
Henkel Electronic Materials (Belgium) NV
Henkel Electronic Materials (Belgium) NV
6 Projects, page 1 of 2
Open Access Mandate for Publications assignment_turned_in Project2016 - 2020Partners:GAS NATURAL, NORDSON DIMA, UNIVERSITE DE TOURS, SORIN GROUP, GN RESOUND +65 partnersGAS NATURAL,NORDSON DIMA,UNIVERSITE DE TOURS,SORIN GROUP,GN RESOUND,SOLEMS,Henkel Electronic Materials (Belgium) NV,SKF,O-FLEXX TECHNOLOGIES GMBH,CAIRDAC,OJMAR S.A.,NORDSON BV,IMA,UL,SKF (France),CAIRDAC,FHG,Von Ardenne (Germany),EDITAG,ST-CZ,OPHTIMALIA,ST TOURS,GEMALTO,SOLEMS,LETI,ALPWISE,Evalan,NORDSON DIMA,Maastricht Instruments BV,SKF,ST-CZ,AIRBUS DEFENCE AND SPACE GMBH,BASF Schweiz AG,ENERBEE,CSIC,GN RESOUND,SKF (France),GAS NATURAL,Maastricht Instruments,ALPWISE,PRAYON S.A,BLUMORPHO,MEYER BURGER (NETHERLANDS) BV,TNO,IMA,Von Ardenne (Germany),IDNEO,Evalan,ValoTec,SORIN GROUP,TNO,APPLIED MATERIALS,APPLIED MATERIALS GMBH,UM,ST TOURS,Henkel Electronic Materials (Belgium) NV,MEYER BURGER (NETHERLANDS) BV,OPHTIMALIA,PRAYON S.A,AED,AIRBUS DEFENCE AND SPACE GMBH,ValoTec,OJMAR S.A.,EDITAG,IDNEO,ULiège,BASF Schweiz AG,NORDSON BV,ČVUT,ENERBEEFunder: European Commission Project Code: 692482Overall Budget: 64,564,300 EURFunder Contribution: 16,677,300 EURThe goal of EnSO is to develop and consolidate a unique European ecosystem in the field of autonomous micro energy sources (AMES) supporting Electronic European industry to develop innovative products, in particular in IoT markets. In summary, EnSO multi-KET objectives are: • Objective 1: demonstrate the competitiveness of EnSO energy solutions of the targeted Smart Society, Smart Health, and Smart Energy key applications • Objective 2: disseminate EnSO energy solutions to foster the take-up of emerging markets. • Objective 3: develop high reliability assembly technologies of shapeable micro batteries, energy harvester and power management building blocks • Objective 4: Develop and demonstrate high density, low profile, shapeable, long life time, rechargeable micro battery product family. • Objective 5: develop customizable smart recharge and energy harvesting enabling technologies for Autonomous Micro Energy Source “AMES”. • Objective 6: demonstrate EnSO Pilot Line capability and investigate and assess the upscale of AMES manufacturing for competitive very high volume production. EnSO will bring to market innovative energy solutions inducing definitive differentiation to the electronic smart systems. Generic building block technologies will be customizable. EnSO manufacturing challenges will develop high throughput processes. The ENSo ecosystem will involve all the value chain from key materials and tools to many demonstrators in different fields of application. EnSO work scope addresses the market replication, demonstration and technological introduction activities of ECSEL Innovation Action work program. EnSO relates to several of the Strategic Thrusts of ECSEL MASP. EnSO innovations in terms of advanced materials, advanced equipment and multi-physics co-design of heterogeneous smart systems will contribute to the Semiconductor Process, Equipment and Materials thrust. The AMES will be a key enabling technology of Smart Energy key applications.
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For further information contact us at helpdesk@openaire.euassignment_turned_in Project2012 - 2015Partners:TNO, TNO, Philips GmbH, Roth & Rau AG, Roth & Rau AG +19 partnersTNO,TNO,Philips GmbH,Roth & Rau AG,Roth & Rau AG,Henkel Electronic Materials (Belgium) NV,CSEM,Roth & Rau AG,DTF UK Ltd,CSEM,Henkel Electronic Materials (Belgium) NV,ORBX,EPIGEM LIMITED,PHILIPS ELECTRONICS NEDERLAND B.V.,EPIGEM LIMITED,ORBX,Philips GmbH,DTF UK Ltd,SPGBRABANT RENOVA SPGSCREENS SPGTEXTILE PRINTING G,SPGBRABANT RENOVA SPGSCREENS SPGTEXTILE PRINTING G,TAMPERE UNIVERSITY OF TECHNOLOGY,PHILIPS ELECTRONICS NEDERLAND B.V.,EPFL,TAMPERE UNIVERSITY OF TECHNOLOGYFunder: European Commission Project Code: 314362All Research productsarrow_drop_down <script type="text/javascript"> <!-- document.write('<div id="oa_widget"></div>'); document.write('<script type="text/javascript" src="https://beta.openaire.eu/index.php?option=com_openaire&view=widget&format=raw&projectId=corda_______::9ce003dbdf9e02782549b4761df2b94b&type=result"></script>'); --> </script>
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For further information contact us at helpdesk@openaire.euassignment_turned_in Project2010 - 2013Partners:FHG, ST TOURS, Henkel Electronic Materials (Belgium) NV, Robert Bosch (Germany), INFOTECH AG +7 partnersFHG,ST TOURS,Henkel Electronic Materials (Belgium) NV,Robert Bosch (Germany),INFOTECH AG,Robert Bosch (Germany),LETI,ST TOURS,Henkel Electronic Materials (Belgium) NV,STMicroelectronics (Switzerland),INFOTECH AG,STMicroelectronics (Switzerland)Funder: European Commission Project Code: 247710All Research productsarrow_drop_down <script type="text/javascript"> <!-- document.write('<div id="oa_widget"></div>'); document.write('<script type="text/javascript" src="https://beta.openaire.eu/index.php?option=com_openaire&view=widget&format=raw&projectId=corda_______::ac5b25f66ca7809f4c207a9a2a05184a&type=result"></script>'); --> </script>
