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<script type="text/javascript">
<!--
document.write('<div id="oa_widget"></div>');
document.write('<script type="text/javascript" src="https://beta.openaire.eu/index.php?option=com_openaire&view=widget&format=raw&projectId=undefined&type=result"></script>');
-->
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Review of Health Prognostics and Condition Monitoring of Electronic Components

Pour répondre aux spécifications des appareils électroniques à faible coût et très fiables, les techniques de diagnostic des pannes jouent un rôle essentiel. Il est essentiel de trouver des défauts à un stade précoce de la conception, des composants, des matériaux ou de la fabrication au cours de la phase initiale. Ce document de synthèse tente de résumer les développements passés et les progrès récents dans les domaines de la fabrication verte, de la maintenance, de la prévision de la durée de vie utile restante (RUL), etc. L'état actuel de la recherche sur la fiabilité des composants électroniques, comprend principalement des mécanismes de défaillance, la surveillance de l'état et l'évaluation de la durée de vie résiduelle. Une analyse critique des études de fiabilité pour identifier leurs mérites relatifs et l'utilité des résultats de ces études vis-à-vis de la fabrication verte est présentée. Le large éventail d'outils et de techniques statistiques, empiriques et intelligents utilisés dans la littérature sont ensuite identifiés et cartographiés. Enfin, les résultats sont résumés et le déficit de recherche central est mis en évidence.
Para cumplir con las especificaciones de dispositivos electrónicos de bajo coste y alta fiabilidad, las técnicas de diagnóstico de fallos desempeñan un papel esencial. Es vital encontrar fallas en una etapa temprana en el diseño, los componentes, el material o la fabricación durante la fase inicial. Este documento de revisión intenta resumir el desarrollo pasado y los avances recientes en las áreas de fabricación ecológica, mantenimiento, predicción de la vida útil restante (RUL) y similares. Se explora el estado actual de la técnica en la investigación de confiabilidad para componentes electrónicos, que incluye principalmente mecanismos de falla, monitoreo de condición y evaluación de vida útil residual. Se presenta un análisis crítico de los estudios de fiabilidad para identificar sus méritos relativos y la utilidad del resultado de estos estudios con respecto a la fabricación ecológica. La amplia gama de herramientas y técnicas estadísticas, empíricas e inteligentes utilizadas en la literatura se identifican y mapean. Finalmente, se resumen los hallazgos y se destaca la brecha central de la investigación.
To meet the specifications of low cost, highly reliable electronic devices, fault diagnosis techniques play an essential role. It is vital to find flaws at an early stage in design, components, material, or manufacturing during the initial phase. This review paper attempts to summarize past development and recent advances in the areas about green manufacturing, maintenance, remaining useful life (RUL) prediction, and like. The current state of the art in reliability research for electronic components, mainly includes failure mechanisms, condition monitoring, and residual lifetime evaluation is explored. A critical analysis of reliability studies to identify their relative merits and usefulness of the outcome of these studies' vis-a-vis green manufacturing is presented. The wide array of statistical, empirical, and intelligent tools and techniques used in the literature are then identified and mapped. Finally, the findings are summarized, and the central research gap is highlighted.
لتلبية مواصفات الأجهزة الإلكترونية منخفضة التكلفة والموثوقة للغاية، تلعب تقنيات تشخيص الأعطال دورًا أساسيًا. من الضروري العثور على العيوب في مرحلة مبكرة من التصميم أو المكونات أو المواد أو التصنيع خلال المرحلة الأولية. تحاول ورقة المراجعة هذه تلخيص التطورات السابقة والتطورات الحديثة في مجالات التصنيع الأخضر والصيانة والتنبؤ بالعمر الإنتاجي المتبقي وما شابه ذلك. يتم استكشاف أحدث التطورات الحالية في أبحاث الموثوقية للمكونات الإلكترونية، والتي تشمل بشكل أساسي آليات الفشل ومراقبة الحالة وتقييم العمر المتبقي. يتم تقديم تحليل نقدي لدراسات الموثوقية لتحديد مزاياها النسبية وفائدتها لنتائج هذه الدراسات مقابل التصنيع الأخضر. ثم يتم تحديد ورسم خرائط لمجموعة واسعة من الأدوات والتقنيات الإحصائية والتجريبية والذكية المستخدمة في الأدبيات. وأخيرًا، يتم تلخيص النتائج وتسليط الضوء على فجوة البحث المركزية.
- Lovely Professional University India
- Aalborg University Denmark
- Aalborg University Library (AUB) Denmark
- Universiti Tenaga Nasional Malaysia
- Wrocław University of Science and Technology Poland
Maintenance Optimization, condition monitoring, Failure Analysis of Integrated Circuits, FOS: Mechanical engineering, Quantum mechanics, Reliability engineering, Failure Analysis, Systems engineering, Engineering, prognostics, diagnostics, FOS: Electrical engineering, electronic engineering, information engineering, Reliability Engineering, faults and failures, Risk analysis (engineering), Electrical and Electronic Engineering, Safety, Risk, Reliability and Quality, Non-Destructive Techniques Based on Eddy Current Testing, Prognostics, Mechanical Engineering, Physics, Electrical Characterization, Electronic component, Power (physics), faults and failiures, Computer science, Reliability Engineering and Maintenance Optimization, Mechanical engineering, TK1-9971, Condition monitoring, Reliability (semiconductor), Electrical engineering, Physical Sciences, Physics of failure, Medicine, Electrical engineering. Electronics. Nuclear engineering, System Reliability, Reliability methods
Maintenance Optimization, condition monitoring, Failure Analysis of Integrated Circuits, FOS: Mechanical engineering, Quantum mechanics, Reliability engineering, Failure Analysis, Systems engineering, Engineering, prognostics, diagnostics, FOS: Electrical engineering, electronic engineering, information engineering, Reliability Engineering, faults and failures, Risk analysis (engineering), Electrical and Electronic Engineering, Safety, Risk, Reliability and Quality, Non-Destructive Techniques Based on Eddy Current Testing, Prognostics, Mechanical Engineering, Physics, Electrical Characterization, Electronic component, Power (physics), faults and failiures, Computer science, Reliability Engineering and Maintenance Optimization, Mechanical engineering, TK1-9971, Condition monitoring, Reliability (semiconductor), Electrical engineering, Physical Sciences, Physics of failure, Medicine, Electrical engineering. Electronics. Nuclear engineering, System Reliability, Reliability methods
citations This is an alternative to the "Influence" indicator, which also reflects the overall/total impact of an article in the research community at large, based on the underlying citation network (diachronically).48 popularity This indicator reflects the "current" impact/attention (the "hype") of an article in the research community at large, based on the underlying citation network.Top 1% influence This indicator reflects the overall/total impact of an article in the research community at large, based on the underlying citation network (diachronically).Top 10% impulse This indicator reflects the initial momentum of an article directly after its publication, based on the underlying citation network.Top 1%
