The aim of this research is to fabricate microwave radiating antennas and substrates using nanomaterials. These novel dielectric substrates will facilitate electromagnetic advantages.Antennas are becoming increasingly prevalent in our modern, wireless and digital society; they are crucial for voice and data communication, GPS information and the provision of wireless communication between components of larger integrated systems. Antennas are subject to constant market forces which demand that products and their antennas become cheaper and smaller with improved functionality. With multiple antennas with multiband and MIMO capabilities whilst in very close proximity, for example on a mobile phone, the isolation between the different antennas also requires technological advances for improvement. The establishment of a novel technique to create antennas with improved radiation efficiency would reduce energy consumption.Nanoparticles are typically smaller than one millionth of a metre in at least one dimension and can be combined to form nanomaterials. Yet because the size of nanoparticles is so small and their resultant surface area-to-volume ratio so extremely large, nanomaterials possess a range of very useful and exciting properties. These include proportionately increased electrical conductivity, strength, heat and scratch resistance. Note, we will not be using nano-powders so the health risks will be minimal - and we will take all necessary steps to further minimise them.The use of nanomaterials will fundamentally allow increased versatility and improve functionality by design innovations. This area of research is highly novel as the use of nanomaterials as proposed here has not previously been reported at the application-rich microwave frequencies (wavelength ~ 30cm >> 1 micron). Using such nanomaterials for microwave antennas would allow manufacturing benefits as the antenna, the substrate and RF circuitry can be constructed together and integrated into one process. Currently, antennas designs are limited to certain specific fixed substrate properties. By constructing the substrate from non-metallic nanomaterials, advantageous, novel and heterogeneous substrates, with low losses and desirable electric and magnetic properties, can be produced, which can then be tailored for specific applications. Creating antennas from nanomaterials enables highly conductive and thinner than conventional layers.Intensive simulations using high performance computers will enhance Loughborough University's (LU) recent pilot study of how these novel antennas can behave. When these preparatory stages have been completed, prototype samples and antennas will be fabricated. Initially, geometrically simple antenna designs such as dipoles and patches will be used, enabling extrapolation to more complex antenna geometries later in the project. Once these are created their characteristics will be measured using LU's anechoic chamber, and compared with the simulation results.LU is ideally placed to research this exciting new area. The Communications Group has extensive expertise of simulating, design and measuring antennas and metamaterials. We have assembled an extremely strong multi-disciplinary team which has over 700 journal publications and more than 100 patents and book chapters. The Centre for Renewable Energy Systems Technology (CREST) has the capabilities to produce and characterise our specially made nanostructures. We also have close contacts with Patras University in Greece, which can fabricate nanostructures by an alternative (but viable) method using polymers.

EdgeAI is as a key initiative for the European digital transition towards intelligent processing solutions at the edge. EdgeAI will develop new electronic components and systems, processing architectures, connectivity, software, algorithms, and middleware through the combination of microelectronics, AI, embedded systems, and edge computing. EdgeAI will ensure that Europe has the necessary tools, skills, and technologies to enable edge AI as a viable alternative deployment option to legacy centralised solutions, unlocking the potential of ubiquitous AI deployment, with the long-term objective of Europe taking the lead of Intelligent Edge. EdgeAI will contribute to the Green Deal twin transition with a systemic, cross-sectoral approach, and will deliver enhanced AI-based electronic components and systems, edge processing platforms, AI frameworks and middleware. It will develop methodologies to ease, advance and tailor the design of edge AI technologies by co-ordinating efforts across 48 of the brightest and best R&D organizations across Europe. It will demonstrate the applicability of the developed approaches across a variety of vertical solutions, considering security, trust, and energy efficiency demands inherent in each of these use cases. EdgeAI will significantly contribute to the grand societal challenge to increase the intelligent processing capabilities at the edge.

The European FDSOI family of technology platforms is recognized for its low power consumption, versatility, high radiation hardness, embedded non-volatile memories and exceptional radio frequency capabilities. The objective of the SOIL project is to extend FDSOI technology platforms and broaden their use within the European industry in order to provide Europe with a real alternative to semiconductor supply autonomy using FDSOI semiconductors. We will thus expand a European technology manufactured by European players and suited to the European and Worldwide market. The SOIL project will give Europe the opportunity to move forward with industrial and academic players spanning the value chain by joining in the risk-taking necessary for the growth dynamics of semiconductors for Automotive, Space, IOT and Edge AI domain in Europe. The SOIL project will accelerate the implementation of semiconductor manufacturing based on FDSOI technology, building, and securing the European semiconductor value chain from material to system, supporting the twin green and digital transition. SOIL will expand the family of European FDSOI technology platforms by developing production and innovation capabilities in the following key areas: i) Advanced features: prepare next generation of FDSOI technologies and components; ii) Semiconductor Intellectual Property (SIP) core: reinforce the FDSOI design ecosystem and the supply chain around FDSOI manufacturing; iii) Digital, analog & RF single-chip integration capabilities (Microcontroller Unit; RF communication; RF sensor, e.g. radar). The project will shape the future by developing new technology approaches as well as numerous IPs on advanced applications and will promote the capability and benefits of the technology by providing advanced demonstrations on key applications and comparing the technology. SOIL will strengthen and expand the overall FDSOI ecosystem from material to system.