For zero‐defect wave soldering of double‐sided and multilayer printed circuit boards, the copper through‐hole‐plating must be impervious to gas generated in the laminate for the period of a few seconds while the solder is molten. The kinetics of the gas evolution during soldering have been related quantitatively to the integrity of the plated copper. This in turn is related to the quality of the electroless copper (evaluated using the backlighting test), the nature and distribution of the catalyst (evaluated using X‐ray photoelectron spectroscopy) and the methods and effectiveness of the hole‐wall preparation (evaluated using scanning electron microscopy). The relevance of laboratory measurements has been confirmed on a wide range of industrial production plating lines.