FLEXCOM aims at building a new class of phased arrays technology for airborne, spaceborne and Earth segment satellite communications with an unpreceded level of flexibility and re-configurability. Specifically, FLEXCOM will deliver a highly integrated antenna tile conceived to be the building block through which several SatCom antenna types may be build. The FLEXCOM tiles are designed to be used in different scenarios and for different applications, so responding to the needs of a continuously evolving SatCom market and enforcing a significant reduction of life-cycle costs. The developed tiles by will provide - Broadband TX/RX operations at K/Ka band in a single radiating aperture; - Possibility to adopt two different beamforming cores, namely Hybrid Analog/Digital beamforming or, for the first time for K-Ka SatCom applications, a fully-digital beamforming with direct conversion; - Electronic steering, multibeam and smart antennas functionalities; FLEXCOM will develop and integrate in each tile the following beyond the state-of-the-art subsystems: - TX/RX K/Ka band Analog Front Ends (AFE) based on multicore SiGeBiCMOS RFICs, including phase shifters and down conversion stages; - A Digital Beamforming processor dedicated to satcom applications; - Dual band radiating apertures covering K/Ka satcom and 5G bands. The HYPAC technology will be demonstrated building and testing three prototypes relevant to real use cases: - a prototype for Internet of Things and Machine to Machine applications; - a DRA integrated on a UAV platform; - a feed for a transmit array, intended for High Altitude Platform application. FLEXCOM will contribute to the development of the European research and technology ecosystem combining in the consortium, a strong industrial partnership covering both the SatCom (THALES and TTI) and the 5G network (NOKIA and SIAE) area as well as key players in the supply chain (TE2V, ANTECNICA and EVATRONIX). This partnership will include two academic instit

The objective of the Technology for European iNdependence in Space Image Sensors (TENSIS) project is to develop, manufacture, and validate a scalable, large-area, high-resolution, radiation tolerant, customizable, and affordable, 180nm CMOS detector, with the key technical characteristics of a 24K x 16K format matrix of 400MPixels. The targeted pixel pitch is 3.5µm to keep the overall matrix manufacturable with the proposed X-Fab 0.18µm CMOS Image Sensor process, and with high Full Well Capacity. Overall pixel electro-optical performances including MTF and spectral features will be enhanced by the design and implementation of specific optical stack in Back Side Illumination configuration, combining RGB&NIR filters with flat microlenses. As a by product of the design of the 24K x 16K detector, a 4K x 4K detector will also be designed and manufactured by Te2v in FSI then BSI configuration. Te2v will package produced dies in PCB package and deliver them to Airbus Defence and Space in Toulouse for detailed functional electro-optical characterization. Before this characterization test campaign, Airbus will develop dedicated test means including proximity boards both matching with the 24K x 16K and the 4K x 4K detectors, in close cooperation with Tev. A group of 4K x 4K BSI detectors initially electro-optically characterized by Airbus will then be delivered to ALTER, at Séville to be submitted to dedicated environmental tests, including TID, TNID and heavy ions radiation campaigns as well as burn-in and power on/off cycling tests. Thanks to this test campaign, the 4K x 4K detector die will reach TRL7 by the end of the project . The project will further aim at creating a strategic competitive advantage for the European partners, prime and equipment manufacturers and reduce the dependence on critical technologies and capabilities from outside EU. It will rely on the X-Fab foundry, which is key for the TENSIS project.

The proposed INTERSTELLAR project addresses one critical topic of European non-dependence under the line “High speed DAC-ADC based on European Technology” – analogue-to-digital and digital-to-analogue data converters. E2V designs, manufactures, supplies to the space market these essential components, but faces keen competition from US providers. To preserve know-how and production of such competitive components in Europe and to underscore its efforts for non-dependence, the industrial consortium proposes to develop two new data converters and to mature them to TRL6. A four-channel ADC, sampling at up to 6 GSPs offers ultra-wide input bandwidth, flexibility and high-speed serial outputs. A multi-channel DAC, reconstructing at up to 6 GSPs offers multi-Nyquist output bandwidth, configurable modes and high-speed serial inputs. Using a European semiconductor technology, the new converters shall target performances beyond today’s state-of-the-art to ensure their competitiveness by their delivery dates. Such devices facilitate innovative Rx-to-Tx signal chain solutions for satellite telecommunications, earth observation, navigation and scientific missions. To achieve the challenging objectives set, the four partners have intimate knowledge in space technology and will bring expertise to the project. E2V (F), coordinator, will be in charge of design, manufacturing and test activities. AIRBUS Defence & Space (UK) and THALES ALENIA SPACE (F), the two major European space companies, will make a key contribution as end-users of space data converters – guiding initial requirements and evaluating the devices under relevant conditions. The Fraunhofer Institute (D) will significantly contribute with reference PCBs hosting the new ADC and DAC, thus enabling detailed device evaluation and enhancing the dissemination of the results. Assembling such honed skills within a fruitful cooperation, promises to make the INTERSTELLAR project a great success for the European space industry.