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MULTI-FUN

Enabling MULTI-FUNctional performance through multi-material additive manufacturing
image/svg+xml art designer at PLoS, modified by Wikipedia users Nina, Beao, JakobVoss, and AnonMoos Open Access logo, converted into svg, designed by PLoS. This version with transparent background. http://commons.wikimedia.org/wiki/File:Open_Access_logo_PLoS_white.svg art designer at PLoS, modified by Wikipedia users Nina, Beao, JakobVoss, and AnonMoos http://www.plos.org/ Open Access Mandate for Publications assignment_turned_inproject01 Mar 2020(Started)-28 Feb 2023(Ended)Closed
Funder: European CommissionProject code: 862617 Call for proposal: H2020-NMBP-TR-IND-2019
Funded under: H2020 | IA Overall Budget: 9,235,950 EURFunder Contribution: 7,891,670 EUR
Detailed project information (CORDIS)
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Description

MULTI-FUN sets a clear focus on market-creating innovation, developing advanced materials and equipment for Additive Manufacturing of multi-material parts. These new material combinations will provide a significant performance & efficiency gain in MAM products by fully integrated multi-functionalities based on novel active materials and enable MULTI-MATERIAL design in geometrically complex 3D metal parts without size limitations by innovative, cost-effective AM technologies. The novel integrated functionalities include embedded electrical conductivity, fibre-optical sensing features or innovative heat management concepts, incl. applying nanotechnologies in at least 3 variants. Leading experts in AM process & equipment manufacturing (from SMEs, IND, RTOs and UNIV) will fully cover the physical integration of these advanced materials into metallic substrates. Significant improvements in efficiency, quality & reliability of products will result in KPI numbers beyond the request (>40%), alongside reduced environ

Partners
VOESTALPINE METAL FORMING GMBH , EDAG , EWF , VOESTALPINE METAL FORMING GMBH , EWF , AVL , Cranfield University , BEYOND GRAVITY AUSTRIA GMBH , PEAK TECHNOLOGY GMBH , EDAG , RHP TECHNOLOGY , Alpex Technologies , FHG , INPHOTECH , ISQ , WAAM3D , AEROTECNIC METALLIC , LKR , LKR , Cranfield University , ...
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