The overarching goal of BEYOND5 is to build a completely European supply chain for Radio-Frequency Electronics enabling new RF domains for sensing, communication, 5G radio infrastructure and beyond. BEYOND5 is first and foremost a technology project gathering most significant European actors covering the entire value chain from materials, semiconductor technologies, designs and components up to the systems. BEYOND5 will drive industrial roadmaps in More than Moore (MtM) in adding connectivity features on existing CMOS Technology. The ambition is to accomplish sustainable Radio Frequency SOI platforms to cover the frequency range from 0.7GHz to more than 100GHz, and to demonstrate the technical advantage of SOI, which allows combining large scale integration, low power consumption, cost competitiveness and higher reliability; thus, resulting in high volume production of trusted components with low environmental impact in Europe. This objective will be achieved in a “Time to Market” approach using the 3 major work streams: 1. Technology enhancement in three European industrial pilot lines: • 300mm RF SOI substrates pilot line in Soitec, supported by the “Substrate Innovation Center” in CEA LETI to prepare future generations. • RF-SOI 65nm pilot line for 5G FEM in ST addressing both sub-6GHz and 28GHz domains. • 22FDX pilot line addressing Digital Signal Processing of radio module and RF reliability, in GF 2. European RF design ecosystem strengthening, based on a large fabless community using FD-SOI and RF-SOI platforms 3. Six Leading edge systems aggregating the value chain to demonstrate added-value of the technology at the user level: • NB IoT for Smart Asset Tracking, • Contactless USB for high-data rate communication, • V2X for autonomous connected trucks, • 5G Low Power Digital Beamforming Base Station for Indoor dense spaces, • Automotive MIMO Radar with embedded AI, • Car Interior Radar for passenger monitoring.

STARLight is a major opportunity to establish Europe at the forefront of 300mm Silicon Photonics (SiPho) innovation and thus “Solidify the European photonics ecosystem and accelerate its industrial deployment”. The main STARLight vision is to contribute to European sovereignty relying on the achievement of an efficient and resilient ecosystem and a sustainable society by driving excellence and innovation in the implementation of 300mm silicon photonics manufacturing capacity in Europe (STMicroelectronics, France). The main STARLight goals are: -To offer Europe a realistic solution ensuring its independency on the sourcing of SiPho and other needed optical module compounds (EIC, laser), based on a true European end-to-end value chain, tailored to the global market. -To give Europe the opportunity to move forward with industrial and academic players by joining in the risk-taking necessary for the growth dynamics of SiPho optical modules in Europe, addressing applications such as Data Centers including Hyperscalers, Artificial Intelligence, Telecom, Automotive Lidar, Inter-Satellites communication. -To expand the European photonics technology platform family in terms of accessibility, upscaling and high yield, packaging assembly and providing modelling tools to converge on a mainstream simulation flow. -To be ready for future applications with 200 GBaud (400 Gbps PAM4/lane) by leveraging leading-edge SiPho technology innovations using the integration of heterogeneous non-silicon materials. -To demonstrate the benefit of SiPho optical modules sustainability, providing a better energy-saving, reliability, limited usage of copper and aluminium materials, and reducing the usage of polluting material and water. The STARLight project makes it possible to promote a concept of collaboration, which is based on an ecosystem bringing together the various actors of the supply chain ranging from the technologies, the circuits providers to the manufacturer of modules and systems.

The European FDSOI family of technology platforms is recognized for its low power consumption, versatility, high radiation hardness, embedded non-volatile memories and exceptional radio frequency capabilities. The objective of the SOIL project is to extend FDSOI technology platforms and broaden their use within the European industry in order to provide Europe with a real alternative to semiconductor supply autonomy using FDSOI semiconductors. We will thus expand a European technology manufactured by European players and suited to the European and Worldwide market. The SOIL project will give Europe the opportunity to move forward with industrial and academic players spanning the value chain by joining in the risk-taking necessary for the growth dynamics of semiconductors for Automotive, Space, IOT and Edge AI domain in Europe. The SOIL project will accelerate the implementation of semiconductor manufacturing based on FDSOI technology, building, and securing the European semiconductor value chain from material to system, supporting the twin green and digital transition. SOIL will expand the family of European FDSOI technology platforms by developing production and innovation capabilities in the following key areas: i) Advanced features: prepare next generation of FDSOI technologies and components; ii) Semiconductor Intellectual Property (SIP) core: reinforce the FDSOI design ecosystem and the supply chain around FDSOI manufacturing; iii) Digital, analog & RF single-chip integration capabilities (Microcontroller Unit; RF communication; RF sensor, e.g. radar). The project will shape the future by developing new technology approaches as well as numerous IPs on advanced applications and will promote the capability and benefits of the technology by providing advanced demonstrations on key applications and comparing the technology. SOIL will strengthen and expand the overall FDSOI ecosystem from material to system.