
Merlin Circuits
Merlin Circuits
7 Projects, page 1 of 2
assignment_turned_in Project2015 - 2018Partners:Merlin Circuits, Weidlinger Associates, Semefab Scotland Ltd, AFM, University of Glasgow +15 partnersMerlin Circuits,Weidlinger Associates,Semefab Scotland Ltd,AFM,University of Glasgow,Weidlinger Associates,University of Glasgow,NATIONAL INSTRUMENTS CORPORATION(UK) LIMITED,Diagnostic Sonar (United Kingdom),Semefab Scotland Ltd,Precision Acoustics (United Kingdom),Disco (Germany),Precision Acoustics (United Kingdom),Disco Hi-Tec Europe Gmbh,NPL,Diagnostic Sonar (United Kingdom),AFM,Merlin Circuits,NATIONAL INSTRUMENTS CORPORATION(UK) LIMITED,NPLFunder: UK Research and Innovation Project Code: EP/K034537/2Funder Contribution: 3,210,630 GBPCapsule endoscopy for medical diagnosis in the gastrointestinal (GI) tract has emerged only in the past 10 years. Now established in "pillcams", which have benefitted more than 1 m patients worldwide, it is a clear candidate for further innovation. Most capsule endoscopy devices record and transmit video data representing the visual appearance of the inside of the gut, but work has begun on other diagnostic techniques, such as the measurement of pH, and there has been some research into the use of capsules for treatment as well. Medical ultrasound imaging is a safe, inexpensive technique which can be applied in real-time at the point of care. Ultrasound is also capable of treatment through focused ultrasound surgery and, in research, for targeted drug delivery. The core of the Sonopill programme is the exploration of ultrasound imaging and therapeutic capabilities deployed in capsule format. This will be supported by extensive pre-clinical work to demonstrate the complementary nature of ultrasound and visual imaging, along with studies of multimodal diagnosis and therapy, and of mechanisms to control the motion of the Sonopill as it travels through the GI tract. This brings research challenges and opportunities in areas including ultrasound device and systems design, microengineering and microelectronic packaging, autonomous capsule positioning, sensor suites for diagnosis and intervention, and routes to translation into clinical practice. Our carefully structured but open-ended approach maximises the possibility to meet these research challenges while delivering for the UK a sustainable international lead in multimodality capsule endoscopy, to provide greater capabilities for the clinician, more acceptable practice for the patient population, and lower costs for economic wellbeing.
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For further information contact us at helpdesk@openaire.euassignment_turned_in Project2008 - 2013Partners:University of Strathclyde, IMEC - REALITY, Roper Technologies (United Kingdom), NCR Financial Solutions Ltd, PowerPhotonic (United Kingdom) +170 partnersUniversity of Strathclyde,IMEC - REALITY,Roper Technologies (United Kingdom),NCR Financial Solutions Ltd,PowerPhotonic (United Kingdom),IKEA Properties Investments Ltd,Loadpoint (United Kingdom),OptoSci (United Kingdom),ROLLS-ROYCE PLC,Scotweave Ltd,University of Bath,Selex-Galileo,Ituna Solutions Limited,BAE Systems (Sweden),Lightworks Design Ltd,Rofin-Sinar UK Ltd,Pathtrace Engineering Systems Ltd,Ituna Solutions Limited,BAE Systems (United Kingdom),Airbus (United Kingdom),BAE Systems Avionics Management Ltd,Sira Ltd,Selex-Galileo,3D Systems (United Kingdom),Design LED,Silicon Graphics,SLI Limited,MBDA UK Ltd,Generic Robotics (United Kingdom),Agilent Technologies (United Kingdom),Design LED,FMC Energy Systems,Weidlinger Associates,Raytheon (United Kingdom),BAE Systems Naval Ships,Ituna Solutions Limited,University of Transylvania,Weidlinger Associates,Heriot-Watt University,IceRobotics Ltd,D-Cubed Ltd,Piezo Composite Transducers (PCT) Ltd,IMEC - REALITY,Omnova