
STGNB 2 SAS
STGNB 2 SAS
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63 Projects, page 1 of 13
assignment_turned_in Project2012 - 2015Partners:GLOBALFOUNDRIES Dresden Module One LLC & Co. KG, STM CROLLES, ST-ERICSSON OY, Helmholtz Association of German Research Centres, LETI +34 partnersGLOBALFOUNDRIES Dresden Module One LLC & Co. KG,STM CROLLES,ST-ERICSSON OY,Helmholtz Association of German Research Centres,LETI,University of Twente,SOITEC,Grenoble Institute of Technology,Ibs (France),IMEC,GLOBALFOUNDRIES Dresden Module One LLC & Co. KG,eSilicon Romania SRL,MENTOR GRAPHICS DEVELOPMENT CROLLES SARL,EAB,Bruco IC,ST,adixen,Ibs (France),adixen,Bruco IC,Acreo,FZJ,IMEC,Acreo,Axiom IC B.V.,STGNB 2 SAS,eSilicon Romania SRL,ST,ST-ERICSSON,Dolphin Design (France),ST-ERICSSON,ST-ERICSSON OY,Cooperative Program for the Technological Development and Modernization of Coffee,MENTOR GRAPHICS DEVELOPMENT CROLLES SARL,Axiom IC B.V.,STGNB 2 SAS,DOLPHIN INTEGRATION,UCL,SOITECFunder: European Commission Project Code: 325633All Research productsarrow_drop_down <script type="text/javascript"> <!-- document.write('<div id="oa_widget"></div>'); document.write('<script type="text/javascript" src="https://beta.openaire.eu/index.php?option=com_openaire&view=widget&format=raw&projectId=corda_______::bffc03c5813b2e4a23039c69b202e39a&type=result"></script>'); --> </script>
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For further information contact us at helpdesk@openaire.euassignment_turned_in Project2014 - 2018Partners:STMicroelectronics (R&D) Ltd, AUDI, EVG, Umicore IR Glass, STGNB 2 SAS +30 partnersSTMicroelectronics (R&D) Ltd,AUDI,EVG,Umicore IR Glass,STGNB 2 SAS,SoftBank Robotics (France),Encapsulix,MICROOLED SARL,EVG,Umicore IR Glass,MCL,STMicroelectronics (R&D) Ltd,MICROOLED SARL,Mediso Kft.,Polaris Vision,Mediso Kft.,MISSING_LEGAL_NAME,Polaris Vision,ULIS,Encapsulix,Fogale nanotech,LETI,University of Edinburgh,ALDEBARAN,ULIS,STGNB 2 SAS,UMICORE,Cooperative Program for the Technological Development and Modernization of Coffee,Fogale nanotech,HORIBA Jobin Yvon IBH Ltd,AUDI,HORIBA Jobin Yvon IBH Ltd,MCL,STM CROLLES,TU DelftFunder: European Commission Project Code: 621200All Research productsarrow_drop_down <script type="text/javascript"> <!-- document.write('<div id="oa_widget"></div>'); document.write('<script type="text/javascript" src="https://beta.openaire.eu/index.php?option=com_openaire&view=widget&format=raw&projectId=corda_______::a96d0a8394ccef17c58b096a4b06f123&type=result"></script>'); --> </script>
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For further information contact us at helpdesk@openaire.euassignment_turned_in Project2010 - 2013Partners:STGNB 2 SAS, CWR, Polytechnic University of Milan, CWR, FHG +8 partnersSTGNB 2 SAS,CWR,Polytechnic University of Milan,CWR,FHG,IMEC,ICCS,STGNB 2 SAS,RWTH,ICCS,STMicroelectronics (Switzerland),IMEC,STMicroelectronics (Switzerland)Funder: European Commission Project Code: 248716All Research productsarrow_drop_down <script type="text/javascript"> <!-- document.write('<div id="oa_widget"></div>'); document.write('<script type="text/javascript" src="https://beta.openaire.eu/index.php?option=com_openaire&view=widget&format=raw&projectId=corda_______::ad020f71c5975f941064b5b30b01be6c&type=result"></script>'); --> </script>
