
EDC
3 Projects, page 1 of 1
Open Access Mandate for Publications and Research data assignment_turned_in Project2021 - 2024Partners:CSEM, X-FAB Dresden, FORD OTOMOTIV SANAYI ANONIM SIRKETI, UTIA, CYBERTRON TECH GMBH +65 partnersCSEM,X-FAB Dresden,FORD OTOMOTIV SANAYI ANONIM SIRKETI,UTIA,CYBERTRON TECH GMBH,STGNB 2 SAS,KTH,STRIKERSOFT,EDC,IMMS GMBH,UGA,TURKCELL,ARCELIK,ARCELIK,BUYUTECH TEKNOLOJI SANAYI VE TICARET ANONIM SIRKETI,Atlas Copco Industrial Technique AB,FHG,CSEM,XGS,EDC,IMEC,GEMALTO,ZF FRIEDRICHSHAFEN AG,BUYUTECH TEKNOLOJI SANAYI VE TICARET ANONIM SIRKETI,TURKCELL,STRIKERSOFT,MICRO-SENSYS GMBH,EMMTRIX,Istanbul Medipol University,SOITEC,Uppsala University,LPL,POLITO,MICRO-SENSYS GMBH,Pfeiffer Vacuum (France),IMEC,CYBERTRON TECH GMBH,ST,IUNET,X-FAB Dresden,FORD OTOMOTIV SANAYI ANONIM SIRKETI,TÜBİTAK,THALES DIS,ST,IMA,THALES DIS,CAS,EMMTRIX,SOITEC,LETI,TU Darmstadt,XGS,STGNB 2 SAS,STMicroelectronics (Switzerland),IMA,UTIA,ZF FRIEDRICHSHAFEN AG,IMMS GMBH,STMicroelectronics (Switzerland),Cooperative Program for the Technological Development and Modernization of Coffee,Pfeiffer Vacuum (France),Melexis (Germany),KNOWTION GMBH,STM CROLLES,Melexis (Germany),ENDIIO ENGINEERING GMBH,Atlas Copco Industrial Technique AB,TÜBİTAK,KNOWTION GMBH,ENDIIO ENGINEERING GMBHFunder: European Commission Project Code: 101007321Overall Budget: 99,414,800 EURFunder Contribution: 24,932,300 EURThe main objective of the storAIge project is the development and industrialization of FDSOI 28nm and next generation embedded Phase Change Memory (ePCM) world-class semiconductor technologies, allowing the prototyping of high performance, Ultra low power and secured & safety System on Chip (SoC) solutions enabling competitive Artificial Intelligence (AI) for Edge applications. The main challenge addressed by the project is on one hand to handle the complexity of sub-28nm ‘more than moore’ technologies and to bring them up at a high maturity level and on the other hand to handle the design of complex SoCs for more intelligent, secure, flexible, low power consumption and cost effective. The project is targeting chipset and solutions with very efficient memories and high computing power targeting 10 Tops per Watt. The development of the most advanced automotive microcontrollers in FDSOI 28nm ePCM will be the support technology to demonstrate the high performances path as well as the robustness of the ePCM solution. The next generation of FDSOI ePCM will be main path for general purpose advanced microcontrollers usable for large volume Edge AI application in industrial and consumer markets with the best compromise on three requirements: performances, low power and adequate security. On top of the development and industrialization of silicon process lines and SoC design, storAIge will also address new design methodologies and tools to facilitate the exploitation of these advanced technology nodes, particularly for high performance microcontrollers having AI capabilities. Activities will be performed to setup robust and adequate Security and Safety level in the final applications, defining and implementing the good ‘mixture’ and tradeoff between HW and SW solutions to speed up adoption for large volume applications.
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For further information contact us at helpdesk@openaire.euassignment_turned_in Project2012 - 2013Partners:EDC, EDC, Chemnitz University of Technology, Chemnitz University of TechnologyEDC,EDC,Chemnitz University of Technology,Chemnitz University of TechnologyFunder: European Commission Project Code: 296681All Research productsarrow_drop_down <script type="text/javascript"> <!-- document.write('<div id="oa_widget"></div>'); document.write('<script type="text/javascript" src="https://beta.openaire.eu/index.php?option=com_openaire&view=widget&format=raw&projectId=corda_______::6ea59996b3899ac36d99a0298da0cfef&type=result"></script>'); --> </script>
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For further information contact us at helpdesk@openaire.euOpen Access Mandate for Publications assignment_turned_in Project2015 - 2019Partners:SenseAir (Sweden), AMS SENSORS GERMANY, Fabmatics (Germany), MENARINI SILICON BIOSYSTEMS SPA, X-FAB Dresden +23 partnersSenseAir (Sweden),AMS SENSORS GERMANY,Fabmatics (Germany),MENARINI SILICON BIOSYSTEMS SPA,X-FAB Dresden,Okmetic,Technikon (Austria),HEIMANN SENSOR GMBH,IMMS GMBH,Technikon (Austria),SYSTEMA,X-FAB Dresden,HEIMANN SENSOR GMBH,Roth & Rau - Ortner GmbH,SenseAir (Sweden),FHG,EDC,SYSTEMA,Fabmatics (Germany),MSB,EDC,SMT DD,KPS Ltd.,AMS SENSORS GERMANY,Okmetic,IMMS GMBH,KPS Ltd.,Roth & Rau - Ortner GmbHFunder: European Commission Project Code: 661796Overall Budget: 38,905,200 EURFunder Contribution: 11,096,400 EURThe “Advanced Distributed Pilot Line for More-than-Moore Technologies” project (ADMONT) is focused on a powerful and versatile More-than-Moore (MtM) pilot line for Europe increasing the diversification of CMOS process technologies. The combination of existing expertise, technological capabilities and the manufacturing capacity of industrial and research partners creates a whole new ecosystem within Europe’s biggest silicon technology cluster “Silicon Saxony”. The distributed pilot line utilizes various MtM platform technologies for sensor and OLED processing in combination with baseline CMOS processes in a unique way and incorporates 2.5D as well as 3D integration of silicon systems into one single production flow. The technology modules, equipment and processes are not located in one single clean room, but are distributed between partners located in Dresden. This local concentration of micro- and nanotechnology facilities has various advantages for potential customer since it enables a short production cycle time and fast delivery. Such distributed MtM pilot line is unique in Europe as well as worldwide and will be implemented as “one-stop-shop” for partners and customer. It is supported by advanced design technologies to address the challenges of modelling and simulation of MtM relevant aspects like reliability, degradation effects, process variability, and IT solution aspects for MtM smart fabrication, fab automation and data processing to generate a smart infrastructure. The distributed pilot line is working as an open platform and is able to integrate future technologies for autonomous and smart system solutions. ADMONT is focused on four main key applications: smart energy, smart mobility, smart health, and smart production and essential capabilities like semiconductor process equipment and materials, design technology and smart system integration. The project consortium is organized and working along the value chain for ECS technologies in Europe.
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