
OY EVERON AB
OY EVERON AB
2 Projects, page 1 of 1
Open Access Mandate for Publications assignment_turned_in Project2019 - 2022Partners:Almae Technologies SAS, DUSTPHOTONICS LTD, ALBIS OPTOELECTRONICS AG, IMEC, University of Turku +57 partnersAlmae Technologies SAS,DUSTPHOTONICS LTD,ALBIS OPTOELECTRONICS AG,IMEC,University of Turku,USN,PRECORDIOR OY,DUSTPHOTONICS LTD,WURTH ELEKTRONIK GMBH & CO KG,EVG,BESI,CSEM,GEHC.FI,EVG,PAC TECH,VAISALA OYJ,JSR MICRO NV,mediri GmbH,OY EVERON AB,IDEAS,Cardiaccs (Norway),ALBIS OPTOELECTRONICS AG,ICOS,IMEC-NL,Ams AG,CSEM,Afore Oy,JSR MICRO NV,AALTO,Besi Netherlands BV,OSYPKA,Afore Oy,GEHC.FI,BESI,mediri GmbH,IDEAS,APC,Latvian Academy of Sciences,Ams AG,ICOS,SEMILAB ZRT,PAC TECH,FHG,IMEC,Disco (Germany),Almae Technologies SAS,PRECORDIOR OY,WURTH ELEKTRONIK GMBH & CO KG,VAISALA OYJ,APC,IECS,Cardiaccs (Norway),OY EVERON AB,Disco Hi-Tec Europe Gmbh,OSYPKA,IMEC-NL,ROODMICROTEC,Besi Netherlands BV,Mellanox Technologies (Israel),SEMILAB ZRT,ROODMICROTEC,Mellanox Technologies (Israel)Funder: European Commission Project Code: 826588Overall Budget: 34,558,700 EURFunder Contribution: 8,561,600 EURThe strong drive for more complex systems and more advanced packaging, including optics and photonics, creates a chance to retain the manufacturing and packaging value chain to Europe - or even start to bring it back. APPLAUSE supports this by building on the European expertise in advanced packaging and assembly to develop new tools, methods and processes for high volume mass manufacturing of electrical and optical components. The technologies will be piloted in 5 industrial Use Cases, related to 1. Substantially smaller 3D integrated ambient light sensor for mobile and wearable applications (AMS) 2. High performance, low cost, uncooled thermal IR sensor for automotive and surveillance applications (IDEAS) 3. High speed Datacom transceivers with reduced manufacturing costs (DustPhotonics) 4. Flexible cardiac monitoring patch and miniaturized cardiac implants with advanced monitoring capabilities (GE Healthcare and Cardiaccs) 6. Optical water measurement modules with cost-effective packaging of components (Vaisala) The APPLAUSE consortium is built of a number of leading experts from European electronics packaging companies representing different value chain levels related to advanced packaging and smart system integration. The parties have complementary expertise in conception, design, packaging, testing and manufacturing of electronic components, as well as a wide range of expertise from several different end use areas. The unique European ecosystem established within the consortium represents the competitive, leading edge of the technologies available.
