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MSEMICON TEORANTA

Country: Ireland

MSEMICON TEORANTA

2 Projects, page 1 of 1
  • Funder: European Commission Project Code: 101000169
    Overall Budget: 5,675,190 EURFunder Contribution: 4,415,250 EUR

    The Auto-DAN project aims to enable homes and small businesses across the EU to optimize their energy consumption and provide an assessment of the live energy performance of a building which takes into account the quality of appliances/systems installed, user operational habits and the smart readiness of a building.The solution is rooted in augmented intelligence which will focus on the assistive role automation will have in buildings, emphasizing the fact that cognitive technology is designed to enhance human intelligence rather than replace it and that the occupant is a proactive component of the building. Augmented Intelligence enhances a self-optimisation solution as it is a mix of automated controls with user interaction which will maximise the savings of a building in operation. To enable this step-change, the Auto-DAN project will deliver a trebled-structured project framework that evaluates the actual energy performance of EU buildings and provide building users with the awareness to proactively optimize their energy use. The following, lists the subdivisions of the solution: • Smart Hardware Infrastructure - Adaptable hardware strategy that can be applied to all building types and features to ensure maximum replicabilbilty of the Auto-DAN solution across the EU building stock. • Inter-operable Software Architecture - The data analysis platform iSCAN will be used as a foundation for self-optimizing and self-assessing EU buildings stock complemented by 2 analytical features that provides optimisation actions. Those features are a 1. Digital Occupancy Model and a 2. Digital Twin. • Self-Energy Assessment Framework - Generates an automated, dynamic and continuous energy performance assessmentd erived from the monitoring of the energy consumption at building level, dis-aggregated monitoring at an appliance/system level and incorporates existing EU energy regulations (e.g. EPBD, ECO Design, SRI, and Energy Labeling).

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  • Funder: European Commission Project Code: 101129613
    Overall Budget: 3,554,290 EURFunder Contribution: 3,554,290 EUR

    Future technological innovations in areas such as the Internet of things and wearable electronics require cheap, easily deformable and reasonably performing printed electronic circuitries. However, current state-of-the-art (SoA) printed electronic devices show mobilities of ~10 cm2/Vs, about ×100 lower than traditional Si-electronics. A promising solution to print devices from 2D semiconducting nanosheets gives relatively low mobilities (~0.1 cm2/Vs) due to the rate-limiting nature of charge transfer (CT) across inter-nanosheet junctions. By minimising the junction resistance RJ, the mobility of printed devices could match that of individual nanosheets, i.e., up to 1000 cm2/Vs for phosphorene, competing with Si. HYPERSONIC is a high-risk, high-gain interdisciplinary project exploiting new chemical and physical approaches to minimise RJ in printed nanosheet networks, leading to ultra-cheap printed devices with a performance ×10–100 beyond the SoA. The chemical approach relies on chemical crosslinking of nanosheets with (semi)conducting molecules to boost inter-nanosheet CT. The physical approach involves synthesising high-aspect-ratio nanosheets, leading to low bending rigidity and increased inter-nanosheet interactions, yielding conformal, large-area junctions of >10e4 nm2 to dramatically reduce RJ. Our radical new technology will use a range of n- or p-type nanosheets to achieve printed networks with mobilities of up to 1000 cm2/Vs. A comprehensive electrical characterisation of all nanosheet networks will allow us to not only identify those with ultra-high mobility but also to fully control the relation between basic physics/chemistry and network mobility. We will demonstrate the utility of our technology by using our best-performing networks as complementary field-effect devices in next- generation, integrated, wearable sensor arrays. Printed digital and analog circuits will read and amplify sensor signals, demonstrating a potential commercialisable application.

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