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Solder Bond Fatigue is Insensitive to Module Size

descriptionPublicationkeyboard_double_arrow_right Article , Journal 01 Jul 2021Publisher:Institute of Electrical and Electronics Engineers (IEEE)Journal:IEEE Journal of Photovoltaics, volume 11, pages 1,048-1,050 (issn: 2156-3381, eissn: 2156-3403,

Authors: Nick Bosco; Timothy J. Silverman;

doi: 10.1109/jphotov.2021.3074056

Solder Bond Fatigue is Insensitive to Module Size

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Abstract

In this article, we explore the influence of module size on the rate of interconnecting solder bond thermomechanical fatigue (TMF) damage. Structural mechanics models of crystalline silicon PV models are created to solve with the finite-element method. Results conclusively demonstrate that the rate of solder bond TMF damage is independent of module size, interconnect location across the cell and cell location across the module.

Related Organizations

National Renewable Energy Laboratory
United States
National Renewable Energy Laboratory
United States

Impact byBIP!

	citations This is an alternative to the "Influence" indicator, which also reflects the overall/total impact of an article in the research community at large, based on the underlying citation network (diachronically).	3
	popularity This indicator reflects the "current" impact/attention (the "hype") of an article in the research community at large, based on the underlying citation network.	Top 10%
	influence This indicator reflects the overall/total impact of an article in the research community at large, based on the underlying citation network (diachronically).	Average
	impulse This indicator reflects the initial momentum of an article directly after its publication, based on the underlying citation network.	Average

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Top 10%

Average

Fields of Science

engineering and technology

nano-technology

Fields of Science

engineering and technology

nano-technology

Related to Research communities

Energy Research