development and Modernization of Coffee,
AMIL,
HQ-D,
GLOBALFOUNDRIES Dresden Module One LLC & Co. KG,
ACP,
Metryx,
FHWN,
LAM RESEARCH AG,
FRT GmbH,
JO AT,
IMEC,
RMT,
IMEC,
SILTRONIC AG,
ICT Integrated Circuit Testing GmbH,
STM CROLLES,
TPI,
GLOBALFOUNDRIES Dresden Module One LLC & Co. KG,
ICT Integrated Circuit Testing GmbH,
SUSS MicroTec Lithography GmbH,
SUSS MICROOPTICS,
SOITEC,
Oxford Instruments (Germany),
SUSS MICROOPTICS,
TPI,
adixen,
FRT GmbH,
SUSS MicroTec Lithography GmbH,
NANDA TECHNOLOGIES GMBH,
adixen,
SUSS MicroTec (Germany),
Ams AG,
SEMILAB ZRT,
SUSS MicroTec Photomask Equipment,
ACP,
Landshut Silicon Foundry,
Oxford Instruments (Germany),
Ibs (France),
NANDA TECHNOLOGIES GMBH,
PVA-AS,
ICN2,
MEMC,
SILTRONIC AG,
SOITEC,
SUSS MicroTec Photomask Equipment,
AMIL,
Protec Carrier Systems GmbH,
SUSS MicroTec (Germany)
Funder: European Commission Project Code: 257379
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ACP

ACP

2 Projects, page 1 of 1

IMPRESS (Flexible Compression Injection Moulding Platform for Multi-Scale Surface Structures)

SEAL (Semiconductor Equipment Assessment Leveraging Innovation)

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