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Micro-pattern Corrosion Screening on Bimetallic Corrosion for Microelectronic Application

Abstract The continued miniaturization of the integrated circuit, leading to minute dimensions ( 12) at Cu/Ru interface, caused by enhanced oxygen reduction reaction on Ru, is proposed to generate more NH 3 for sustaining fast Cu corrosion. Effects of different plasma chemistries like CF 4 , CF 4 + O 2 , CH 2 F 2 , C 4 F 8 and SF 6 on the Cu corrosion in tetramethylammonium hydroxide (TMAH) were also investigated. Plasma treatments using higher fluorine content gases showed higher Cu corrosion rate in TMAH. Benzotriazole showed limited corrosion inhibition to plasma treated Cu/Ru micro-patterns in pH 14 TMAH solution. Contrastingly, pyrazole demonstrated as an effective corrosion inhibitor suppressing Cu corrosion rate down to the desirable
- University of North Texas United States
- Intel United States
- Inceptus (United States) United States
- Inceptus (United States) United States
- University of North Texas United States
citations This is an alternative to the "Influence" indicator, which also reflects the overall/total impact of an article in the research community at large, based on the underlying citation network (diachronically).10 popularity This indicator reflects the "current" impact/attention (the "hype") of an article in the research community at large, based on the underlying citation network.Top 10% influence This indicator reflects the overall/total impact of an article in the research community at large, based on the underlying citation network (diachronically).Average impulse This indicator reflects the initial momentum of an article directly after its publication, based on the underlying citation network.Average