Solutions,Silicon Graphics,Cv FMC Technologies Ltd,BAE Sytems Electronics Ltd,Kestrel 3D,NCR Financial Solutions Ltd,Rolls-Royce (United Kingdom),C A Models Ltd,Advanced Optical Technology,Kodak (United Kingdom),Qioptiq Ltd,Merlin Circuits,Kodak Ltd,Reachin software,IKEA Properties Investments Ltd,Design LED,Piezo Composite Transducers (PCT) Ltd,RSL,PowerPhotonic Ltd,Piezo Composite Transducers (PCT) Ltd,D-Cubed Ltd,BCF Designs Ltd,BCF Designs Ltd,Virtual Interconnect Limited,BAE Systems Advanced Technology Centre,Rolls-Royce (United Kingdom),Exception PCB Ltd,Advanced Optical Technology,Omnova Solutions,Heidenhain (United Kingdom),Agilent Technologies (United Kingdom),NCR Financial Solutions Ltd,Sun Microsystems,MBDA UK Ltd,QinetiQ (Malvern),University of Strathclyde,Agilent Technologies (United Kingdom),SLI Limited,Lightworks Design Ltd,NTU,Italian Institute of Technology,University of Bath,The Mathworks Ltd,Exception PCB Ltd,BAE Systems Advanced Technology Centre,Reachin software,TechnipFMC (United Kingdom),RSL,J C Bamford Excavators (United Kingdom),SLI Limited,Kestrel 3D,Siemens (United Kingdom),Mactaggart Scott & Co Ltd,Pathtrace Engineering Systems Ltd,Rofin-Sinar UK Ltd,3D Systems Inc,Heriot-Watt University,Loadpoint Ltd,ModCell,Syngenta Ltd,Virtual Interconnect Limited,ModCell,LSTECH LTD,LSTECH LTD,Merlin Circuit Technology (United Kingdom),University of Nottingham,Sun Microsystems,Qinetiq (United Kingdom),Reachin software,J C Bamford Excavators (United Kingdom),MBDA (United Kingdom),RENISHAW,Loadpoint Ltd,Microstencil Ltd,Selex Sensors and Aiborne Systems Ltd,Transylvania University of Bra?ov,Microstencil Ltd,Rolls-Royce (United Kingdom),Cv FMC Technologies Ltd,Micro Circuit Engineering,Syngenta Ltd,Mactaggart Scott & Co Ltd,AWE,Advanced Optical Technology,Weidlinger Associates (United States),BAE Systems Avionics Management Ltd,Renishaw Plc,AIRBUS OPERATIONS LIMITED,Scotweave Ltd,Airbus,Mactaggart Scott & Co Ltd,Omnova Solutions,Heriot-Watt University,University of Transylvania,AWE Aldermaston,BCF Designs Ltd,Lightworks Design Ltd,IKEA Properties Investments Ltd,Italian Institute of Technology,FMC Energy Systems,Sira Ltd,PowerPhotonic Ltd,Micro Circuit Engineering,Rofin (United Kingdom),Optocap Ltd,BAE Systems Avionics Management Ltd,Optocap Ltd,Cv FMC Technologies Ltd,RENISHAW,First Syngenta UIC,FMC Energy Systems,BAE Systems Avionics,Sun Microsystems,J C Bamford Excavators (United Kingdom),Qioptiq Ltd,Bath Spa University,The Mathworks Ltd,Renishaw (United Kingdom),Scotweave Ltd,Silicon Graphics,Sira Ltd,Pathtrace Engineering Systems Ltd,D-Cubed Ltd,Merlin Circuits,Airbus (Germany),Exception PCB Ltd,Kodak Ltd,BAE Systems (Sweden),Microstencil Ltd,Virtual Interconnect Limited,IMEC - REALITY,Micro Circuit EngineeringFunder: UK Research and Innovation Project Code: EP/F02553X/1Funder Contribution: 7,146,840 GBPThe Scottish Manufacturing Institute aims to research technology for manufacture, addressing the requirements of European, UK and regional industries. It taps into the broad expanse of research at Heriot-Watt University to deliver innovative manufacturing technology solutions. The SMI delivers high quality research and education in innovative manufacturing technology for high value, lower volume, highly customised, and high IP content products that enable European and UK Manufacturers to compete in an environment of increased global competition, environmental concern, sustainability and regulation, where access to knowledge, skills and IP determine where manufacturing is located. Our mission is to deliver high impact research in innovative manufacturing technologies based on the multidisciplinary technology resource across Heriot-Watt University, the Edinburgh Research Partnership, the Scottish Universities Physics Alliance and beyond. The Institute is