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HERMES

High density integration by embedding chips for reduced size modules and electronic systems
assignment_turned_inproject01 May 2008(Started)-29 Feb 2012(Ended)Closed
Funder: European CommissionProject code: 224611 Call for proposal: FP7-ICT-2007-2
Funded under: FP7 | SP1 | ICT
Detailed project information (CORDIS)
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