The “Pilot Line for Micro-Transfer-Printing of Functional Components on Wafer Level” project (MICROPRINCE) is focused on creation of a pilot line for heterogeneous integration of smart systems by micro-transfer-printing (µTP) in a semiconductor foundry manufacturing environment. Functional components like processed III/V devices, optical filters, and special sensors will be transfer printed to demonstrate the capabilities of the technology and pilot line. Based on several EU and national research activities demonstrating successfully the feasibility of µTP technology in a scientific and laboratory environment, the MICROPRINCE consortium has the goal to setup the first worldwide open access foundry pilot line for heterogeneous integration by µTP and to demonstrate its capability on five defined target application scenarios. For this purpose, the consortium consisting of 13 partners from four different countries combine their expertise along the value chain from materials and equipment, technology and semiconductor processing, integrated circuit and system design, test and application. The partners are industrial companies incl. SME’s, accompanied by leading research institutes with a clear focus on production and application in Europe. The working principle of the micro-transfer-printing technology is to use a micro-structured elastomer stamp to transfer microscale functional components from their native substrates onto non-native substrates. The lateral dimensions of the functional components can range from a few microns to a few hundreds of microns with thicknesses of only a few microns. The native substrate contains the functional components to be printed and is flexible in size and material. The MICROPRINCE pilot line is acting as a regional and nationwide competence cluster for a novel technology with European dimensions for heterogeneous system integration and supports the ECS industry to reach leadership in key applications.

The BAMBAM project aims at reintegrating the display manufacturing industry in Europe while enabling the era of the low energy µLED for this application. Microprinting of electrical and optical structures and active LEDs pixels (µLED on CMOS) are the solutions implemented in BAMBAM to get rid of the Thin Film Transistor (TFT) arrays controlling LCD and OLED displays; all of them being manufactured in Asia in dedicated expensive, enormous and energy-intensive plants. The new BAMBAM technology relies on the unique active µLEDs on silicon by ALEDIA, where each µLED has its own CMOS driver that can be connected to a low cost substrate by printing of micron scale bussing on any substrate. Following micro-printing by University of Stuttgart of the XTPL's ink, containing Qustom dots color conversion components, on the µLED of Aledia, and their transfer on a low cost substrates by XDC and Xceleprint, the contact ink is micro-printed to connect the active pixel elements to the substrates. The 2 types of display demonstrators, manufactured with this technology, are then adjusted and operated by Barco to achieve the best picture quality at the low energy consumption of the µLED for TV and video walls. The solution is compatible with a high pixel count and low pixel size on flexible substrates. Manufacturing displays in Europe, with a low energy consumption along the life cycle of the product, on low end flexible substrates and low cost, is being prepared by Aledia in its new european manufacturing-line, which is under construction with the help of partners from all over Europe.

Smart systems technologies are evolving towards ever increasing functionality and miniaturisation through the heterogeneous integration of separate components. The ideal integration requires precision placement of multiple types of devices on a substrate to allow their inter-connection. We propose to solve this integration challenge through an exciting new technique called micro-Transfer-Printing (TP) where the essential materials or devices, with thicknesses of a few microns, are separated from their native substrates and are transferred in parallel to the new platform according to the desired positioning while achieving micron-scale placement accuracy. Sequential application of the process enables different components of different functionality to be manipulated in a highly flexible and programmable way making best use of the materials. The TOP HIT project will aggressively develop and validate the TP technology by integrating electronics and photonics components for the magnetic and communication industrie

Data centers which underpin the Cloud are under pressure. As the capacity of data center servers is growing, so must the capacity of the links between those servers. Industry foresees a need for high volumes of 800Gb/s and 1.6Tb/s transceivers by 2025. Today, despite the use of complex Photonic Integrated Circuits (PICs), manufacturing an optical transceiver still requires a large number of sequential steps. This is because lasers and electronic chips need to be assembled on a piece-by-piece basis onto the PIC. The resulting optical engine then needs to be coupled to a fiber array and packaged. These steps are done sequentially, creating a bottleneck in the manufacturing line which makes it hard to scale up production and reduce cost. CALADAN will demonstrate how integration of lasers and electronics onto a PIC can be done fully at the wafer-level using the established micro transfer printing technique, thus eliminating this bottleneck. GaAs quantum dot lasers and 130nm SiGe BiCMOS 56Gbaud capable driver an

The HIPERION consortium has been assembled to answer the call LC-SC3-RES-15-2019: Increase the competitiveness of the EU PV manufacturing industry. The goal of the project is to bring to fruition at the industrial scale a validated high efficiency module-level innovation, based on a disruptive planar optical micro-tracking technology, which concentrates sunlight on multijunction solar cells, mounted on top of a conventional silicon backplate. The resulting high efficiency solar modules (>30% STC under direct sunlight) with a standard flat panel form factor can be mounted on any standard racks or rooftops. The technology has been extensively demonstrated with outdoor tests and pilot installations. It must be now industrialized for mass production, to enable its integration by manufacturers in their existing production lines. The project will demonstrate at pilot-line level the assembly of these high efficiency modules, while several commercial pilot sites across Europe and qualification tests will further