
KAI
12 Projects, page 1 of 3
Open Access Mandate for Publications assignment_turned_in Project2015 - 2018Partners:UiO, University of Graz, TUD, SILTRONIC AG, DELTA ELECTRONICS (NORWAY) +34 partnersUiO,University of Graz,TUD,SILTRONIC AG,DELTA ELECTRONICS (NORWAY),IFD,FORES,Ikerlan,QUANTEMOL LIMITED,MPIE,CISC Semiconductor (Austria),CTR,PLANSEE SE,BESI,University of Bristol,NANODESIGN,INFINEON TECHNOLOGIES ITALIA Srl,MEMSSTAR LTD,TRYMAX SEMICONDUCTOR EQUIPMENT BV,UNIPD,NaMLab gGmbH,CSIC,FHG,PAC TECH,Besi Netherlands BV,Infineon Technologies (Austria),FRONIUS INTERNATIONAL GMBH,IMEC,SPTS Technologies (United Kingdom),KAI,STU,BAUMANN GMBH,Fabmatics (Germany),Infineon Technologies (Germany),FCM,greenpower,Ams AG,SOITEC BELGIUM NV,NFAGFunder: European Commission Project Code: 662133Overall Budget: 90,254,496 EURFunder Contribution: 19,196,500 EURThe key objective of PowerBase “Enhanced substrates and GaN pilot lines enabling compact power applications” is to ensure the availability of Electronic Components and Systems (ECS) for key markets and for addressing societal challenges, aiming at keeping Europe at the forefront of the technology development, bridging the gap between research and exploitation, creating economic and employment growth in the European Union. The project PowerBase aims to contribute to the industrial ambition of value creation in Europe and fully supports this vision by addressing key topics of ECSEL multi annual strategic plan 2014. By positioning PowerBase as innovation action a clear focus on exploitation of the expected result is primary goal. To expand the limits in current power semiconductor technologies the project focuses on setting up a qualified wide band gap GaN technology Pilot line, on expanding the limits of today’s silicon based substrate materials for power semiconductors, improving manufacturing efficiency by innovative automation, setting up of a GaN compatible chip embedding pilot line and demonstrating innovation potential in leading compact power application domains. PowerBase is a project proposal with a vertical supply chain involved with contributions from partners in 7 European countries. This spans expertise from raw material research, process innovation, pilot line, assembly innovation and pilot line up to various application domains representing enhanced smart systems. The supporting partners consist of market leaders in their domain, having excellent technological background, which are fully committed to achieve the very challenging project goals. The project PowerBase aims to have significant impact on mart regions. High tech jobs in the area of semiconductor technologies and micro/nano electronics in general are expressed core competences of the regions Austria: Carinthia, Styria, Germany: Sachsen, Bavaria and many other countries/ regions involved.
more_vert Open Access Mandate for Publications assignment_turned_in Project2018 - 2021Partners:Ibermática (Spain), Elmos Semiconductor (Germany), TUD, SYSTEMA, AIT +35 partnersIbermática (Spain),Elmos Semiconductor (Germany),TUD,SYSTEMA,AIT,camLine,YAZZOOM,University of Bucharest,SIRRIS,Infineon Technologies Romania and CO. Societate in Comandita Simpla,IFD,UTC-N,University of Hagen,INFINEON TECHNOLOGIES ITALIA Srl,CISC Semiconductor (Austria),Regensburg University of Applied Sciences,G&D,Know Center,UNIMIB,WHZ,FHG,TTTECH INDUSTRIAL AUTOMATION AG,Dresden University of Applied Sciences,ECCENCA,TUW,Infineon Technologies (Austria),Zittau/Görlitz University of Applied Sciences,TTTech Computertechnik (Austria),University of Siegen,JEMA,IFKL,EVOLARIS,AAU,Infineon Technologies (Germany),WU,KAI,AKTING,AVL,TECNALIA,VIFFunder: European Commission Project Code: 783163Overall Budget: 47,021,900 EURFunder Contribution: 10,896,500 EURThe main objective of the iDev40 project proposal is to achieve a disruptive or “breakthrough change” step toward speedup in time to market by digitalising the European industry, closely interlinking development processes, logistics and manufacturing. Ultimately, the project aims at suitable digital technology advancements to strengthen the electronic components and systems industry in Europe. It addresses various industrial domains with one and the same approach of digitalisation towards competitive and innovative solutions. The new concept of introducing seamlessly integrated development together with automation and network solutions as well as enhancing the transparency of data, their consistence, flexibility and overall efficiency will lead to a significant speedup in the time to market (T2M) race. iDev40’s unique approach addresses: • AI learning, Data Life Cycle Management and IP Protection • Embedding Digital Development in Digital Production (the digital twin) • Close the Knowledge loop in product life cycle management along the supply chain • Collaboration 4.0 and Development of highly skilled R&D and Manufacturing Teams • Prove the innovated technologies on selected use cases in real productive environment Progress in mastering these challenges will significantly impact the productivity of future design processes embedded in an Industrial Internet environment. The global state-of-art technologies already offer tremendous diagnostics algorithms, machine controls, simulators, optimizers, etc., but only an extensive framework like iDev40 can combine them into effective integration into the development process enabling such powerful simulations like “digital twins” that ever more govern the hardware, manufacturing service and business functions. To cope with the exceptional complexity it becomes even more crucial to be competitive leaders in developing virtual representations of real physical implementation.