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For further information contact us at helpdesk@openaire.euOpen Access Mandate for Publications assignment_turned_in Project2020 - 2023Partners:Sony Europe B.V., KTH, Sony Europe B.V., FLAVIA IT-Management GmbH, BUYUTECH TEKNOLOJI SANAYI VE TICARET ANONIM SIRKETI +59 partnersSony Europe B.V.,KTH,Sony Europe B.V.,FLAVIA IT-Management GmbH,BUYUTECH TEKNOLOJI SANAYI VE TICARET ANONIM SIRKETI,TRAXENS,MIKROELEKTRONIK LTD,TURKCELL,MU,TRAXENS,Sequans Communications (France),Sequans Communications (France),EAB,Gdańsk University of Technology,MIKROELEKTRONIK LTD,RFBEAM MICROWAVE GMBH,D&R,IMEC,ARBE ROBOTICS LTD,NI,FORD OTOMOTIV SANAYI ANONIM SIRKETI,Anteverta,FORD OTOMOTIV SANAYI ANONIM SIRKETI,STGNB 2 SAS,SMART IS MAKINALARI SANAYI VE TICARET ANONIM SIRKETI,FHG,IMEC,SILTRONIC AG,GLOBALFOUNDRIES Dresden Module One LLC & Co. KG,BUYUTECH TEKNOLOJI SANAYI VE TICARET ANONIM SIRKETI,Bundeswehr University Munich,VIC,Silicon Radar (Germany),MU,TÜBİTAK,TUD,UCL,SILTRONIC AG,SOITEC,Silicon Radar (Germany),VIC,LETI,Lund University,D&R,STGNB 2 SAS,AED,RFBEAM MICROWAVE GMBH,University of Bucharest,Institut Polytechnique de Bordeaux,TURKCELL,MunEDA,TU Delft,Anteverta,TÜBİTAK,ASYGN,SMART IS MAKINALARI SANAYI VE TICARET ANONIM SIRKETI,Cooperative Program for the Technological Development and Modernization of Coffee,NI,SOITEC,MunEDA,ARBE ROBOTICS LTD,GLOBALFOUNDRIES Dresden Module One LLC & Co. KG,FLAVIA IT-Management GmbH,STM CROLLESFunder: European Commission Project Code: 876124Overall Budget: 97,448,096 EURFunder Contribution: 24,872,400 EURThe overarching goal of BEYOND5 is to build a completely European supply chain for Radio-Frequency Electronics enabling new RF domains for sensing, communication, 5G radio infrastructure and beyond. BEYOND5 is first and foremost a technology project gathering most significant European actors covering the entire value chain from materials, semiconductor technologies, designs and components up to the systems. BEYOND5 will drive industrial roadmaps in More than Moore (MtM) in adding connectivity features on existing CMOS Technology. The ambition is to accomplish sustainable Radio Frequency SOI platforms to cover the frequency range from 0.7GHz to more than 100GHz, and to demonstrate the technical advantage of SOI, which allows combining large scale integration, low power consumption, cost competitiveness and higher reliability; thus, resulting in high volume production of trusted components with low environmental impact in Europe. This objective will be achieved in a “Time to Market” approach using the 3 major work streams: 1. Technology enhancement in three European industrial pilot lines: • 300mm RF SOI substrates pilot line in Soitec, supported by the “Substrate Innovation Center” in CEA LETI to prepare future generations. • RF-SOI 65nm pilot line for 5G FEM in ST addressing both sub-6GHz and 28GHz domains. • 22FDX pilot line addressing Digital Signal Processing of radio module and RF reliability, in GF 2. European RF design ecosystem strengthening, based on a large fabless community using FD-SOI and RF-SOI platforms 3. Six Leading edge systems aggregating the value chain to demonstrate added-value of the technology at the user level: • NB IoT for Smart Asset Tracking, • Contactless USB for high-data rate communication, • V2X for autonomous connected trucks, • 5G Low Power Digital Beamforming Base Station for Indoor dense spaces, • Automotive MIMO Radar with embedded AI, • Car Interior Radar for passenger monitoring.
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For further information contact us at helpdesk@openaire.euassignment_turned_in Project2012 - 2016Partners:TNO, TNO, AAU, University of Twente, STGNB 2 SAS +8 partnersTNO,TNO,AAU,University of Twente,STGNB 2 SAS,RWTH,RS,STGNB 2 SAS,GOMSPACE APS,INRIA,Saarland University,GOMSPACE AS,RSFunder: European Commission Project Code: 318490All Research productsarrow_drop_down <script type="text/javascript"> <!-- document.write('<div id="oa_widget"></div>'); document.write('<script type="text/javascript" src="https://beta.openaire.eu/index.php?option=com_openaire&view=widget&format=raw&projectId=corda_______::33574e2734c1146f83091d06baa42148&type=result"></script>'); --> </script>
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