
NXP SEMICONDUCTORS AUSTRIA GMBH & CO KG
NXP SEMICONDUCTORS AUSTRIA GMBH & CO KG
11 Projects, page 1 of 3
Open Access Mandate for Publications and Research data assignment_turned_in Project2021 - 2024Partners:BLOOLOC, NXP Semiconductors, EAB, Technikon (Austria), Telefonica Research and Development +11 partnersBLOOLOC,NXP Semiconductors,EAB,Technikon (Austria),Telefonica Research and Development,Technikon (Austria),TELEFONICA SA,BLOOLOC,KUL,NXP Semiconductors,Graz University of Technology,Lund University,LiU,NXP SEMICONDUCTORS AUSTRIA GMBH & CO KG,Telefonica Research and Development,TELEFONICA SAFunder: European Commission Project Code: 101013425Overall Budget: 4,644,460 EURFunder Contribution: 4,644,460 EURThe REINDEER project will develop a new smart connect-compute platform with a capacity that is scalable to quasi-infinite, and that offers perceived zero latency and interaction with an extremely high number of embedded devices. It will thereto develop “RadioWeaves” technology, a new wireless access infrastructure consisting of a fabric of distributed radio, computing, and storage resources. RadioWeaves can be deployed as panels mounted on walls and ceilings. It brings a large number of antennas and intelligence close to devices offering consistently excellent service at minimal transmit power and making very efficient usage of network bandwidth and energy. Technologically, RadioWeaves advance the ideas of large-scale intelligent surfaces and cell-free wireless access, two theoretical concepts that bear great promise to offer capabilities far beyond 5G networks. We will characterize channels based on measurements and develop distributed platform architectures to realize the great potential in actual deployments. We will develop protocols and algorithms to establish novel resilient interactive applications that require ‘real-time’ and ‘real-space’ cooperation, for future robotized industrial environments, immersive entertainment, and intuitive care, We will co-design focusing algorithms and protocols for enhanced interaction with many energy-neutral devices. REINDEER will provide experimental proof-of-concept in versatile testbeds. Industrial partners fostering innovation team up with academic experts in the REINDEER consortium. The project will reinforce the technological leadership in Europe and create new business opportunities in beyond 5G infrastructure and network operation both licensed and unlicensed bands, the focused vertical domains, and in private networks. We will execute an ambitious communication plan towards industry, pre-standardisation, and a broad public, disseminate through high-impact publications, and organize topical trainings.
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For further information contact us at helpdesk@openaire.euOpen Access Mandate for Publications assignment_turned_in Project2020 - 2023Partners:Gdańsk University of Technology, ITT, HALTIAN, Tieto, TEKNOLOGIAN TUTKIMUSKESKUS VTT OY +90 partnersGdańsk University of Technology,ITT,HALTIAN,Tieto,TEKNOLOGIAN TUTKIMUSKESKUS VTT OY,University of Twente,WESTERMO NETWORK TECHNOLOGIES AB,NXP SEMICONDUCTORS AUSTRIA GMBH & CO KG,RTE,NXP Semiconductors,LEONARDO,AKEO PLUS,AEROPORTI DI PUGLIA S.p.A.,MGEP,UCC,Indra (Spain),WAPICE LTD WAPICE AB,MU,NXP (Netherlands),ST,TIETOEVRY FINLAND OY,MGEP,PHILIPS ELECTRONICS NEDERLAND B.V.,ISS RFID