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For further information contact us at helpdesk@openaire.euOpen Access Mandate for Publications and Research data assignment_turned_in Project2017 - 2019Partners:DTI, FIOH, Henkel Electronic Materials (Belgium) NV, SWAN, NXP +20 partnersDTI,FIOH,Henkel Electronic Materials (Belgium) NV,SWAN,NXP,HENKEL,CROWN PACKAGING MANUFACTURING UK LIMITED,CPI,DTI,FHG,NXP,SWAN,HENKEL,CPI,PRAGMATIC SEMICONDUCTOR LIMITED,CROWN PACKAGING MANUFACTURING UK LIMITED,NANOGAP,FIOH,PragmatIC Printing Ltd,BSH,BSH,CONTITECH ELASTOMER-BESCHICHTUNGEN GMBH,CONTITECH ELASTOMER-BESCHICHTUNGEN GMBH,Henkel Electronic Materials (Belgium) NV,NANOGAPFunder: European Commission Project Code: 720897Overall Budget: 8,101,380 EURFunder Contribution: 6,820,290 EURThe project targets the incorporation of advanced functional materials to deliver customised conductive inks and flexible adhesives compatible with high volume manufacturing platforms. Specifically the development of these enabling materials will support high speed roll to roll integration of hybrid and large area electronics to address internet of things opportunities The consortium will integrate materials development with end application requirements in terms of technical performance (thermal/electrical conductivity, processing conditions, materials integrity and adhesion) and unit cost of production to facilitate market adoption. The project will utilise and build on existing CPI pilot facilities (R2R print line) to demonstrate technology integration, manufacturability and produce components for end user evaluation to enable the direct comparison of production techniques. The project delivers a supply chain to support future commercialisation: incorporating materials suppliers of inks and adhesives, supporting RTO in Formulation and nano-particle production, established high fidelity print equipment manufacturers, electronic device manufacturers, established pilot line facilities and potential end users from the apparel, packaging and healthcare sector – relating to the internet of things.
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For further information contact us at helpdesk@openaire.euOpen Access Mandate for Publications assignment_turned_in Project2019 - 2022Partners:FHG, IMEC, UL, 3D-Micromac AG, LETI +27 partnersFHG,IMEC,UL,3D-Micromac AG,LETI,Ibs (France),3D-Micromac AG,Ibs (France),Henkel Electronic Materials (Belgium) NV,VALOE OYJ,ISFH,UAB SOLI TEK R&D,VOLTEC SOLAR,UAB VALOE CELLS,CSEM,IMEC,ISSOL SA,VALOE OYJ,UAB SOLI TEK R&D,PI BERLIN,VOLTEC SOLAR,CSEM,PI BERLIN,ISFH,Henkel Electronic Materials (Belgium) NV,APPLIED MATERIALS ITALIA SRL,TNO,TNO,International Solar Energy Research Center Konstanz,ISSOL SA,APPLIED MATERIALS ITALIA SRL,EPFLFunder: European Commission Project Code: 857793Overall Budget: 15,087,600 EURFunder Contribution: 12,870,500 EURThe HighLite project aims to substantially improve the competitiveness of the EU PV manufacturing industry by developing knowledge-based manufacturing solutions for high-performance low-cost modules with excellent environnment profiles (low CO2 footprint, enhanced durability, improved recyclability). To achieve this, the HighLite project focuses on thin (down to 100 µm) high-efficiency crystalline silicon solar cells with passivating contacts and capitalizes on the learnings from previous large funded projects. In HighLite, a unique consortium of experienced industrial actors and leading institutes will work collectively to develop, optimize, and bring to high technology readiness levels (TRL 6-7) innovative solutions at both cell and module levels. In practice, HighLite will demonstrate high-efficiency ¼ size (or smaller) cut solar cells (silicon heterojunction cells with efficiency η ≥ 23.3%, interdigated back-contact cells with η ≥ 24.3%; only 0.2% less than full size cells) in pilot-line manufacturing. Industrial tools will be developed in the project for assembling these cut-cells into high-efficiency modules tailored for various distributed generation (DG) applications. More specifically, the following developments will take place: (1) building-applied PV modules with η ≥ 22% and a carbon footprint ≤ 250 kg-eq.CO2/kWp, (2) building-integrated PV modules with η ≥ 21% and improved shading tolerance, and (3) 3D-curved vehicle-integrated PV modules with η ≥ 20% and a weight ≤ 5 kg/m2. Finally, HighLite aims to show improved cost and performance (both through indoor testing and outdoor demonstrators) against state-of-the-art commercially available modules. Altogether, it is expected that the solutions developed in HighLite will: (1) create more demand in Europe and worldwide for such DG products, (2) significantly improve the competitiveness of industrial actors that are part of the consortium, and (3) trigger significant investment in the EU PV industry.
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