organised into three themes:- Digital Tools;- Photonics; and - MicrosystemsThe vision of the Digital Tools Theme is to provide tomorrow's engineers with tools that will help them to easily capture, locate, exploit and manipulate 3D information for mechanical products of all kinds using distributed, networked resources. Photonics has strong resonance with the needs of developed economies to compete in the 21st Century global market for manufacturing, providing: routes to low cost automated manufacture; and the key processes underpinning high added value products. We have a shared conviction that photonics technologies are an essential component of any credible strategy for knowledge-based industrial production. The Photonics Theme vision is for the SMI to be internationally recognised as the leading UK focus for industrially-relevant photonics R&D, delivering a mix of academic and commercial outputs in hardware, process technology and production applications.The principal strategy of the Microsystems Theme is to research into new integration and packaging solutions of MEMS that are low cost, mass manufacturable and easily adoptable by the industry. The vision is to become a European Centre of Excellence in MEMS integration and packaging over the next 5 years. We thus aspire to service UK manufacturing industry with innovative technology for high value, lower volume, highly customised, and high IP content products; and to help UK industry expand globally in an internationally competitive market.
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For further information contact us at helpdesk@openaire.euassignment_turned_in Project2015 - 2019Partners:RENISHAW, CAB, Renishaw (United Kingdom), Merlin Circuit Technology (United Kingdom), RENISHAW +8 partnersRENISHAW,CAB,Renishaw (United Kingdom),Merlin Circuit Technology (United Kingdom),RENISHAW,Blatchford (United Kingdom),Merlin Circuits,Renishaw plc (UK),Merlin Circuits,Heriot-Watt University,CAB,Heriot-Watt University,Heriot-Watt UniversityFunder: UK Research and Innovation Project Code: EP/N018222/1Funder Contribution: 351,844 GBPSelective formation of metallic nanoparticles in plastics has a wide range of uses for generating conductive tracks, creating antimicrobial surfaces and for the fabrication of sensors and actuators which has a broad spectrum of applications such as microsystems, printed electronics and wearable devices. Photobioform II aims to develop bio-inspired, industrially relevant manufacturing processes that can selectively pattern metals onto non-conductive substrates using light-harvesting complexes to accelerate the reduction of metal ions embedded into these substrates. The key challenges addressed in this project cover the fields of material science and manufacturing. The material science challenges include (1) the vast range of materials which can be processed using this method where each material requires different treatment techniques or operational parameters, (2) the need for a better understanding of the mechanisms responsible for the photosynthesis within the light harvesting complexes, (3) the determination of the optimal material formulation for this reduction processes and (4) the understanding of the interdependent factors (wavelength, intensity, etc) acting in this multi-dimensional design space to target the for optimum metallisation process. The manufacturing challenges cover (1) the interplay between processes and manufacturing techniques (and equipment) to deliver these processes (2) the novel spray coating process using aerosol jetting and (3) the industrial need for high speed, high resolution and low cost photo-patterning techniques. Particular high impact applications of prosthetics and encoders will be used to demonstrate the manufacturing capabilities developed during this research.