SPOLKA Z OGRANICZONA ODPOWIEDZIALNOSCIA,ST,FSC,ISEP,ABB AB,JOHANNES KEPLER UNIVERSITAT LINZ,HALTIAN EMPATHIC BUILDING OY,KAI,VEMCO SP ZOO,JIG.ES,RTE,Eurotech (Italy),IDEMIA ISF,ACCIONA CONSTRUCCION SA,Tieto,LCM,Klas Telecom,LETI,UPM,VEMCO SP ZOO,KTH,SOCIETA EMILIANA TRASPORTI AUTOFILOVIARI SPA,NURD INNOVATION CENTER,ACCIONA CONSTRUCCION SA,Tieto (Finland),AVL,RISE,CINI ,MDH,ARCELIK,CISC Semiconductor (Austria),HALTIAN EMPATHIC BUILDING OY,VIF,AEROPORTI DI PUGLIA S.p.A.,LIEBHERR CONTAINER CRANES LIMITED,MU,ARCELIK,NXP Semiconductors,Indra (Spain),ISS RFID SPOLKA Z OGRANICZONA ODPOWIEDZIALNOSCIA,Eurotech (Italy),ideXlab (France),PAVO TASARIM URETIM ELEKTRONIK TICARET ANONIM SIRKETI,PHILIPS ELECTRONICS NEDERLAND B.V.,VIF,FSC,CAPGEMINI PORTUGAL SA,CISC Semiconductor (Austria),AKEO PLUS,HALTIAN,JIG.ES,TEKNOLOGIAN TUTKIMUSKESKUS VTT OY,ITT,VORTEX - ASSOCIACAO PARA O LABORATORIO COLABORATIVO EM SISTEMAS CIBER-FISICOS E CIBER-SEGURANCA,JSI,Klas Telecom,PAVO TASARIM URETIM ELEKTRONIK TICARET ANONIM SIRKETI,AVL,SAL,CINI ,VORTEX - ASSOCIACAO PARA O LABORATORIO COLABORATIVO EM SISTEMAS CIBER-FISICOS E CIBER-SEGURANCA,LIEBHERR CONTAINER CRANES LIMITED,SAL,JSI,NURD INNOVATION CENTER,TU Delft,SOCIETA EMILIANA TRASPORTI AUTOFILOVIARI SPA,NXP (Netherlands),LEONARDO,WAPICE LTD WAPICE AB,LCM,KAIFunder: European Commission Project Code: 876038Overall Budget: 44,131,800 EURFunder Contribution: 11,292,400 EURArtificial Intelligence of Things (AIoT) is the natural evolution for both Artificial Intelligence (AI) and Internet of Things (IoT) because they are mutually beneficial. AI increases the value of the IoT through machine learning by transforming the data into useful information, while the IoT increases the value of AI through connectivity and data exchange. Therefore, InSecTT – Intelligent Secure Trustable Things, a pan-European effort with 52 key partners from 12 countries (EU and Turkey), will provide intelligent, secure and trustworthy systems for industrial applications to provide comprehensive cost-efficient solutions of intelligent, end-to-end secure, trustworthy connectivity and interoperability to bring the Internet of Things and Artificial Intelligence together. InSecTT aims at creating trust in AI-based intelligent systems and solutions as a major part of the AIoT, i.e. moving AI to the edge and making AI and ML based systems trustable, explainable and not just a black box. InSecTT will foster cooperation between big industrial players from various domains, a number of highly innovative SMEs distributed all over Europa and cutting-edge research organisations and university. The project features a big variety of industry-driven use cases embedded into various application domains, i.e. smart infrastructure, building, manufacturing, automotive, aeronautics, railway, urban public transport, maritime as well as health. The demonstration of InSecTT solutions in well-known real-world environments like trains, ports, airports and the health sector will generate huge impact on both high and broad level, going from citizens up to European stakeholders. It will establish the EU as a center of intelligent, secure and trustworthy systems for industrial applications enabled by a strong industry with a strong reputation and an informed society, in order to enable products and services based on AI compliant to European values and “Made in Europe".
