The heat generation from recent advanced computer chips is increasing rapidly. This creates a challenge in cooling the chips while maintaining their temperatures below the threshold values. Another challenge is that the heat generation in the chip is not uniform where some chip components generate more heat than other components. This would create a large temperature gradient across the chip, resulting in inducing thermal stresses inside the chip that may lead to a high probability to damage the chip. The locations in the chip with heat rates that correspond to high heat fluxes are known as hotspots. This research study focuses on using thermoelectric modules (TEMs) for cooling chip hotspots of different heat fluxes. When a TEM is used for cooling a chip hotspot, it is called a thermoelectric cooler (TEC), which requires electrical power. Additionally, when a TEM is used for converting a chip’s wasted heat to electrical power, it is called a thermoelectric generator (TEG). In this study, the TEMs are used for cooling the hotspots of computer chips, and a TEC is attached to the hotspot to reduce its temperature to an acceptable value. On the other hand, the other cold surfaces of the chip are attached to TEGs for harvesting electrical power from the chip’s wasted heat. Thereafter, this harvested electrical power (HEP) is then used to run the TEC attached to the hotspot. Since no external electrical power is needed for cooling the hotspot to an acceptable temperature, this technique is called a sustainable self-cooling framework (SSCF). In this paper, the operation principles of the SSCF to cool the hotspot, subjected to different operating conditions, are discussed. As well, considerations are given to investigate the effect of the TEM geometrical parameters, such as the P-/N-leg height and spacing between the legs in both operations of the TEC mode and TEG mode on the SSCF performance.