more_vert assignment_turned_in Project2013 - 2016Partners:University of Leoben, PHILIPS, nmb-minebea GmbH, TUD, CEST Kompetenzzentrum fur elektrochemische Oberflachentechnologie GmbH +27 partnersUniversity of Leoben,PHILIPS,nmb-minebea GmbH,TUD,CEST Kompetenzzentrum fur elektrochemische Oberflachentechnologie GmbH,EMOSS,INFINEON TECHNOLOGIES ITALIA Srl,PHILIPS MEDICAL SYSTEMS NEDERLAND,TU/e,CEA,Heliox,Graz University of Technology,IFD,CTR,PLANSEE SE,NANIUM S.A.,FHG,MPG,Infineon Technologies (Austria),FRONIUS INTERNATIONAL GMBH,adixen,Ams AG,LEAR,ALES,SPTS TECHNOLOGIES SAS,INL,Infineon Technologies (Germany),EVG,PRESTO,KAI,University of Applied Sciences Stralsund,ECPFunder: European Commission Project Code: 325608more_vert Open Access Mandate for Publications assignment_turned_in Project2019 - 2022Partners:LIND, TELLU AS, PODCOMP, TUD, Robert Bosch (Germany) +81 partnersLIND,TELLU AS,PODCOMP,TUD,Robert Bosch (Germany),AVCR,BUTE,SYSTEMA,AIT,Eurotech (Italy),TU/e,ROPARDO,TECHNEXT,Ikerlan,Luleå University of Technology,ifak e. V. Magdeburg,DOTGIS,NOVA,SAP NORWAY AS,INQUERY LABS CLOSED COMPANY LIMITEDBY SHARES,ČVUT,Jotne,ACCIONA CONSTRUCCION SA,MONDRAGON CORPORACION COOPERATIVA SCOOP,Latvian Academy of Sciences,Carlos III University of Madrid,ECL,VTC,CEA,SIRRIS,HiØ,NTNU,AEE INTEC,BUT,SANTER REPLY,IFD,THE REUSE COMPANY,CAMEA,MSI,SEMANTIS INFORMATION BUILDERS GMBH,IECS,LUNDQVIST TRAVARU AB,ULMA Embedded Solutions,BOSCH SOFTWARE INNOVATIONS GMBH,PHILIPS MEDICAL SYSTEMS NEDERLAND,IUNET,EQUA SOLUTIONS AG,WAPICE LTD WAPICE AB,Dresden University of Applied Sciences,ICT,DAC.DIGITAL JOINT-STOCK COMPANY,CISC Semiconductor (Austria),3E,UMT,STGNB 2 SAS,TECHNOLUTION BV,FAGOR AUTO,Infineon Technologies (Austria),BOLIDEN MINERAL AB,Gdańsk University of Technology,BEIA,STMicroelectronics (Switzerland),Infineon Technologies (Germany),INCQUERY LABS RESEARCH AND DEVELOPMENT LTD,TEKNOLOGIAN TUTKIMUSKESKUS VTT OY,EDMS,EVOPRO INNOVATION KFT,ABB OY,MGEP,POLITO,University of Lübeck,Magillem Design Services,AITIA International Zrt.,BnearIT (Sweden),UTIA,CSC,ASTUCE,ASML (Netherlands),FORSCHUNG BURGENLAND GMBH,KAI,EXPLEO GERMANY GMBH,FAGOR ARRASATE S COOP,EQUA Simulation (Sweden),RHEINLAND-PFALZISCHE TECHNISCHE UNIVERSITAT,VIF,ARCELIKFunder: European Commission Project Code: 826452Overall Budget: 83,757,200 EURFunder Contribution: 21,155,000 EURFor the purpose of creating digitalisation and automation solutions Arrowhead Tools adresses engineering methodologies and suitable integrated tool chains. With the global aim of substantial reduction of the engineering costs for digitalisation/automation solutions. Thus the Arrowhead Tools vision is: - Engineering processes and tool chains for cost efficient developments of digitalization, connectivity and automation systems solutions in various fields of application For the further and wider commercialisation of automation and digitalisation services and products based on SOA, Arrowhead Framework and similar technologies there is a clear need for engineerings tools that integrates existing automation and digitalisation engineering procedures and tool with SOA based automation/digitalisation technology. For this purpose the Arrowhead Tool’s grand challenges are defined as: - Engineering costs reduction by 40-60% for a wide range of automation/digitalisation solutions. - Tools chains for digitalisation and automation engineering and management, adapted to: 1. existing automation and digitalisation engineering methodologies and tools 2. new IoT and SoS automation and digitalisation engineering and management tools 3. security management tools - Training material and kits for professional engineers The results will create impact on: - Automation and digitalisation solution market - Automation and engineering efficiency and the SSBS market - Automation and digitalisation security - Competence development on engineering of automation and digitalisation solution