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For further information contact us at helpdesk@openaire.euOpen Access Mandate for Publications and Research data assignment_turned_in Project2022 - 2025Partners:UNIBO, THALES, E4, SIEMENS, ABSINT +79 partnersUNIBO,THALES,E4,SIEMENS,ABSINT,ABSINT,SIEMENS ELECTRONIC DESIGN AUTOMATION LTD,LETI,AICAS,FHG,TENSOR EMBEDDED GMBH,TUM,University of Twente,SIEMENS ELECTRONIC DESIGN AUTOMATION SARL,NXP (Germany),Infineon Technologies (Germany),VLSI SOLUTION OY,NXP Semiconductors,CODASIP GMBH,Infineon Technologies (Germany),STMicroelectronics (Switzerland),TU Darmstadt,IMEC,Robert Bosch (France),THALES DIS DESIGN SERVICES SAS,NXP SEMICONDUCTORS ROMANIA SRL,SIEMENS ELECTRONIC DESIGN AUTOMATION LTD,POLITO,THALES,NSNFINLAND,NXP (Germany),NXP SEMICONDUCTORS AUSTRIA GMBH & CO KG,THALES DIS,KALMAR,TECHNOLUTION BV,AICAS,NLR,Antmicro Ltd,SIEMENS,Antmicro Ltd,CODASIP GMBH,Robert Bosch (Germany),VLSI SOLUTION OY,NLR,THALES DIS,ACCEMIC TECHNOLOGIES GMBH,HIAB FINALD OY,GREENWAVES TECHNOLOGIES,ECL,MINRES TECHNOLOGIES GMBH,E4,INFINEON TECHNOLOGIES DUISBURG GMBH& CO. KG,HIAB FINALD OY,NSNFINLAND,IMEC,LEONARDO,ACCEMIC TECHNOLOGIES GMBH,YONGATEK,NXP,MINRES TECHNOLOGIES GMBH,Robert Bosch (Germany),STGNB 2 SAS,NXP,KALMAR,EPOS EMBEDDED CORE & POWER SYSTEMS GMBH & CO. KG,THALES DIS DESIGN SERVICES SAS,SIEMENS ELECTRONIC DESIGN AUTOMATION SARL,SEMIFY EU,ECL,SEMIFY EU,TENSOR EMBEDDED GMBH,NXP SEMICONDUCTORS ROMANIA SRL,STMicroelectronics (Switzerland),GREENWAVES TECHNOLOGIES,YONGATEK,IRDETO B.V.,TAMPERE UNIVERSITY,STGNB 2 SAS,SYSGO AG,TECHNOLUTION B.V.,Graz University of Technology,SYSGO AG,Robert Bosch (France),LEONARDOFunder: European Commission Project Code: 101095947Overall Budget: 53,724,200 EURFunder Contribution: 15,430,500 EURTRISTAN’S overarching aim is to expand, mature and industrialize the European RISC-V ecosystem so that it is able to compete with existing commercial alternatives. This will be achieved by leveraging the Open-Source community to gain in productivity and quality. This goal will be achieved by defining a European strategy for RISC-V based designs including the creation of a repository of industrial quality building blocks to be used for SoC designs in different application domains (e.g. automotive, industrial, etc.). The TRISTAN approach is holistic, covering both electronic design automation tools (EDA) and the full software stack. The broad consortium will expose a large number of engineers to RISC-V technology, which will further encourage adoption. This ecosystem will ensure a European sovereign alternative to existing industrial players. The 3-year project fits in the strategy of the European Commission to support the digital transformation of all economic and societal sectors, and speed up the transition towards a green, climate neutral and digital Europe. This transformation includes the development of new semiconductor components, such as processors, as these are considered of key importance in retaining technological and digital sovereignty and build on significant prior investments in knowledge generation in this domain. Development strategies leveraging public research funding that exploit Open-Source have been shown to boost productivity, increase security, increase transparency, allow better interoperability, reduce cost to companies and consumers, and avoid vendor lock-ins. The TRISTAN consortium is composed of 46 partners from industry (both large industries as well as SMEs), research organizations, universities and RISC-V related industry associations, originating from Austria, Belgium, Finland, France, Germany, Israel, Italy, the Netherlands, Poland, Romania, Turkey and Switzerland.