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For further information contact us at helpdesk@openaire.euassignment_turned_in Project2013 - 2015Partners:Merlin Circuits, University of Dundee, University of Dundee, AFM, Merlin Circuit Technology (United Kingdom) +3 partnersMerlin Circuits,University of Dundee,University of Dundee,AFM,Merlin Circuit Technology (United Kingdom),Merlin Circuits,AFM,Applied Functional Materials (United Kingdom)Funder: UK Research and Innovation Project Code: EP/K020250/1Funder Contribution: 725,790 GBPThe research challenge we will tackle is to realise real-time visualisation of tissue in the brain with a needle capable of minimally-invasive, real-time, high resolution ultrasound imaging. This will, for the first time, enable the neurosurgeon to obtain immediate information about lesions and the location of critical structures in the brain intraoperatively, and thus to provide treatment with less morbidity and better patient outcomes. Our specific engineering challenge is to create a needle carrying an integrated, miniature ultrasound array for high-resolution (~100 um) neurological imaging and to demonstrate feasibility for future translation into clinical practice. Previous EPSRC-funded collaboration by the Universities of Birmingham and Dundee has shown that piezocomposite material with microscale features can be realised with net-shape micromoulding techniques. Single element transducers based on these materials have been evaluated already and exploratory studies with Heriot-Watt University have demonstrated the capability to bond dense interconnects onto the new materials at low temperature and pressure to connect kerfless imaging arrays to external imaging electronics. The research we now propose will extend and integrate this technical work with neurosurgery to determine basic capabilities using brain tissue in soft-embalmed cadavers and to explore potential surgical benefits and applications. As well as the three university partners, the work will benefit from support from four companies, covering all aspects of the technology as well as its translation into clinical practice.
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For further information contact us at helpdesk@openaire.euassignment_turned_in Project2014 - 2023Partners:BAE Systems (UK), SULSA, Merlin Circuits, SBT, Defence Science and Technology Laboratory +77 partnersBAE Systems (UK),SULSA,Merlin Circuits,SBT,Defence Science and Technology Laboratory,OPTOS plc,Thales Optronics Ltd,Gloucestershire Hospitals NHS Fdn Trust,National Physical Laboratory,Defence Science & Tech Lab DSTL,M Squared Lasers (United Kingdom),PowerPhotonic Ltd,Merlin Circuit Technology (United Kingdom),GOOCH & HOUSEGO PLC,Heriot-Watt University,Fraunhofer UK Research Ltd,IT Power,Defence Science & Tech Lab DSTL,Toshiba Medical Visualization Systems,Coherent Scotland Ltd,Gloucestershire Hospitals NHS Fdn Trust,ST Microelectronics Limited (UK),M-Solv Limited,OPTOS plc,Gooch & Housego (United Kingdom),Cascade Technologies (United Kingdom),PowerPhotonic (United Kingdom),NPL,Cascade Technologies (United Kingdom),UK ATC,RENISHAW,ST Microelectronics Limited (UK),Gooch & Housego (United Kingdom),Thales Optronics Ltd,Leonardo (United Kingdom),Rofin-Sinar UK Ltd,Thales (United Kingdom),M-Solv Limited,Selex ES Ltd,BAE Systems (Sweden),Scottish Universities Physics Alliance,Andritz (United Kingdom),Coherent Scotland Ltd,Atomic Weapons Establishment,Heriot-Watt University,OPTOS plc,SUPA,BAE Systems (Sweden),Merlin Circuits,SeeByte Ltd,UK ATC,Toshiba Medical Visualization Systems,Gloucestershire Hospitals NHS Foundation Trust,Fraunhofer UK Research Ltd,Glasgow Science Centre Ltd,PowerPhotonic Ltd,Cascade Technologies (United Kingdom),Glasgow Science Centre Ltd,Glasgow Science Centre Ltd,M Squared Lasers (United Kingdom),Gooch & Housego (United Kingdom),General Dynamics (United Kingdom),AWE,UK Astronomy Technology Centre,M Squared Lasers (United Kingdom),Rofin-Sinar UK Ltd,BAE Systems (United Kingdom),Renishaw plc (UK),IT Power,Thales Optronics Ltd,Defence Science & Tech Lab DSTL,Selex-ES Ltd,Renishaw (United Kingdom),NPL,Heriot-Watt University,Coherent (United Kingdom),Rofin (United Kingdom),RENISHAW,SBT,M-Solv (United Kingdom),ST Microelectronics Limited (UK),STFCFunder: UK Research and Innovation Project Code: EP/L01596X/1Funder Contribution: 4,493,490 GBPIn a consortium led by Heriot-Watt with St Andrews, Glasgow, Strathclyde and Dundee, this proposal is for an EPSRC CDT in Applied Photonics and responds to the Integrative Technologies priority area, but also impacts on the Measurement and Sensing, Photonic Materials and Innovative Production Processes priorities. Technologies integrating photonics and electronics pervade products and services in any modern economy, enabling vital activities in manufacturing, security, telecommunications, healthcare, retail, entertainment and transport. The success of UK companies in this technology space is threatened by a lack of doctoral-level researchers with a grasp of photonic- / electronic-engineering design, fabrication and systems integration, coupled with high-level business, management and communication skills. By ensuring a supply of these individuals, our CDT will deliver broad-ranging impacts on the UK industrial knowledge base, driving the high-growth export-led sectors of the UK economy whose photonics-enabled products and services have far-reaching impacts on society, from consumer technology and mobile computing devices to healthcare and security. Building on the success of our current IDC in Optics and Photonics Technologies, the proposed CDT will again be configured as an IDC but will enhance our existing programme to meet industry's need for engineers able to integrate photonic and electronic devices, circuits and systems to deliver high value products and processes. Our proposal was developed in partnership with industry, whose letters of support show a commitment to sponsoring 71-74 EngD and 14-17 PhD projects -- 40% more than the minimum required -- demonstrating exceptional industrial engagement. Major stakeholders include Fraunhofer UK, NPL, Renishaw, Thales, BAE Systems, Gooch and Housego and Selex ES, who are joined by a number of SMEs. The CDT follows a model in which (annually) EPSRC funds 7 EngD students, with 3 more supported by industrial / university contributions. In a progressive strategy supported by our industrial partners, we will, where appropriate, align university-funded PhD projects to the programme to leverage greater industry engagement with PhD research in the consortium. The focus of the CDT corresponds to areas of research excellence in the consortium, which comprises 89 academic supervisors, whose papers since 2008 total 584 in all optics journals , with 111 in Science / Nature / PRL, and whose active EPSRC PI photonics funding is £40.9M. All academics are experienced supervisors, having each supervised on average >6 doctoral students, with many previously acting as IDC supervisors. The strategic commitment by the participating universities is evidenced by their recruitment since 2008 of 29 new academic staff in relevant areas (including 9 professors). An 8-month frontloaded residential phase in St Andrews and Glasgow will ensure the cohort strongly gels together, and will equip students with the technical knowledge and skills they need before they begin their industrial research project. Business modules (x3) will bring each cohort back to Heriot-Watt for 1-week periods, and weekend skills workshops will be used to regularly reunite the cohort, further consolidating it to create opportunities for peer-to-peer interactions. Taught courses will total 120 credits, and will be supplemented by new Computational Methods, Systems Integration and Research Skills workshops delivered by our industry partners, as well as public-engagement training led by Glasgow Science Centre. Another innovation is an International Advisory Board, comprising leading academics / industrialists , who will benchmark and advise on our performance. The requested EPSRC support of £4.5M is complemented by £2.8M of industrial / academic cash, covering the cost of 3 students in each cohort of 10. In-kind industrial / academic contributions are worth a further £5.4M, providing exceptional value.
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