more_vert Open Access Mandate for Publications assignment_turned_in Project2020 - 2023Partners:Elmos Semiconductor (Germany), University of L'Aquila, SCHWEIZER ELECTRONIC AG, FTZ, TUD +80 partnersElmos Semiconductor (Germany),University of L'Aquila,SCHWEIZER ELECTRONIC AG,FTZ,TUD,NANODESIGN,University of Bremen,IWO,ULMA Embedded Solutions,INFINEON TECHNOLOGIES ITALIA Srl,INMOTION TECHNOLOGIES AB,RISE,ON SEMICONDUCTOR TECHNOLOGY,BATZ,Ikerlan,Carlos III University of Madrid,TU Delft,SIRRIS,ELAPHE PROPULSION TECHNOLOGIES LTD,Graz University of Technology,IFD,TEKNE,GPL,EDR & MEDESO,PAVO TASARIM URETIM ELEKTRONIK TICARET ANONIM SIRKETI,HSG-IMIT,FORCIOT OY,Chemnitz University of Technology,CSIC,ENFORMA BILISIM,WHZ,FHG,PUMACY,Okmetic,IUNET,UMT,TUW,Infineon Technologies (Austria),BelGaN,UMS,WAT MOTOR,MCL,IMEC,RBDD,AALTO,MU,NANIUM S.A.,LFOUNDRY SRL,JSI,IFKL,UNIVERSITE LYON 1 CLAUDE BERNARD,THE REUSE COMPANY,X-FAB Dresden,Scania (Sweden),PLASTIC OMNIUM ADVANCED INNOVATIONAND RESEARCH,KAI,NEXPERIA BV,UCLM,IVF,X-FAB SEMICONDUCTOR,NINIX TECHNOLOGIES NV,Infineon Technologies (Germany),Plastic Omnium (France),TEKNOLOGIAN TUTKIMUSKESKUS VTT OY,BSH,Screentec,STU,III V Lab,SENSITEC GMBH,JIACO INSTRUMENTS BV,FOUNDATION FOR RESEARCH AND TECHNOLOGYHELLAS,HAN,LIS,TECNOLOGICA,AVL,AT&S (Austria),THALES,VIF,ARCELIK,MINDCET NV,QRTECH,Ams AG,Signify Netherlands BV,CAF,LEC GMBHFunder: European Commission Project Code: 876659Overall Budget: 102,525,000 EURFunder Contribution: 24,862,600 EURIntelligent Reliability 4.0 (iRel40) has the ultimate goal of improving reliability for electronic components and systems by reducing failure rates along the entire value chain. Trend for system integration, especially for heterogeneous integration, is miniaturization. Thus, reliability becomes an increasing challenge on device and system level and faces exceptional requirements for future complex applications. Applications require customer acceptance and satisfaction at acceptable cost. Reliability must be guaranteed when using systems in new and critical environments. In iRel40, 79 partners from 14 countries collaborate in 6 technical work packages along the value chain. WP1 focuses on specifications and requirements. WP2 and WP3 focus on modelling, simulation, materials and interfaces based on test vehicles. WP4 applies the test vehicle knowledge to industrial pilots related to production. WP5 applies the knowledge to testing. WP6 focuses on application use cases applying the industrial pilots. We assess and validate the iRel40 results. Reliable electronic components and systems are developed faster and new processes are transferred to production with higher speed. Crucial insight gained by Physics of Failure and AI methods will push overall quality levels and reliability. iRel40 results will strengthen production along the value chain and support sustainable success of Electronic Components and Systems investment in Europe. By collaboration between academy, industry and knowledge institutes on this challenging topic of reliability, the project secures more than 25.000 jobs in the 25 participating production and testing sites in Europe. The project supports new applications and reliable chips push applications in energy efficiency, e-mobility, autonomous driving and IoT. This unique project brings, for the first time ever, world-leading reliability experts and European manufacturing expertise together to generate a sustainable pan-European reliability community.
more_vert
chevron_left - 1
- 2
- 3
chevron_right