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For further information contact us at helpdesk@openaire.euOpen Access Mandate for Publications assignment_turned_in Project2017 - 2020Partners:SMART INNOVATION OSTFOLD AS, RTE, NXP (Netherlands), TECNALIA, UiO +99 partnersSMART INNOVATION OSTFOLD AS,RTE,NXP (Netherlands),TECNALIA,UiO,Gdańsk University of Technology,TYCO IRELAND LIMITED,SICS,TELLU AS,NSNFINLAND,Signify Netherlands BV,ITT,TYCO IRELAND LIMITED,NSNFINLAND,TEKNOLOGIAN TUTKIMUSKESKUS VTT OY,Robert Bosch (Germany),UCC,NXP (Netherlands),MGEP,EYE NETWORKS AS,PHILIPS ELECTRONICS NEDERLAND B.V.,FSC,Oslo Metropolitan University,TELENOR ASA,RTE,NXP Semiconductors,Indra (Spain),SIEMENS MOBILITY AUSTRIA GMBH,GMVIS SKYSOFT,EAB,IMEC-NL,Indra (Spain),Centria University of Applied Sciences,VEMCO SP ZOO,KTH,Movation (Norway),RISE,Robert Bosch (Germany),CISC Semiconductor (Austria),INTEGRASYS,INTEGRASYS,AIT,SICS,RD VELHO,ACCIONA CONSTRUCCION SA,Oslo Metropolitan University,SIEMENS,EMBRAER,TELLU AS,GMVIS SKYSOFT,TELENOR ASA,SIEMENS MOBILITY AUSTRIA GMBH,SIEMENS,TU/e,UPM,SBA,ACCIONA CONSTRUCCION SA,AVL,IK4-TEKNIKER,FEV POLSKA SPOLKA Z OGRANICZONA ODPOWIEDZIALNOSCIA,TECNALIA,EMBRAER,IMEC-NL,MGEP,Movation (Norway),VIF,VEMCO SP ZOO,JIG.ES,Graz University of Technology,LCM,SBA,Signify Netherlands BV,Klas Telecom,NXP Semiconductors,EYE NETWORKS AS,NXP SEMICONDUCTORS AUSTRIA GMBH & CO KG,FEV POLSKA SPOLKA Z OGRANICZONA ODPOWIEDZIALNOSCIA,Halmstad University,RD VELHO,ISEP,JOHANNES KEPLER UNIVERSITAT LINZ,SMART INNOVATION OSTFOLD AS,WOLFFIA AS,TU Delft,LCM,ITI,ITT,Klas Telecom,AVL,IK4-TEKNIKER,Centria University of Applied Sciences,QPLOX ENGINEERING,FEV EUROPE GMBH,XETAL,XETAL,FEV EUROPE GMBH,JIG.ES,TEKNOLOGIAN TUTKIMUSKESKUS VTT OY,QPLOX ENGINEERING,ITI,PHILIPS ELECTRONICS NEDERLAND B.V.,VIF,FSC,CISC Semiconductor (Austria)Funder: European Commission Project Code: 737422Overall Budget: 38,792,400 EURFunder Contribution: 10,228,000 EURCreating trust in wireless solutions and increasing social acceptance are major challenges to achieve the full potential of the Internet of Things. SCOTT, with 57 key partners from 12 countries (EU + Brazil), will provide efficient solutions of wireless, end-to-end secure, trustworthy connectivity and interoperability to bridge the last mile to the market (TRL 6-7). SCOTT focusses on wireless sensor & actuator networks and communication in mobility, smart infrastructure and health, thus addressing essential European societal challenges and significantly contributing to burning issues such as Automated Vehicles or Industry 4.0. SCOTT is based on 15 industrial use cases with a focus on cross-domain applications and heterogeneous environments, emphasizing 5G and cloud computing aspects. It uses a standardized multi-domain reference architecture, fully compliant with ISO 29182, which fosters reusability, scalability, and interoperability. Nearly 50 reusable technical building blocks will be developed and utilized, proving cross-domain sharing of trustable wireless technologies and services. Finally, more than 20 tangible demonstrators will be presented all over Europe to a broader public. Following a user-centred design to put security and privacy really in the hands of the user, SCOTT will build up and apply a dedicated Trusted System Development Framework to significantly foster acceptance of SCOTT solutions on the market, including the creation of an unprecedented, standardisable ‘privacy labelling’. SCOTT covers full value chains from silicon to end-users/operators showing full vertical integration. Via reference implementations and open innovation approaches as well as close cooperation with AIOTI and other cluster organizations, SCOTT will establish an attractive, long-term eco-system. Ultimately, SCOTT will foster Europe’s independence for security enabling components and systems and will further boost the growing “internet economy”.
