Vertical multijunction (VMJ) silicon solar cells (SC) are considered the most preferred among all known single-crystal ones for using in various photovoltaic systems under conditions of highly concentrated sunlight. The techniques of ultrasound assisted nickel plating (USNiP) of mirror polished silicon wafers and their subsequent vacuum annealing for VMJ SC ohmic contacts creating were tested by X-ray diffractometry, scanning electron microscopy and dark current–voltage characteristics. The feasibility of utilizing nickel electroplating in the sulfamate electrolyte for the NiSi ohmic contact made on the mirror polished silicon wafers with n+–p junctions on both sides have been experimentally confirmed. Ultrasound assistance of the nickel plating insured the enhancement of NiSi adhesion and improving the quality of the ohmic contacts.