AbstractBilevel resist processing techniques, offering the advantage of forming images on a planar substrate, and thus improving the resolution capability of optical projection printers are discussed. After careful consideration of such materials characteristics as UV absorption, solubility, compatibility, and Tg, practical schemes can be developed, the simplest of which is one that uses conventional novolak‐quinone diazide positive resists as the top masking layer and short wavelength sensitive methacrylate based resists to planarize the substrate. Sub‐micron resolution and excellent line‐width control are achieved in these systems.