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For further information contact us at helpdesk@openaire.euOpen Access Mandate for Publications assignment_turned_in Project2020 - 2023Partners:PHILIPS MEDICAL SYSTEMS NEDERLAND, UCC, PRECORDIOR OY, PHILIPS ELECTRONICS NEDERLAND B.V., HI Iberia (Spain) +113 partnersPHILIPS MEDICAL SYSTEMS NEDERLAND,UCC,PRECORDIOR OY,PHILIPS ELECTRONICS NEDERLAND B.V.,HI Iberia (Spain),MCS,LIN INL,BESI,www.gobiond.com,CORTEC,INPHER SARL,EVG,INESC ID,University of Turku,AEDUS SPACE KORLATOLT FELELOSSEGU TARSASAG,EK,EVG,CSEM,IRBLEIDA,Micronit Microfluidics (Netherlands),ICAS,Micronit Microfluidics (Netherlands),INPHER SARL,Okmetic,MICRONIT BV,REMOTEA OY,IT,Salvia BioElectronics,TEKNOLOGIAN TUTKIMUSKESKUS VTT OY,IMEC,TU/e,University of Freiburg,3db,FUNDACION INSTITUTO DE INVESTIGACION SANITARIA ARAGON,OY EVERON AB,Microfluidic ChipShop (Germany),ANSEM,THALES DIS FINLAND OY,KIT,IRBLEIDA,Salvia BioElectronics,IMEC-NL,CSEM,SILICONGATE LDA,DYB DYCONEX SA DYCONEX LTD,Roma Tre University,MENARINI SILICON BIOSYSTEMS SPA,HI Iberia (Spain),UNIPV,OSYPKA,EMFIT,www.gobiond.com,AESCULAP AG,BESI,INESC ID,BEONCHIP SL,MicroLIQUID (Spain),FHG,DYB DYCONEX SA DYCONEX LTD,ANSEM,INESC MICROSISTEMAS E NANOTECNOLGIAS-INSTITUTO DE,BEONCHIP SL,Integer,INSPHERO,IMEC,AbbVie Ireland NL B.V.,LABORATORIO IBERICO INTERNACIONAL DE NANOTECNOLOGIA LIN,PDM&FC,ICSENSE,3db,BSL,CORTEC,MicroLIQUID (Spain),PDM&FC,STMicroelectronics (Switzerland),TEKNOLOGIAN TUTKIMUSKESKUS VTT OY,INSPHERO,MICRONIT BV,HUN-REN CENTRE FOR ENERGY RESEARCH,BOSTON SCIENTIFIC CORK LIMITED,Besi Netherlands BV,TNO,Okmetic,TNO,INESC MICROSISTEMAS E NANOTECNOLGIAS-INSTITUTO DE,PHILIPS MEDICAL SYSTEMS NEDERLAND,UM,OY EVERON AB,STMicroelectronics (Switzerland),OSYPKA,SILICONGATE LDA,University of Zaragoza,IHS WEIGLING SOCIEDAD LIMITADA,EMFIT,UPV/EHU,IMEC-NL,PICOSUN OY,Integer,Besi Netherlands BV,MSB,FUNDACION INSTITUTO DE INVESTIGACION SANITARIA ARAGON,Roma Tre University,Microfluidic ChipShop (Germany),AEDUS SPACE KORLATOLT FELELOSSEGU TARSASAG,ICSENSE,IHS WEIGLING SOCIEDAD LIMITADA,AESCULAP AG,TUW,GAUDLITZ GMBH,PHILIPS ELECTRONICS NEDERLAND B.V.,GAUDLITZ GMBH,PRECORDIOR OY,TU Delft,University of Florence,REMOTEA OY,MCS,AbbVie Ireland NL B.V.,PICOSUN OYFunder: European Commission Project Code: 876190Overall Budget: 66,084,700 EURFunder Contribution: 16,947,200 EURCompared to the pace of innovation in electronic consumer products, the pace of innovation for medical devices is lagging behind. It is the overarching objective of Moore4Medical to accelerate innovation in electronic medical devices. Moore4Medical emerging medical applications that offer significant new opportunities for the ECS industry including: active implantable devices (bioelectronic medicines), organ-on-chip, drug adherence monitoring, smart ultrasound, radiation free interventions and continuous monitoring. The new technologies will help fighting the increasing cost of healthcare by: reducing the need for hospitalization, helping the development of personalized therapies, and realizing intelligent point-of-care diagnostic tools. Moore4Medical will bring together 68 specialists from 12 countries who will develop open technology platforms for these emerging fields to help them bridge “the Valley of Death” in shorter time and at lower cost. Open technology platforms used by multiple users for multiple applications with the prospect of medium to high volume markets are an attractive proposition for the European ECS industry. The combination of typical MedTech applications with an ECS style platform approach will enhance the competitiveness for the emerging medical domains addressed in Moore4Medical. With value and IP moving from the technology level towards applications and solutions, defragmentation and open technology platforms will be key in acquiring and maintaining a premier position for Europe in the forefront of affordable healthcare
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