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image/svg+xml Jakob Voss, based on art designer at PLoS, modified by Wikipedia users Nina and Beao Closed Access logo, derived from PLoS Open Access logo. This version with transparent background. http://commons.wikimedia.org/wiki/File:Closed_Access_logo_transparent.svg Jakob Voss, based on art designer at PLoS, modified by Wikipedia users Nina and Beao IEEE Journal of Phot...arrow_drop_down
image/svg+xml Jakob Voss, based on art designer at PLoS, modified by Wikipedia users Nina and Beao Closed Access logo, derived from PLoS Open Access logo. This version with transparent background. http://commons.wikimedia.org/wiki/File:Closed_Access_logo_transparent.svg Jakob Voss, based on art designer at PLoS, modified by Wikipedia users Nina and Beao
IEEE Journal of Photovoltaics
Article . 2013 . Peer-reviewed
License: IEEE Copyright
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Al-Foil on Encapsulant for the Interconnection of Al-Metalized Silicon Solar Cells

Authors: Agnes Merkle; Robert Bock; Susanne Blankemeyer; Henning Schulte-Huxel; Sarah Kajari-Schröder; Rolf Brendel;

Al-Foil on Encapsulant for the Interconnection of Al-Metalized Silicon Solar Cells

Abstract

We demonstrate the interconnection of silicon solar cells with evaporated aluminum back contacts using an aluminum foil which is attached to a silicone encapsulant. The aluminum-based mechanical and electrical laser interconnection (AMELI) process forms laser weld spots using single laser pulses. These laser welds resist high mechanical stresses and have a low electrical contact resistivity. No solder, conductive adhesives, or Ag-pastes are required for interconnection. We find the electrical contact resistivity to be below ρc = 0.01 mΩ·cm2. The contact resistance is constant under accelerated aging of 300 humidity-freeze cycles. With a tensile testing machine, we measure tear-off stresses in the perpendicular direction of up to 380 kPa for our laser weld spots. We present a proof-of-concept module which consists of five n-type back-junction back-contact solar cells with a conversion efficiency of 20.4%. The unchanged fill factor FF and open circuit voltage Voc verify a damage- and loss-free interconnection which is supported by electroluminescence measurements.

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