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For further information contact us at helpdesk@openaire.euOpen Access Mandate for Publications and Research data assignment_turned_in Project2025 - 2028Partners:PUMACY, IMA, Nordic Engineering Partner AB, VINOTION BV, UNIMORE +45 partnersPUMACY,IMA,Nordic Engineering Partner AB,VINOTION BV,UNIMORE,AI4SEC OU,AITEK,SYSGO AG,SORAMA,CSIC,OTOKAR AS,IMEC-NL,REDIMI GMBH,Nommon Solutions and Technologies (Spain),MDH,ERGUNLER INSAAT PETROL URUNLERI OTOMOTIV TEKSTIL MADENCILIK SU URUNLER SANAYI VE TICARET LIMITED STI.,OTOKAR AS,AI4SEC OU,Charles University,NXP SEMICONDUCTORS AUSTRIA GMBH & CO KG,IMEC-NL,HI Iberia (Spain),HI Iberia (Spain),NXP Semiconductors,Giesecke+Devrient Mobile Security Germany GmbH,Eurotech (Italy),PUMACY,SAL,SYSGO AG,Eurotech (Italy),SOCIETA EMILIANA TRASPORTI AUTOFILOVIARI SPA,SALLY R AB,ERGUNLER INSAAT PETROL URUNLERI OTOMOTIV TEKSTIL MADENCILIK SU URUNLER SANAYI VE TICARET LIMITED STI.,STREAM ANALYSE SWEDEN AB,BUT,FHG,BITNET BILISIM HIZMETLERI LIMITED SIRKETI,Nommon Solutions and Technologies (Spain),UPM,SWECO,VINOTION BV,SORAMA,SAL,TUT,BITNET BILISIM HIZMETLERI LIMITED SIRKETI,IMA,AITEK SPA,SWEGREEN AB,UNIPR,STREAM ANALYSE SWEDEN ABFunder: European Commission Project Code: 101194287Overall Budget: 27,213,500 EURFunder Contribution: 8,548,300 EURData and AI-driven smart technologies, with an emphasis on (i) the connection between the urban space and the industrial space, (ii) sustainable living and (ii) sustainable industrial production, hold the transformative potential to enhance the sustainability and climate resilience across EU, in private and work spaces. Assuming this, NexTArc is devoted to augmenting the adoption of Trustworthy edge AI and IoT across 3 complementary and interrelated application domains, organised as Use Cases (UC): SLN - Smart, sustainable and Liveable Neighbourhood in Urban Spaces; STI - Smart, sustainable and transparent industrial Spaces; and TEM - Trustworthy and Eco-friendly Multimodal Connectivity of Urban and Industrial Spaces through people and freight mobility, incl. the inter and intra-mobility. Building on this vision, NexTArc aims to promote the cross-fertilization of ideas among a broad spectrum of stakeholders, 38 partners in 10 countries, integrated over a four-fold Innovation Module (IM) approach: i) cyber-resilience on chip; ii) low-power embedded AI; iii) improved computation and dependability covering the high-performance needs; iv) holistic solution stack to enable trustworthy services, which resonate with the EU Chips Act, etc. NexTArc has identified 6 Specific Objectives: 1) Driving adoption of AI while enhancing connectivity preparedness; 2) Targeting a 40% increase in data transmission rates and a 30% reduction in energy use during data processes, while ensuring robust architectural resilience; 3) Fortifying cyber-physical security with an aim for full-compliance with EU’s Chip and Cybersecurity act; 4) Realising open HW/SW to ensure designs that are secure, safe, private, and accountable; 5) Proactively adapting to the dynamic landscape of open-source innovations and key industry standards; 6) Orchestrating 4 IM, unveiling 15 Key Innovations to develop the solutions that are needed for Europe to take the technological lead towards a sustainable society.
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