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image/svg+xml Jakob Voss, based on art designer at PLoS, modified by Wikipedia users Nina and Beao Closed Access logo, derived from PLoS Open Access logo. This version with transparent background. http://commons.wikimedia.org/wiki/File:Closed_Access_logo_transparent.svg Jakob Voss, based on art designer at PLoS, modified by Wikipedia users Nina and Beao Applied Thermal Engi...arrow_drop_down
image/svg+xml Jakob Voss, based on art designer at PLoS, modified by Wikipedia users Nina and Beao Closed Access logo, derived from PLoS Open Access logo. This version with transparent background. http://commons.wikimedia.org/wiki/File:Closed_Access_logo_transparent.svg Jakob Voss, based on art designer at PLoS, modified by Wikipedia users Nina and Beao
Applied Thermal Engineering
Article . 2017 . Peer-reviewed
License: Elsevier TDM
Data sources: Crossref
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Evaluation and optimization of low melting point metal PCM heat sink against ultra-high thermal shock

Authors: Yi-Xin Zhou; Jing Liu; Jing Liu; Zhi-Zhu He; Sicong Tan; Xiao-Hu Yang;

Evaluation and optimization of low melting point metal PCM heat sink against ultra-high thermal shock

Abstract

Abstract In this paper, the low melting point metal phase change material (PCM) heat sink for coping with ultra-high thermal shock (10 2 W/cm 2 ) is developed and optimized theoretically and numerically. Gallium is selected as the best PCM candidate from the point of view of thermal performance based on an approximate theoretical analysis, and gallium based PCM heat sink with internal copper fin is configured. Different fin structures, namely plate fin, crossed fin and pin fin are investigated and compared; the effects of fin number, fin width and base thickness are parametrically studied; the influence of the structural material is briefly discussed. For arbitrarily given heating condition, the optimal geometric configuration of the heat sink is suggested and corresponding thermal performance is provided. The proposed low melting point metal PCM heat sink can cope with very large thermal shock like 100 W/cm 2 (1 s) with maximum device temperature of 46 °C, under the ambient temperature of 25 °C, which is extremely difficult to deal with otherwise by conventional PCMs. The conclusions drawn in this paper can serve as valuable reference for thermal design and analysis of PCM heat sink against ultra-high thermal shock.

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citations
This is an alternative to the "Influence" indicator, which also reflects the overall/total impact of an article in the research community at large, based on the underlying citation network (diachronically).
BIP!Citations provided by BIP!
popularity
This indicator reflects the "current" impact/attention (the "hype") of an article in the research community at large, based on the underlying citation network.
BIP!Popularity provided by BIP!
influence
This indicator reflects the overall/total impact of an article in the research community at large, based on the underlying citation network (diachronically).
BIP!Influence provided by BIP!
impulse
This indicator reflects the initial momentum of an article directly after its publication, based on the underlying citation network.
BIP!Impulse provided by BIP!
88
Top 1%
Top 10%
Top 10%