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application of fine pattern plating technology for 3 dimensional assembly technologies

マイクロデバイス実装と表面技術　ＩＩ３次元実装技術と微細配線めっき技術の応用

descriptionPublicationkeyboard_double_arrow_right Article , Journal 01 Jan 2001Publisher:The Surface Finishing Society of JapanJournal:Journal of the Surface Finishing Society of Japan, volume 52, pages 494-499 (issn: 0915-1869, eissn: 1884-3409,

Authors: Shinichi Wakabayashi; Takashi Kurihara; Michio Horiuchi;

doi: 10.4139/sfj.52.494

application of fine pattern plating technology for 3 dimensional assembly technologies

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Fields of Science (3) View all

engineering and technology

electrical engineering, electronic engineering, information engineering

Fields of Science

engineering and technology

electrical engineering, electronic engineering, information engineering

View all

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Energy Research